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    • 1. 发明申请
    • CLEANING AGENT FOR REMOVAL OF SOLDERING FLUX
    • 用于清除焊剂的清洁剂
    • WO2017082936A1
    • 2017-05-18
    • PCT/US2015/060725
    • 2015-11-13
    • KYZEN CORPORATION
    • DOYEL, Kyle, J.BIXENMAN, Michael, L.LOBER, David, T.SOUCY, Kevin
    • C07D317/14
    • C07D317/20
    • A composition effective for removing solder fluxes either as a concentrated material or when diluted with water. The composition is effective in removing all types of solder fluxes including rosin type, resin type, no-clean, Sow residue, lead-free, organic acid and water soluble soldering fluxes. The composition comprises isopropylidene glycerol and an alkali and has a pH of greater than 7.5. The composition may contain additional optional solvents and additives to enhance cleaning of articles or to impart other properties to the composition. The composition can be contacted with a surface to be cleaned in a number of ways and under a number of conditions depending on the manufacturing or processing variables present.
    • 用于去除助焊剂的组合物,作为浓缩材料或用水稀释时有效。 该组合物有效去除所有类型的助焊剂,包括松香型,树脂型,免清洗,母猪残留物,无铅,有机酸和水溶性助焊剂。 该组合物包含异亚丙基甘油和碱,并且具有大于7.5的pH。 该组合物可含有额外的任选溶剂和添加剂以增强物品的清洁或赋予组合物其他性质。 取决于存在的制造或加工变量,组合物可以以多种方式并且在多种条件下与要清洁的表面接触。