专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5869886A Flip chip semiconductor mounting structure with electrically conductive resin 失效
标题翻译：带导电树脂的倒装芯片半导体安装结构
公开(公告)号：US5869886A
公开(公告)日：1999-02-09
申请号：US826750
申请日：1997-03-24
申请人： Kenichi Tokuno
发明人： Kenichi Tokuno
IPC分类号： H01L21/56 , H01L21/60 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/58 , H01L21/283
CPC分类号： H01L24/73 , H01L21/563 , H01L23/585 , H01L24/24 , H01L24/29 , H01L24/81 , H01L24/82 , H01L24/83 , H01L2224/16225 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/24998 , H01L2224/29101 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73259 , H01L2224/81801 , H01L2224/82007 , H01L2224/8319 , H01L2224/838 , H01L2924/01004 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781
摘要： A semiconductor chip is flip chip bonded on a substrate wherein the semiconductor chip has a first surface on which bumps are provided. An insulating sealing resin is provided in a space defined between the semiconductor chip and the substrate and also around the semiconductor chip. An electrically conductive resin is provided which extends over a least a part of a second surface of the semiconductor chip, a part of the sealing resin and a ground pattern provided over the substrate.
摘要翻译：半导体芯片被倒装芯片接合在基板上，其中半导体芯片具有设置凸块的第一表面。绝缘密封树脂设置在半导体芯片和基板之间以及半导体芯片周围的空间中。提供一种导电树脂，其在半导体芯片的第二表面的至少一部分上延伸，密封树脂的一部分和设置在基板上的接地图案。

2. 发明授权

US5763295A Device module comprising a substrate having grooves fixed to circuit chips with improved sealing characteristics 失效
标题翻译：设备模块包括具有固定到具有改进的密封特性的电路芯片的槽的衬底
公开(公告)号：US5763295A
公开(公告)日：1998-06-09
申请号：US857822
申请日：1997-05-16
申请人： Kenichi Tokuno , Manabu Bonkohara
发明人： Kenichi Tokuno , Manabu Bonkohara
IPC分类号： H01L23/28 , H01L21/56 , H01L21/60 , H01L23/12 , H01L23/498
CPC分类号： H01L24/28 , H01L21/563 , H01L23/49838 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/14
摘要： A device module with a circuit chip and a print-circuit substrate on which a pattern of grooves is formed by selective etching. A liquid sealing material is in the space between the circuit chip and the surface of the substrate, fixing the circuit chip on the surface of the substrate. The circuit chip has a plurality of electrodes arranged in a first pattern, and the substrate has a plurality of connection terminals arranged in the first pattern within a chip mounting area on a surface thereof. Each of the grooves passes between two adjacent connection terminals through the chip mounting area, and both ends of each groove protrudes from the periphery of the chip mounting area. After the circuit chip is placed on the chip mounting area with the respective electrodes corresponding to the connection terminals, a liquid sealing material may be spread more easily into the space between the circuit chip and the substrate by the use of capillary action to provide a more reliable and efficient seal.
摘要翻译：具有电路芯片和印刷电路基板的器件模块，通过选择性蚀刻在其上形成凹槽图案。液体密封材料位于电路芯片和基板表面之间的空间中，将电路芯片固定在基板的表面上。电路芯片具有以第一图案布置的多个电极，并且基板在其表面上的芯片安装区域内具有以第一图案布置的多个连接端子。每个槽通过芯片安装区域在两个相邻的连接端子之间通过，并且每个槽的两端从芯片安装区域的周边突出。在将电路芯片放置在具有对应于连接端子的相应电极的芯片安装区域之后，通过使用毛细管作用，液体密封材料可以更容易地扩散到电路芯片和基板之间的空间中，以提供更多可靠高效的密封。

3. 发明授权

US6094354A Chip component mounting board, chip component mounting structure, and method of manufacturing chip component mounting board 失效
标题翻译：芯片部件安装板，芯片部件安装结构以及芯片部件安装板的制造方法
公开(公告)号：US6094354A
公开(公告)日：2000-07-25
申请号：US980914
申请日：1997-12-01
申请人： Toshiaki Nakajoh , Kenichi Tokuno
发明人： Toshiaki Nakajoh , Kenichi Tokuno
IPC分类号： H01L21/56 , H01L23/13 , H05K1/02 , H05K3/34 , H05K3/46 , H05K7/02
CPC分类号： H05K3/3452 , H01L21/563 , H01L23/13 , H01L24/32 , H05K1/0271 , H01L2224/05571 , H01L2224/05573 , H01L2224/1134 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83385 , H01L2924/00013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/15151 , H01L2924/3511 , H05K2201/09036 , H05K2201/09072 , H05K2201/0989 , H05K2201/10674 , H05K2201/10977 , H05K3/4644
摘要： A chip component mounting board includes a chip mounting portion and a first groove. A chip component is mounted on the chip mounting portion. The chip mounting portion has a connection pad electrically connected to the chip component. The first groove is formed in the chip mounting portion to extend from a center of the chip mounting portion to one side of the chip mounting portion while gradually increasing its width. A method of manufacturing a chip component mounting board is also disclosed.
摘要翻译：芯片部件安装板包括芯片安装部分和第一凹槽。芯片部件安装在芯片安装部分上。芯片安装部分具有电连接到芯片部件的连接焊盘。第一槽形成在芯片安装部分中，从芯片安装部分的中心延伸到芯片安装部分的一侧，同时逐渐增加其宽度。还公开了一种制造芯片部件安装板的方法。

4. 发明授权

US5892289A Bare chip mounting structure and manufacturing method therefor 失效
标题翻译：裸芯片安装结构及其制造方法
公开(公告)号：US5892289A
公开(公告)日：1999-04-06
申请号：US837801
申请日：1997-04-22
申请人： Kenichi Tokuno
发明人： Kenichi Tokuno
IPC分类号： H01L21/60 , H01L21/56 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/563 , H01L24/28 , H01L2224/13111 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/09701 , H01L2924/15151 , H01L2924/15788 , H01L2924/1579
摘要： A mounting structure is provided which improves the reliability of the connection between the bumps at the four corners of a flip-chip mounted semiconductor chip which is subject to stress concentrations caused by board warping or a difference in thermal coefficient of expansion when subjecting the mounted chip to thermal cycling tests. In this structure, a sealing resin is caused to flow into a space between the semiconductor chip and the board at the four corners of the semiconductor chip, thereby forming large resin fillets at the four corners, these fillets relieving the above-noted stress at the bump connection parts of the four corners of the semiconductor chip, thereby causing an improvement in reliability of the connection. The flowing distance is shortened and simultaneous flowing resin is performed, thereby shortening the time required for sealing.
摘要翻译：提供了一种安装结构，其提高了在安装芯片的倒装芯片安装的半导体芯片的四个角部处的凸起之间的连接的可靠性，其受到板翘曲引起的应力集中或当安装的芯片到热循环测试。在这种结构中，使密封树脂在半导体芯片的四个角落处流到半导体芯片和板之间的空间中，从而在四个角部形成大的树脂圆角，这些圆角消除了上述应力半导体芯片的四个角的凸起连接部分，从而提高连接的可靠性。流动距离缩短并且执行同时流动的树脂，从而缩短了密封所需的时间。

5. 发明授权

US5883426A Stack module 失效
标题翻译：堆栈模块
公开(公告)号：US5883426A
公开(公告)日：1999-03-16
申请号：US844320
申请日：1997-04-18
申请人： Kenichi Tokuno , Ikushi Morisaki , Akihiro Doya , Manabu Bonkohara , Naoji Senba , Yuuzou Shimada , Kazuaki Utumi
发明人： Kenichi Tokuno , Ikushi Morisaki , Akihiro Doya , Manabu Bonkohara , Naoji Senba , Yuuzou Shimada , Kazuaki Utumi
IPC分类号： H01L23/427 , H01L23/31 , H01L23/367 , H01L25/065 , H01L25/07 , H01L25/10 , H01L25/11 , H01L25/18 , H01L23/02
CPC分类号： H01L23/3672 , H01L23/3107 , H01L23/467 , H01L25/105 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L23/427 , H01L2924/15311 , H01L2924/15331
摘要： A stack module is provided which relieves thermal stress generated in a heat-radiating element and provides improved cooling efficiency. Connection bumps of a plurality of mounting substrates, onto which are mounted semiconductor chips are used to stack the substrates to four levels, three wave-shaped heat-radiating elements, made of copper, being in thermal contact between the semiconductor chips of three of the mounting substrates and the rear surfaces of three of the mounting substrates, making use of the spring elasticity of the heat-radiating elements to establish this thermal contact.
摘要翻译：提供了一种减轻在散热元件中产生的热应力并提供改善的冷却效率的堆叠模块。使用安装有半导体芯片的多个安装基板的连接凸块将基板堆叠成四个级别，三个由铜构成的波浪形散热元件在三个半导体芯片的半导体芯片之间热接触安装基板和三个安装基板的后表面，利用散热元件的弹簧弹性来建立这种热接触。

6. 发明授权

US06188127B1 Semiconductor packing stack module and method of producing the same 失效
标题翻译：半导体封装堆叠模块及其制造方法
公开(公告)号：US06188127B1
公开(公告)日：2001-02-13
申请号：US08604115
申请日：1996-02-20
申请人： Naoji Senba , Yuzo Shimada , Kazuaki Utsumi , Kenichi Tokuno , Ikushi Morizaki , Akihiro Dohya , Manabu Bonkohara
发明人： Naoji Senba , Yuzo Shimada , Kazuaki Utsumi , Kenichi Tokuno , Ikushi Morizaki , Akihiro Dohya , Manabu Bonkohara
IPC分类号： H01L2302
CPC分类号： H01L24/28 , H01L21/563 , H01L25/105 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48247 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/83102 , H01L2224/92125 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15331 , H01L2924/15787 , H01L2924/1627 , H01L2924/181 , H01L2924/18161 , H01L2924/19041 , H01L2924/3011 , H01L2924/3511 , H01L2924/00014 , H01L2924/00 , H01L2924/0665 , H01L2924/00012
摘要： In a semiconductor package stack module, an LSI (Large Scale Integrated circuit) is mounted, via fine bumps, on a ceramic carrier substrate or a flexible carrier film on which wiring conductors are formed. After a seal resin has been injected, the chip is thinned by, e.g., grinding. A plurality of such carrier substrates or carrier films are connected to each other by bumps via through holes which are electrically connected to the wiring conductors, thereby completing a tridimensional stack module. The module achieves a miniature, thin, dense, low cost, and reliable structure without resorting to a wire bonding system or a TAB (Tape Automated Bonding) system. In addition, the module has a minimum of wiring length and a desirable electric characteristic.
摘要翻译：在半导体封装堆叠模块中，通过微小的凸块将LSI（大规模集成电路）安装在陶瓷载体基板或形成布线导体的柔性载体膜上。在注入密封树脂之后，通过例如研磨使芯片变薄。多个这样的载体基板或载体膜通过与导线导电连接的通孔而由凸块彼此连接，从而完成三维叠层模块。该模块实现了微型，薄型，致密，低成本和可靠的结构，而不需要使用引线接合系统或TAB（磁带自动接合）系统。此外，该模块具有最小的布线长度和期望的电特性。

7. 发明授权

US5777847A Multichip module having a cover wtih support pillar 失效
标题翻译：多芯片模块具有支撑柱支撑
公开(公告)号：US5777847A
公开(公告)日：1998-07-07
申请号：US812859
申请日：1997-03-06
申请人： Kenichi Tokuno , Akihiro Dohya
发明人： Kenichi Tokuno , Akihiro Dohya
IPC分类号： H01L23/10 , H01L23/367 , H05K7/20
CPC分类号： H01L23/10 , H01L23/3675 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L25/0655 , H01L2924/09701 , H01L2924/15311 , H01L2924/16152 , H01L2924/3025
摘要： A multichip module comprises a substrate mounting a plurality of circuit chips, a cover plate positioned over the circuit chips, and at least one pillar member for fixing the cover plate to the substrate to support it. The substrate has a plurality of circuit chips fixed in a predetermined pattern of locations on a side thereof. At least one pillar member fixes the cover plate to the substrate such that the cover plate is positioned over the circuit chips. Since the pillar member is fixed to the substrate at a small area to support the cover plate, the substrate can be prevented from deforming due to a temperature change. In order to secure the covering member, the pillar member is preferably fixed by means of an adhesive, a fit, or screwing.
摘要翻译：多芯片模块包括安装多个电路芯片的基板，位于电路芯片上方的盖板以及用于将盖板固定到基板以支撑其的至少一个柱构件。基板具有固定在其侧面上的预定图案位置的多个电路芯片。至少一个柱构件将盖板固定到基板，使得盖板位于电路芯片上方。由于柱构件在小面积上固定在基板上以支撑盖板，所以可以防止基板由于温度变化而变形。为了固定覆盖构件，柱构件优选地通过粘合剂，配合或螺纹固定。

8. 发明授权

US5767689A Bare chip test carrier with an improved holding structure for a semiconductor chip 失效
标题翻译：具有改进的用于半导体芯片的保持结构的裸芯片测试载体
公开(公告)号：US5767689A
公开(公告)日：1998-06-16
申请号：US575480
申请日：1995-12-20
申请人： Kenichi Tokuno , Akihiro Dohya
发明人： Kenichi Tokuno , Akihiro Dohya
IPC分类号： H01L21/66 , G01R1/04 , G01R31/26 , G01R31/02
CPC分类号： G01R1/0408
摘要： A chip tester for holding a semiconductor chip bonded via convex electrodes to a flexible substrate. The tester has a carrier body with a flat surface in contact with the flexible board. The carrier body overlies the flexible substrate so as to press down the flexible substrate. The tester also has a chip plate that underlies and contacts the semiconductor chip so as to urge the semiconductor chip toward the flexible substrate. At least a flat contact surface of the chip plate is made of an elastic material with a high elastic coefficient to obtain an adhesion with the semiconductor chip to prevent lateral displacement of the semiconductor chip. The tester also has a chip plate holder that underlies the flexible substrate and is positioned around both the semiconductor chip and the chip plate. The chip plate holder is spaced apart from the semiconductor chip so that the chip plate holder sandwiches the flexible substrate in cooperation with the carrier body.
摘要翻译：用于将通过凸电极粘合的半导体芯片保持在柔性基板上的芯片测试器。测试仪具有与柔性板接触的平坦表面的承载体。承载体覆盖柔性基板，以便将柔性基板压下。测试仪还具有底板并接触半导体芯片，以将半导体芯片推向柔性基板。芯片板的至少平坦的接触表面由具有高弹性系数的弹性材料制成，以获得与半导体芯片的粘附性，以防止半导体芯片的横向位移。该测试仪还具有一个位于柔性基片下方并位于半导体芯片和芯片板周围的芯片板支架。芯片板保持件与半导体芯片间隔开，使得芯片板保持器与载体主体协作地夹持柔性基板。

9. 发明授权

US5686763A Device module comprising a substrate having grooves fixed to circuit chips with improved sealing characteristics 失效
标题翻译：设备模块包括具有固定到具有改进的密封特性的电路芯片的槽的衬底
公开(公告)号：US5686763A
公开(公告)日：1997-11-11
申请号：US534940
申请日：1995-09-28
申请人： Kenichi Tokuno , Manabu Bonkohara
发明人： Kenichi Tokuno , Manabu Bonkohara
IPC分类号： H01L23/28 , H01L21/56 , H01L21/60 , H01L23/12 , H01L23/498 , H01L23/31
CPC分类号： H01L24/28 , H01L21/563 , H01L23/49838 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/14
摘要： A device module with a circuit chip and a print-circuit substrate on which a pattern of grooves is formed by selective etching. A liquid sealing material is in the space between the circuit chip and the surface of the substrate, fixing the circuit chip on the surface of the substrate. The circuit chip has a plurality of electrodes arranged in a first pattern, and the substrate has a plurality of connection terminals arranged in the first pattern within a chip mounting area on a surface thereof. Each of the grooves passes between two adjacent connection terminals through the chip mounting area, and both ends of each groove protrudes from the periphery of the chip mounting area. After the circuit chip is placed on the chip mounting area with the respective electrodes corresponding to the connection terminals, a liquid sealing material may be spread more easily into the space between the circuit chip and the substrate by the use of capillary action to provide a more reliable and efficient seal.
摘要翻译：具有电路芯片和印刷电路基板的器件模块，通过选择性蚀刻在其上形成凹槽图案。液体密封材料位于电路芯片和基板表面之间的空间中，将电路芯片固定在基板的表面上。电路芯片具有以第一图案布置的多个电极，并且基板在其表面上的芯片安装区域内具有以第一图案布置的多个连接端子。每个槽通过芯片安装区域在两个相邻的连接端子之间通过，并且每个槽的两端从芯片安装区域的周边突出。在将电路芯片放置在具有对应于连接端子的相应电极的芯片安装区域之后，通过使用毛细管作用，液体密封材料可以更容易地扩散到电路芯片和基板之间的空间中，以提供更多可靠高效的密封。

10. 发明授权

US5565704A Memory card having two types of memory integrated circuits connected to two different shaped connectors 失效
标题翻译：具有连接到两个不同形状的连接器的两种类型的存储器集成电路的存储卡
公开(公告)号：US5565704A
公开(公告)日：1996-10-15
申请号：US353371
申请日：1994-12-02
申请人： Kenichi Tokuno
发明人： Kenichi Tokuno
IPC分类号： G11C5/00 , H01L23/538 , H05K1/11 , H05K1/18 , H01L23/02 , H01L23/58
CPC分类号： H01L23/5388 , H05K1/181 , H01L2924/0002 , H05K1/117 , H05K2201/09972 , H05K2201/10159 , H05K2201/10189 , Y02P70/611
摘要： A memory card includes two types of memory integrated circuits (ICs) and two connectors located on opposite sides of the card. One connector is electrically connected to one type of memory ICs, and the other connector is electrically connected to the other type of memory ICs. This allows two kinds of functions to coexist within a single memory card. The two types of memory ICs are a dynamic random access memory (DRAM) IC and a read-only memory (ROM) IC, respectively.
摘要翻译：存储卡包括两种类型的存储器集成电路（IC）和位于卡相对侧上的两个连接器。一个连接器电连接到一种类型的存储器IC，另一个连接器电连接到另一种类型的存储器IC。这允许两种功能在单个存储卡内共存。两种类型的存储器IC分别是动态随机存取存储器（DRAM）IC和只读存储器（ROM）IC。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式