基本信息:
- 专利标题： 반도체 패키지 제작 방법
- 专利标题（英）：Semiconductor package manufacturing method
- 专利标题（中）：半导体封装制造方法
- 申请号：KR1020150107440 申请日：2015-07-29
- 公开(公告)号：KR1020150094565A 公开(公告)日：2015-08-19
- 发明人： 김재윤 , 임기태 , 정운갑 , 조병우 , 나도현 , 김진성 , 박동주 , 한규완 , 정지영 , 윤주훈
- 申请人： 앰코 테크놀로지 코리아 주식회사
- 申请人地址： 광주광역시 북구 앰코로 *** (대촌동)
- 专利权人： 앰코 테크놀로지 코리아 주식회사
- 当前专利权人： 앰코 테크놀로지 코리아 주식회사
- 当前专利权人地址： 광주광역시 북구 앰코로 *** (대촌동)
- 代理人： 제일특허법인
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L23/12 ; H01L25/07 ; H01L23/28
The semiconductor package manufacturing method of the present invention, the process of bonding a semiconductor die chip pads are formed on the lower portion on the lower surface of a substrate for extension by using an adhesive member, and a plurality of relocation I / O in a predetermined position on the above-mentioned expansion board and the process of forming the relocation conductive bump for the step of a plurality of preparing the substrate is the lower conductive bump formed for the lower I / O and, touches the relocation conductive bump and the lower conductive bumps corresponding to each other fit, chip pad of the semiconductor die the may include a process of bonding the substrate and the substrate for the extension so as to abut on the wiring layer of the substrate.
公开/授权文献:
- KR101616272B1 반도체 패키지 제작 방법 公开/授权日：2016-05-02
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/34 | .冷却装置；加热装置；通风装置或温度补偿装置 |
| ----------H01L23/488 | ..由焊接或黏结结构组成 |