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1. 发明申请

WO2022207307A1 VERBINDUNG ZWEIER BAUTEILE MIT EINEM VERBINDUNGSELEMENT 审中-公开
公开(公告)号：WO2022207307A1
公开(公告)日：2022-10-06
申请号：PCT/EP2022/056695
申请日：2022-03-15
申请人： NANOWIRED GMBH
发明人： BIRLEM, Olav , DASSINGER, Florian , QUEDNAU, Sebastian , ROUSTAIE, Farough
IPC分类号： H01L23/36 , H01L23/40 , H01L23/538 , H05K1/02 , B82Y10/00 , H01L21/48 , H01L23/373 , H01L23/42
摘要： Verbindungselements (1) mit einer jeweiligen Vielzahl von Nanodrähten (2) auf einer ersten Verbindungsfläche (3) und/oder auf einer der ersten Verbindungsfläche (3) gegenüberliegenden zweiten Verbindungsfläche (4), wobei ein Abstand (d) zwischen der ersten Verbindungsfläche (3) und der zweiten Verbindungsfläche (4) über das Verbindungselement (1) variiert.

2. 发明申请

WO2022072286A1 ACTIVE HEAT SINK 审中-公开
公开(公告)号：WO2022072286A1
公开(公告)日：2022-04-07
申请号：PCT/US2021/052240
申请日：2021-09-27
申请人： FRORE SYSTEMS INC.
发明人： YALAMARTHY, Ananth, Saran , SATHYAMURTHY, Prabhu , GANTI, Suryaprakash , MADHAVAPEDDY, Seshagiri, Rao , MUKUNDAN, Vikram
IPC分类号： F04B43/04 , H01L23/42 , H01L23/467
摘要： A system including a cooling element and a support structure is described. The cooling element has a first side and a second side opposite to the first side. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid from the first side to the second side. The support structure thermally couples the cooling element to a heat-generating structure via thermal conduction.

3. 发明申请

WO2020137473A1 温度制御ユニット、温度制御装置审中-公开
公开(公告)号：WO2020137473A1
公开(公告)日：2020-07-02
申请号：PCT/JP2019/048007
申请日：2019-12-09
申请人：株式会社巴川製紙所
发明人：幡野　修平 , 森内　英輝 , 奥村　勝弥
IPC分类号： F28F21/08 , H01L23/42 , C09K5/04 , F28D15/02 , F28D15/04 , F28D15/06 , H05K7/20
摘要：本発明は、温度調節媒体の漏洩による電子部品の故障のおそれが低減され、効率的に対象物の温度を調節できる温度調節ユニットを提供する。本発明による温度制御ユニット（１）は、対象物の温度を調節する温度制御ユニット（１）であって、温度調節媒体と、前記温度調節媒体の流路となる空間が形成されている金属繊維シート（５０）とを備え、前記温度調節媒体が液体状態から気体状態に状態変化する際の前記温度調節媒体の蒸発潜熱が７０～２００ｋＪ／ｋｇであり、前記温度調節媒体が大気圧下で液体状態から気体状態に状態変化する際の前記温度調節媒体の体積膨張率が２５０倍以下である。

4. 发明申请

WO2019066990A1 PACKAGE WITH THERMAL INTERFACE MATERIAL RETAINING STRUCTURES ON DIE AND HEAT SPREADER 审中-公开
公开(公告)号：WO2019066990A1
公开(公告)日：2019-04-04
申请号：PCT/US2017/054674
申请日：2017-09-30
申请人： INTEL CORPORATION , EID, Feras
发明人： EID, Feras
IPC分类号： H01L23/367 , H01L23/42 , H01L23/40
摘要： A device package and a method of forming a device package are described. The device package includes a lid with one or more legs on an outer periphery of the lid, a top surface, and a bottom surface, where the lid is disposed on the substrate. The legs of the lid are attached to the substrate with a sealant. The device package also has one or more dies disposed on the substrate. The die(s) are below the bottom surface of the lid, where each of the dies has a top surface and a bottom surface. The device package further includes a retaining structure disposed between the bottom surface of the lid and the top surface of the die, where the retaining structure has one or more inner walls. The device package includes a thermal interface material disposed within the inner walls of the retaining structure and above the top surface of the die.

5. 发明申请

WO2018140113A1 TECHNIQUES FOR FLUID COOLING OF INTEGRATED CIRCUITS IN PACKAGES 审中-公开
公开(公告)号：WO2018140113A1
公开(公告)日：2018-08-02
申请号：PCT/US2017/061484
申请日：2017-11-14
申请人： INTEL CORPORATION
发明人： GUTALA, Ravi , DASU, Aravind
IPC分类号： H01L23/46 , H01L25/065 , H01L23/42
摘要： A method is provided for removing heat from an integrated circuit package. Fluid coolant is provided from a fluid inlet of a fluid routing device through channels in the fluid routing device to absorb heat generated by first and second integrated circuit dies in the integrated circuit package. The fluid routing device is mounted on a surface of each of the first and second integrated circuit dies. The fluid coolant is provided from the channels to a fluid outlet of the fluid routing device. A flow of the fluid coolant through the fluid routing device is adjusted to reduce a temperature of the first integrated circuit die in response to an increase in a workload of the first integrated circuit die.

6. 发明申请

WO2018126269A1 HEAT REMOVAL BETWEEN TOP AND BOTTOM DIE INTERFACE 审中-公开
公开(公告)号：WO2018126269A1
公开(公告)日：2018-07-05
申请号：PCT/US2018/012078
申请日：2018-01-02
申请人： INTEL CORPORATION
发明人： CHEW, Yen, Hsiang
IPC分类号： H01L23/367 , H01L23/48 , H01L25/065 , H01L23/373 , H01L23/42 , H01L23/498
摘要： Heat dissipation technology in a die stack is disclosed. In one example, an electronic device comprises a pair of electrically coupled dies; and a heat spreader disposed between the pair of dies and electrically isolated from an electrical connection between the pair of dies.

7. 发明申请

WO2017168427A1 TEMPERATURE CONTROLLING DEVICE AND SYSTEM HAVING STATIC COOLING CAPACITY 审中-公开
标题翻译：具有静态冷却能力的温度控制装置和系统
公开(公告)号：WO2017168427A1
公开(公告)日：2017-10-05
申请号：PCT/IL2017/050396
申请日：2017-03-30
申请人： CLEAR PX TECHNOLOGIES LTD
发明人： DROR, Haim , ZIV, Atai , KHOURY, Rabeeh , OMARY, Kossay
IPC分类号： F28F7/00 , F28F13/00 , F28F21/00 , F28F23/00 , G06F1/20 , G12B15/04 , H01L23/40 , H01L23/42 , H01L23/473
摘要： A cooling device for cooling a heat generating load, the device having an enclosed housing defining a continuous cooling volume for flowing a coolant between an inlet and an outlet. The housing featuring at least one surface that is configured for facilitating heat exchange sequence with the heat generating load such that the coolant is configured to absorb generated heat.
摘要翻译：一种用于冷却发热负载的冷却装置，所述装置具有封闭的壳体，所述封闭的壳体限定用于使冷却剂在入口和出口之间流动的连续冷却容积。壳体具有至少一个表面，该表面构造成便于与发热负载进行热交换，使得冷却剂被配置为吸收产生的热量。

8. 发明申请

WO2016164569A1 PROCESS GAS PREHEATING SYSTEMS AND METHODS FOR DOUBLE-SIDED MULTI-SUBSTRATE BATCH PROCESSING 审中-公开
标题翻译：过程气体预处理系统和双面多基板批处理方法
公开(公告)号：WO2016164569A1
公开(公告)日：2016-10-13
申请号：PCT/US2016/026422
申请日：2016-04-07
申请人： APPLIED MATERIALS, INC.
发明人： ISHIKAWA, David Masayuki , STEFFAS, Paul J. , ACHARYA, Sumedh , BURROWS, Brian H.
IPC分类号： H01L31/18 , H01L23/34 , H01L23/40 , H01L23/42
CPC分类号： C30B25/22 , C23C16/45502 , C23C16/45512 , C23C16/4557 , C23C16/46 , C30B25/10 , C30B25/12 , C30B25/14 , C30B29/06 , H01L21/02532 , H01L21/0262 , H01L21/67103 , H01L21/67109 , H01L21/6719 , H01L21/68771 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： In some embodiments, an substrate processing system may include a chamber body, a heater assembly disposed within the chamber body, wherein the heater assembly includes a plurality of resistive heater elements coupled together to form an isothermal heated enclosure, and a process kit disposed within the isothermal heated enclosure and having an inner processing volume that includes a plurality of substrate supports to support substrates when disposed thereon, wherein the process kit includes a first processing gas inlet to provide processing gases to the inner processing volume, a first carrier gas inlet to provide a carrier gas to the inner processing volume, and a first exhaust outlet, and a first gas heater coupled via a first conduit to the first carrier gas inlet to heat the carrier gas prior to flowing into the inner processing volume.
摘要翻译：在一些实施例中，衬底处理系统可以包括室主体，设置在室主体内的加热器组件，其中加热器组件包括耦合在一起以形成等温加热外壳的多个电阻加热器元件，以及设置在室主体内的处理套件等温加热的外壳并且具有内部处理体积，其包括多个基板支撑件，以在其上设置时支撑基板，其中所述处理套件包括用于向所述内部处理体积提供处理气体的第一处理气体入口，第一载气入口以提供到内部处理体积的载气和第一排气出口，以及经由第一导管连接到第一载气入口的第一气体加热器，以在流入内部处理容积之前加热载气。

9. 发明申请

WO2016128094A1 WÄRMETRANSFERBLECH 审中-公开
标题翻译：传热片
公开(公告)号：WO2016128094A1
公开(公告)日：2016-08-18
申请号：PCT/EP2015/079383
申请日：2015-12-11
申请人： ROBERT BOSCH GMBH
发明人： DILLMANN, Adolf , HOLP, Reiner , HUEHNER, Stefan
IPC分类号： H01L23/367 , H01L23/373 , H01L23/40 , H01L23/42
CPC分类号： H01L23/367 , F28F3/044 , F28F2275/12 , H01L23/3675 , H01L23/3736 , H01L23/4006 , H01L23/42
摘要： Die vorliegende Erfindung betrifft ein Verfahren zur Herstellung einer Baugruppe (1), insbesondere einer Leistungselektronik, umfassend die folgenden Schritte: Bereitstellen eines zu kühlenden Bauteils (2) mit einer ersten Fläche (4), Bereitstellen einer Kühlvorrichtung (3) mit einer der ersten Fläche (4) gegenüberliegenden zweiten Fläche (5), Anordnen eines 3-dimensionalen Wärmetransferbleches (6) zwischen den beiden Flächen (4, 5), wobei sich das Wärmetransferblech (6) in einer zu den beiden Flächen (4, 5) parallelen Blechebene (11) erstreckt und im Ausgangszustand eine Vielzahl an Kontaktfortsätzen (9) aufweist, die sich aus zu dieser Blechebene (11) heraus erstrecken, und Verspannen des Bauteils (2) und der Kühlvorrichtung (3) zueinander, wodurch die Kontaktfortsätze (9) in Richtung der Blechebene deformiert werden.
摘要翻译：本发明涉及一种用于制造组件（1），特别是功率电子，包括以下步骤：提供一组件被冷却（2）具有第一表面（4），提供冷却装置（3）与所述第一表面中的一个（4）所述第二面相反的（5），布置在两个表面之间的3维传热板（6）（4，5），其中所述传热在一个板（6）的两个表面（4,5）平行片平面（ 11）与在初始状态下具有多个接触突起从（到片材11）出来和组分（2）的失真的该平面延伸的（9）和彼此冷却装置（3），其中所述接触凸块（9）的方向片平面变形。

10. 发明申请

WO2013140295A3 THERMAL INTERFACE MATERIAL 审中-公开
公开(公告)号：WO2013140295A3
公开(公告)日：2013-09-26
申请号：PCT/IB2013/051907
申请日：2013-03-11
申请人： KONINKLIJKE PHILIPS N.V.
发明人： FLESKENS, Bas , DEN BOER, Reinier Imre Anton
IPC分类号： H01L23/42 , F21V29/00
摘要： There is provided a thermal interface material, TIM, a thermal interface application comprising such a TIM, and corresponding methods for providing the material and the thermal interface. The TIM comprises a TIM layer in which an activable shrinkage material is distributed, such that upon activation of the shrinkage material the thickness of the TIM layer is increased. In the thermal interface application, where the TIM (400) is arranged between a heat generating component (20) and a heat conducting element (30), the increase in thickness of the TIM layer is utilized to increase the contact pressure on mating surfaces. The TIM is sandwiched between the heat generating component and the heat conducting element before the activation of the shrinkage material, and the distance (h) between the heat generating component and the heat conducting element is restricted such upon activation of the shrinkage material, the restricted maximum height (h) between the heat generating component and the heat conducting element in combination with the TIM increasing the thickness of the TIM layer, the contact pressure on the mating surfaces is increased.

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