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1. 发明申请

WO2018172470A9 HEAT SHRINKABLE TUBE ASSEMBLY SYSTEM 审中-公开
公开(公告)号：WO2018172470A9
公开(公告)日：2018-09-27
申请号：PCT/EP2018/057332
申请日：2018-03-22
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , SHENZHEN AMI TECHNOLOGY CO., LTD. , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , TYCO ELECTRONICS UK LTD
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian
IPC分类号： H01R4/72 , B25J9/16 , H01R43/00 , H02G15/18
摘要： An assembly system, including: a feeding mechanism (100) adapted to feed a heat shrinkable tube (12); a cutting mechanism (200) adapted to cut off a section of heat shrinkable tube with a predetermined length from the heat shrinkable tube fed by the feeding mechanism; a clamping mechanism (300) adapted to clamp the heat shrinkable tube during cutting the heat shrinkable tube by the cutting mechanism; a robot (500) adapted to grip the section of heat shrinkable tube cut off from the heat shrinkable tube; and a vision system (410, 420) adapted to guide the robot to sleeve the section of heat shrinkable tube onto a wire (11) of an electrical device (10). The assembly system may realize the automatic assembly of the heat shrinkable tube, improving the assembly efficiency and ensuring the assembly accuracy.

2. 发明申请

WO2018210884A2 WIRE AUTOMATIC SOLDERING SYSTEM 审中-公开
公开(公告)号：WO2018210884A2
公开(公告)日：2018-11-22
申请号：PCT/EP2018/062625
申请日：2018-05-15
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , SHENZHEN AMI TECHNOLOGY CO., LTD. , TYCO ELECTRONICS UK LTD
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian , DENG, Yingcong , LIU, Yun
IPC分类号： B23K1/00 , B23K1/08
摘要： A wire automatic soldering system includes: a carrier adapted to load an electrical product to be soldered; a robot adapted to grip and move the carrier on which the electrical product is loaded; a solder paste container configured to contain a solder paste; and a heater configured to heat the solder paste contained in the solder paste container, so that the solder paste is melted into liquid. The robot is adapted to move wires of the electrical product into the solder paste container, so as to solder the wires together by the solder paste in the solder paste container. The wire automatic soldering system may automatically perform the task of soldering wires of the electrical product. Thereby, it may be suitable for automatic soldering of mass electrical products, and improve the soldering efficiency.

3. 发明申请

WO2018210878A1 ASSEMBLY SYSTEM ADAPTED TO ASSEMBLE A HEAT SHRINKABLE TUBE ONTO AN ELECTRICAL WIRE 审中-公开
公开(公告)号：WO2018210878A1
公开(公告)日：2018-11-22
申请号：PCT/EP2018/062616
申请日：2018-05-15
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , SHENZHEN AMI TECHNOLOGY CO., LTD. , TYCO ELECTRONICS UK LTD
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian , DENG, Yingcong , LIU, Yun
IPC分类号： H01R4/72 , B25J9/16 , H01R43/00 , H02G15/18
摘要： An assembly system includes: a feeding mechanism configured to feed a heat shrinkable tube; a cutting mechanism adapted to cut off a segment of heat shrinkable tube from the heat shrinkable tube fed by the feeding mechanism; a robot adapted to grip the segment of heat shrinkable tube cut off from the heat shrinkable tube; and a vision system adapted to visually guide the robot to assemble the segment of heat shrinkable tube onto a wire of an electrical product. The assembly system may realize the automatic assembly of the heat shrinkable tube, thereby improving the assembly efficiency and ensuring the assembly accuracy.

4. 发明申请

WO2018210884A3 WIRE AUTOMATIC SOLDERING SYSTEM 审中-公开
公开(公告)号：WO2018210884A3
公开(公告)日：2018-11-22
申请号：PCT/EP2018/062625
申请日：2018-05-15
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , SHENZHEN AMI TECHNOLOGY CO., LTD. , TYCO ELECTRONICS UK LTD
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian , DENG, Yingcong , LIU, Yun
IPC分类号： B23K1/00 , B23K1/08 , B23K101/38
摘要： A wire automatic soldering system includes: a carrier (120) adapted to load an electrical product (10) to be soldered; a robot (100) adapted to grip and move the carrier on which the electrical product is loaded; a solder paste container (200) configured to contain a solder paste; and a heater (220) configured to heat the solder paste contained in the solder paste container, so that the solder paste is melted into liquid. The robot is adapted to move wires (11) of the electrical product into the solder paste container, so as to solder the wires together by the solder paste in the solder paste container. The wire automatic soldering system may automatically perform the task of soldering wires of the electrical product. Thereby, it may be suitable for automatic soldering of mass electrical products, and improve the soldering efficiency.

5. 发明申请

WO2018172470A1 HEAT SHRINKABLE TUBE ASSSEMBLY SYSTEM 审中-公开
公开(公告)号：WO2018172470A1
公开(公告)日：2018-09-27
申请号：PCT/EP2018/057332
申请日：2018-03-22
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , SHENZHEN AMI TECHNOLOGY CO., LTD. , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , TYCO ELECTRONICS UK LTD
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian
IPC分类号： H01R4/72 , B25J9/16 , H01R43/00 , H02G15/18
摘要： An assembly system, including: a feeding mechanism (100) adapted to feed a heat shrinkable tube (12); a cutting mechanism (200) adapted to cut off a section of heat shrinkable tube with a predetermined length from the heat shrinkable tube fed by the feeding mechanism; a clamping mechanism (300) adapted to clamp the heat shrinkable tube during cutting the heat shrinkable tube by the cutting mechanism; a robot (500) adapted to grip the section of heat shrinkable tube cut off from the heat shrinkable tube; and a vision system (410, 420) adapted to guide the robot to sleeve the section of heat shrinkable tube onto a wire (11) of an electrical device (10). The assembly system may realize the automatic assembly of the heat shrinkable tube, improving the assembly efficiency and ensuring the assembly accuracy.

6. 发明申请

WO2018167207A1 CARRIER 审中-公开
公开(公告)号：WO2018167207A1
公开(公告)日：2018-09-20
申请号：PCT/EP2018/056521
申请日：2018-03-15
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , TYCO ELECTRONICS UK LTD.
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian , DENG, Yingcong , LIU, Yun
IPC分类号： H05K3/30 , G01R1/04 , G01R31/01
摘要： Disclosed is a carrier including: a base (100) on which a circuit board (121) is mounted; a loading device (111) mounted on the base (100) and configured to load an electronic device (1) thereon; a first pressing device mounted on the base (100) and configured to press a first lead end (1a) protruding from the electronic device (1) on the circuit board (121) to electrically contact the circuit board (121); and a second pressing device mounted on the base (100) and configured to press a second lead end (1b) of the electronic device (1) on the base (100). The carrier is provided with the first pressing device and the second pressing device adapted to fix the first lead end and the second lead end of the electronic device. Thereby, the carrier is adapted to load an electronic device with flexible lead ends.

7. 发明申请

WO2018167216A1 AUTOMATIC SOLDER PASTE FEEDING SYSTEM 审中-公开
公开(公告)号：WO2018167216A1
公开(公告)日：2018-09-20
申请号：PCT/EP2018/056546
申请日：2018-03-15
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , TYCO ELECTRONICS UK LTD
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian , DENG, Yingcong , LIU, Yun
IPC分类号： B23K1/00 , B23K3/06 , H05K3/34
摘要： An automatic solder paste feeding system includes: a base (10); a container (200) mounted on the base and configured to contain solder paste therein; a syringe (100) mounted on the base and configured to inject the solder paste into the container; and a heater (240) mounted on the base and configured to heat the solder paste contained in the container, so that the solder paste is melted into liquid state. The solder paste may be automatically fed by the automatic solder paste feeding system, it improves the feeding efficiency of the solder paste.

8. 发明申请

WO2018178348A1 AUTOMATIC PICK-UP EQUIPMENT 审中-公开
公开(公告)号：WO2018178348A1
公开(公告)日：2018-10-04
申请号：PCT/EP2018/058321
申请日：2018-03-30
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , SHENZHEN AMI TECHNOLOGY CO., LTD. , TYCO ELECTRONICS UK LTD
发明人： DAI, Zhiyong , HU, Lvhai , DENG, Yingcong , ZENG, Qinglong , KANG, Wei
IPC分类号： B25J15/00 , B25J15/02
摘要： An automatic pick-up equipment for picking up components with different shapes, comprises: a base (1) mounted on a manipulator of a robot; a first pick-up device (2) mounted on the base and comprising two first gripping mechanisms opposite to each other, which are configured to linearly reciprocate relative to each other to hold a first component (300); and a second pick-up device (3) mounted on the base. The second pick-up device comprises: two second gripping mechanisms (31) opposite to each other, which are configured to pivotally reciprocate relative to each other to grip a second component (400); and a rotation mechanism (32) configured to drive the two second gripping mechanisms to rotate relative to the baseto change a posture of the gripped second component. The automatic pick-up equipment is adapted to pick up components with different shapes and sizes by different gripping ways.

9. 发明申请

WO2018167232A1 FIXING SYSTEM AND METHOD OF SOLDERING WIRE 审中-公开
公开(公告)号：WO2018167232A1
公开(公告)日：2018-09-20
申请号：PCT/EP2018/056585
申请日：2018-03-15
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , MEASUREMENT SPECIALTIES (CHINA) LTD. , SHENZHEN AMI TECHNOLOGY CO., LTD. , TYCO ELECTRONICS UK LTD
发明人： DENG, Yingcong , ZHONG, Xiaojun , NING, Ke , LI, Xiaocong , TAN, Guiqin , LIU, Yun , ZHANG, Dandan , HU, Lvhai , ZENG, Qinglong
IPC分类号： B23K3/08 , B23K1/00 , H05K3/34
CPC分类号： B23K3/087 , B23K1/0016 , B23K3/00 , H05K3/3421 , H05K3/3494 , H05K2203/0278 , H05K2203/049
摘要： The present invention discloses a fixing system comprising a base (1) and at least one set of clamping devices (2) mounted on the base. Each set of clamping devices includes a first fixture (100), in which a first positioning groove (111), adapted to accommodate and position a circuit board (10) is formed. When the first fixture is mounted on the base, a first angle defined between a bottom surface (111a) of the first positioning groove and a horizontal surface of the base is more than 0 degree and less than 90 degrees, so that the circuit board positioned in the first positioning groove is inclined with respect to the horizontal surface of the base. Because the fixing system is adapted to hold the circuit board obliquely in a predetermined position, during soldering, the melted solder may flow downward automatically along the inclined circuit board, increasing the coverage rate of the solder and making the soldered surfaces smooth and flat.

10. 发明申请

WO2017068473A1 SYSTEM FOR DETERMINING MOUNTING STATE OF PINS OF ELECTRONIC CONNECTOR 审中-公开
标题翻译：确定电子连接器引脚安装状态的系统
公开(公告)号：WO2017068473A1
公开(公告)日：2017-04-27
申请号：PCT/IB2016/056170
申请日：2016-10-14
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS UK LTD.
发明人： ZHOU, Lei , ZHANG, Dandan , HU, Lvhai , DAI, Zhiyong , LU, Roberto Francisco-Yi
IPC分类号： H01R43/20 , G01B11/26 , G01R31/302
CPC分类号： H01R43/20 , G01B11/26 , G01R31/302 , H01R2201/20
摘要： A system for determining mounting state of pins (201) of an electronic connector (100) protruding from a mounting surface (203) of an insulating housing (202) of the electronic connector (100), includes: a positioning device constructed to position the electronic connector (100); an image capturing device (1) constructed to capture an image of a pin (201, 2011, 2012, 2013, 2014) to be detected in a direction which is at an acute angle with respect to an extending direction of an ideal pin (201) protruding perpendicularly from the mounting surface (203); and an identifying device (2) constructed to identify whether the captured image is fallen within a predetermined region (3), and to determine a mounting state of the detected pin (2012, 2013, 2014) as unqualified when identifying that the captured image of the pin (2012) extends beyond the predetermined region (3). The operation of identifying whether or not the mounting state of the detected pins (2012) is qualified may be achieved on line and in real time, reducing manual labor and thereby cost of manufacturing of the electronic connectors.
摘要翻译：用于确定从电子连接器（100）的绝缘壳体（202）的安装表面（203）突出的电子连接器（100）的销（201）的安装状态的系统包括：：构造成定位电子连接器（100）的定位装置; （201,2011,2012,2013,2014）的图像捕捉装置（1），所述图像捕捉装置构造成捕捉在相对于理想销（201,2012,2013,2014）的延伸方向成锐角的方向上检测的销（201,2011,2012,2013,2014）的图像。）从所述安装表面（203）垂直地突出; 以及识别装置（2），被构造为识别所捕获的图像是否落入预定区域（3）内，并且在识别出捕获的图像是不合格的时候将所检测到的针（2012,2013,2014）的安装状态确定为不合格销（2012）延伸超过预定区域（3）。识别所检测的引脚（2012）的安装状态是否合格的操作可以在线地并且实时地实现，从而减少手工劳动并由此减少电子连接器的制造成本。

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