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    • 1. 发明申请
    • DEVICES FROM AND METHOD FOR PRODUCING CRYSTALLOGRAPHIC BOUNDARY JUNCTIONS IN SUPERCONDUCTING THIN FILMS
    • 在超薄膜中制造晶体间界面结构的装置和方法
    • WO1992015406A1
    • 1992-09-17
    • PCT/US1992001444
    • 1992-02-24
    • SUPERCONDUCTOR TECHNOLOGIES, INC.
    • SUPERCONDUCTOR TECHNOLOGIES, INC.JAMES, Timothy, WaltonFLEMING, Julia, Sophia
    • B05D05/12
    • H01L39/225H01L39/2496Y10S505/701Y10S505/702Y10S505/728Y10S505/732
    • Devices from and a method for generating repeatable and reproducible crystallographic grain-boundary junctions are provided by forming a film on a crystalline substrate which has intersecting faces. In a preferred embodiment, a single crystal substrate (10) is etched by an anisotropic etchant to provide a ''V''-groove in one face, and an epitaxial superconducting film (16) is grown on the faces (14) of the V-groove. In another preferred embodiment, a step is etched with an anisotropic etch, and an epitaxial superconducting film grown on the step. Grain-boundary junctions are formed at the points (20) of intersection of the faces with each other, or with the faces (18) and the surface of the substrate. The film may be patterned and etched in the area of the boundary junction to form useful devices. One useful device is a SQUID formed with the boundary junction at the bottom of a V-groove. Another useful device is serially connected junctions.
    • 通过在具有相交面的晶体衬底上形成膜来提供用于产生可重复和可再现的结晶晶界结的装置和方法。 在优选实施例中,通过各向异性蚀刻剂对单晶衬底(10)进行蚀刻,以在一个面中提供“V”形槽,并且外延超导膜(16)生长在 V形槽。 在另一优选实施例中,通过各向异性蚀刻蚀刻步骤,并在该步骤上生长外延超导膜。 在面彼此相交的点(20)处,或者与面(18)和衬底的表面相交的点(20)处形成晶界结。 该膜可以在边界结的区域中被图案化和蚀刻以形成有用的装置。 一个有用的装置是在V形槽的底部形成边界结的SQUID。 另一个有用的装置是串联的连接点。
    • 7. 发明申请
    • FORMATION OF SUPERCONDUCTING DEVICES USING A SELECTIVE ETCHING TECHNIQUE
    • 使用选择性蚀刻技术形成超导体器件
    • WO98033665A1
    • 1998-08-06
    • PCT/US1998/001093
    • 1998-01-21
    • H01L39/24B44C1/22
    • H01L39/2496H01L39/2467Y10S505/728Y10S977/72Y10S977/832
    • A method for forming a superconducting device (232) using a selective etching technique on superconducting thin films. The method utilizes rapid etching which combines ion implantation with chemical etching. The portions of the superconducting film to be retained are masked (215) from the ion implantation process (217). The chemical etching process then removes the implanted portions (225, 227) of the superconducting film at a much faster rate than the portions (223) not implanted so that only the un-implanted portions (223) remain. The resulting superconducting devices can be used, e.g., as nanostructures and nano tips, bolometers, multilayer RF coils, microwave waveguides and filters.
    • 一种使用超导薄膜上的选择性蚀刻技术形成超导器件(232)的方法。 该方法利用快速蚀刻,其结合离子注入与化学蚀刻。 将要保留的超导膜的部分从离子注入工艺(217)掩蔽(215)。 然后,化学蚀刻工艺以比没有植入的部分(223)快得多的速度去除超导膜的注入部分(225,227),使得仅留下未注入部分(223)。 所得到的超导装置可以用作例如纳米结构和纳米尖端,测辐射热计,多层RF线圈,微波波导和滤波器。