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    • 6. 发明申请
    • WATERPROOF LED BEACON LIGHT
    • 防水LED路灯
    • WO2009134113A1
    • 2009-11-05
    • PCT/MY2009/000057
    • 2009-04-28
    • AVIALITE SDN BHDCHEW, Ah, Leh
    • CHEW, Ah, Leh
    • F21V31/04H01L25/13F21S8/00F21W111/00
    • F21V31/04F21V15/00F21V21/116F21W2111/00F21W2111/06F21W2131/10F21Y2105/10F21Y2107/30F21Y2115/10
    • The present invention relates to a beacon light (100) for aviation obstacle warning comprising an elongated body portion formed into a hollow tube (19), a plurality of light emitting diodes (LEDs) (10) mounted on the outer surface of the hollow tube (19) and electrically connected together to form a substantially cylindrical array of LEDs (10), characterized in that a plurality of grooves (21) are formed axially on the outer surface of the hollow tube for arranging the array of LEDs (10) in a substantially cylindrical and orderly manner, and the hollow tube and the LEDs (10) being encapsulated with sealing composition (11), wherein at least a part of the lens body of the LEDs (10) protrudes out from the surface of the encapsulation to allow the direct emission of light. The LEDs (10) are affixed along an elongate conductor set within the grooves (21) and the surface of the body portion. The beacon light (100) which is very compact, light weight for use high up on communications towers and in an around airports, etc. The clear portion of the LED lens to project the light directly outwards 360 degrees horizontally and with a vertical beam width of 15 - 35 degrees. This eliminates the need for a dome or covers over the LEDs that cut down effective light output. This construction further improves heat conduction and cooling from direct convection of air. It is particularly good for keeping out moisture from causing deterioration of the electrical and electronic circuits in the light (100) in hot and humid tropical climates and for long term operation of the light (100).
    • 本发明涉及一种用于航空障碍物警报的信标灯(100),包括形成中空管(19)的细长主体部分,安装在中空管外表面上的多个发光二极管(10) (19)并且电连接在一起以形成基本上圆柱形的LED阵列(10),其特征在于,在所述中空管的外表面上轴向形成多个凹槽(21),用于将所述LED阵列(10)布置在 基本上圆柱形和有序的方式,并且中空管和LED(10)被密封组合物(11)封装,其中LED(10)的透镜体的至少一部分从封装的表面突出到 允许直接发光。 LED(10)沿着设置在槽(21)内的细长导体和主体部分的表面固定。 信标灯(100)非常紧凑,重量轻,在通讯塔和机场周边使用较高。LED透镜的透明部分水平投射360度,垂直波束宽度 15 - 35度。 这样就不需要一个圆顶,也不需要遮盖LED上的有效光输出。 这种结构进一步改善了直接对流空气的热传导和冷却。 特别适用于防止潮湿,导致热和潮湿的热带气候中的光(100)中的电气和电子电路的劣化以及光(100)的长期运行。
    • 9. 发明申请
    • LED MODULE, METHOD FOR PRODUCING THE SAME AND THE USE THEREOF
    • LED模组,方法及其和使用
    • WO02005357A1
    • 2002-01-17
    • PCT/DE2001/002565
    • 2001-07-10
    • F21K99/00H01L25/075H01L25/13H01L33/62H01L33/64H01L33/00F21V29/00
    • H01L33/641H01L25/0753H01L25/13H01L33/62H01L2224/48465H01L2924/01322H01L2924/10253H01L2924/3025H01L2224/48091H01L2924/00014H01L2924/00
    • The invention relates to an LED module comprising a substrate (1) with a good thermal conductivity, on whose surface one or more radiation-emitting semiconductor elements (2) is/are fixed and whose underside is fixed to a support body (3) with a high thermal capacity. The component fixing element (4) placed between the semiconductor elements (2) and the substrate (1) and the substrate fixing element (5) placed between the substrate (1) and the support body (3) have a good thermal conductivity. The invention also relates to a method for producing the LED module, according to which metal surfaces that are suitable for use as etching masks improve the application of the current required during anodic bonding and at the same time are used as contact surfaces for contacting the radiation-emitting semiconductor elements (2). The invention further relates to the use of the LED module. The advantage of said inventive LED module is that the semiconductor components can be supplied with a higher current, as a result of the high thermal capacity of the support body.
    • 本发明涉及一种LED模块,具有高导热性基板(1),在其顶部的一个或多个发射辐射的半导体部件(2)是固定的,其在支承体上侧(3)高的热容量被安装,其中,所述部件安装(4) 半导体部件(2)和所述基板(1)和基板安装(5)在衬底(1)和所述Tragerkörper之间(3)被设计具有良好导热性之间。 此外,本发明涉及一种用于LED模块,在适当情况下作为蚀刻金属表面,以提高在需要时阳极接合流的压花,同时被用作接触表面用于接触所述发射辐射的半导体元件的制备方法(2)。 此外,本发明涉及使用LED模块的。 根据本发明的LED模块具有的优点是,半导体器件可通过承载体的高的热容量被加电。