基本信息:
- 专利标题: LIGHTING MODULE UNIT
- 专利标题(英):Lighting module unit
- 专利标题(中):说明
- 申请号:PCT/EP2001/001948 申请日:2001-02-21
- 公开(公告)号:WO01073844A1 公开(公告)日:2001-10-04
- 主分类号: H01L25/13
- IPC分类号: H01L25/13 ; H01L33/64 ; H01L25/075 ; H01L33/00
摘要:
The invention relates to a lighting module which is designed to be used as a component for lamps, comprising a support (4) that consists of conductor strips (1, 2) and insulating support material (3) and light-emitting diodes (5) which are electrically connected to the conductor strips (1, 2). To achieve increased luminance, the heat of the light-emitting diodes must be dissipated effectively. To achieve this, the inventive conductor strips (1, 2) have a material thickness (8) and radiation surface that are suitable for dissipating and radiating the heat that has been generated by the light-emitting diodes.
摘要(中):
作为用于照明的照明灯具模块的组件提供的阀具有:(4)由导体轨道的载体(1,2)和绝缘支撑材料(3),和发光二极管(5)的导体轨(1,2)电连接。 为了实现更高的亮度,LED的热量必须有效地消散。 这是根据本发明,所述导体轨迹完成(1,2)形成用于排出和发射在发光二极管(5)耐热合适的材料厚度已(8)和辐射表面。
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L25/00 | 由多个单个半导体或其他固态器件组成的组装件 |
--------H01L25/03 | .所有包含在H01L27/00至H01L51/00各组中同一小组内的相同类型的器件,例如整流二极管的组装件 |
----------H01L25/04 | ..不具有单独容器的器件 |
------------H01L25/13 | ...包含在H01L33/00组类型的器件 |