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1. 发明申请

WO2022019814A1 METHOD AND SYSTEM FOR TESTING A PRINTED CIRCUIT BOARD 审中-公开
公开(公告)号：WO2022019814A1
公开(公告)日：2022-01-27
申请号：PCT/SE2020/050747
申请日：2020-07-22
申请人： TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
发明人： ELEFTHERIADIS, Lackis , JIN, Yifei , VULGARAKIS FELJAN, Aneta , VANDIKAS, Konstantinos , KARAPANTELAKIS, Athanasios
IPC分类号： G01R31/28 , G01R31/302 , G01R31/3193 , G01R1/067
摘要： A testing system and method for testing a Printed Circuit Boards (PCBs) is provided. The method is being executed at a testing system which comprises a RF test analyzer; a RF energy source; and one or more RF probes. The method includes performing a first level scanning of a first set of components in the PCB. The method further includes performing a second level scanning of another set of components in the PCB, which differs from the first set of components in the PCB; the second level scanning is performed only if anomalies are identified which is based on analyzing the results of the performed first level scanning. The method further includes determining detailed root causes of the identified anomalies which is based on analyzing results of the performed second level scanning.

2. 发明申请

WO2021037364A1 A TEST ARRANGEMENT, AN AUTOMATED TEST EQUIPMENT AND A METHOD FOR TESTING A DEVICE UNDER TEST COMPRISING A CIRCUIT AND AN ANTENNA WHICH IS COUPLED TO THE CIRCUIT 审中-公开
公开(公告)号：WO2021037364A1
公开(公告)日：2021-03-04
申请号：PCT/EP2019/073024
申请日：2019-08-28
申请人： ADVANTEST CORPORATION , UNIVERSITÄT STUTTGART
发明人： HESSELBARTH, Jan , MOREIRA, José
IPC分类号： G01R31/302
摘要： An embodiment according to the present invention is a test arrangement for testing a DUT comprising an active circuit, and an antenna which is coupled to the circuit. The test arrangement comprises a DUT-location and a probe. Furthermore, the test arrangement comprises a ground area, which is configured to serve as an antenna ground area for an antenna of the DUT. The probe may be positioned, in a proximity of the ground area. The ground area comprises a tiny opening, such that the antenna feed impedance is not affected or not affected significantly. The DUT location is at a first side of the ground area while the probe is arranged at a second side of the ground area. The probe is adapted to weakly couple to the antenna of the DUT via the opening, in order to probe a signal when the antenna of the DUT is fed by the circuit of the DUT and/or in order to couple a signal to the antenna which is fed to the circuit of the DUT by the antenna.

3. 发明申请

WO2019241280A1 TEST-AND-MEASUREMENT PROBE HAVING A TOUCHSCREEN 审中-公开
公开(公告)号：WO2019241280A1
公开(公告)日：2019-12-19
申请号：PCT/US2019/036596
申请日：2019-06-11
申请人： TEKTRONIX, INC.
发明人： RINDER, Karl, A. , SAILOR, David, A. , BARTLETT, Josiah, A.
IPC分类号： G01R1/02 , G01R1/067 , G01R13/02 , G01R31/28 , G01R15/12 , G01R31/302
摘要： A test-and-measurement probe (200) for a test-and-measurement instrument (101), the test-and-measurement probe having a probe head (103) and a touchscreen user interface (250). The probe head is configured to obtain a signal from a device under test. The touchscreen user interface is configured to visually convey test-and-measurement information to a user and to accept user touch input. In embodiments, the touchscreen user interface is removably connected to a compbox (105) of the test-and-measurement probe, through a wired connection or wirelessly.

4. 发明申请

WO2018220931A1 半導体検査装置审中-公开
公开(公告)号：WO2018220931A1
公开(公告)日：2018-12-06
申请号：PCT/JP2018/008830
申请日：2018-03-07
申请人：浜松ホトニクス株式会社
发明人：中村　共則 , 岩城　吉剛
IPC分类号： G01N21/956 , G01R31/302 , H01L21/66
摘要：検査システム１は、光源３３と、ミラー４０ｂと、ガルバノミラー４４ａ，４４ｂと、ミラー４０ｂとガルバノミラー４４ａ，４４ｂを内部に保持し、光学素子を取り付けるための取付部４６を有する筐体３２と、ガルバノミラー４４ａ，４４ｂの振れ角を制御する制御部２１ａと、を備え、制御部２１ａは、半導体デバイスＤと光学的に接続される光路を、ガルバノミラー４４ａ，４４ｂ及びミラー４０ｂを通る第１光路Ｌ１と、ガルバノミラー４４ａ，４４ｂ及び取付部４６を通る第２光路Ｌ２との間で切り替えるように振れ角を制御し、かつ、第１光路Ｌ１に切り替えた際の振れ角と第２光路Ｌ２に切り替えた際の振れ角とが重複しないように、振れ角を制御する。

5. 发明申请

WO2018102259A1 CONTACT ENGINES, PROBE HEAD ASSEMBLIES, PROBE SYSTEMS, AND ASSOCIATED METHODS FOR ON-WAFER TESTING OF THE WIRELESS OPERATION OF A DEVICE UNDER TEST 审中-公开
公开(公告)号：WO2018102259A1
公开(公告)日：2018-06-07
申请号：PCT/US2017/063305
申请日：2017-11-27
申请人： CASCADE MICROTECH, INC.
发明人： BOCK, Daniel Mark , CLEARY, Tim
IPC分类号： G01R31/302 , G01R1/00 , G01R1/073
摘要： Contact engines, probe head assemblies, probe systems, and associated methods for on-wafer testing of the wireless operation of a device under test (DUT). A contact engine includes a flexible dielectric membrane having a first surface and a second surface and a plurality of probes supported by the flexible dielectric membrane. The plurality of probes are oriented to contact a plurality of contact locations on the DUT. Each probe in the plurality of probes includes a corresponding probe tip that projects from the second surface of the flexible dielectric membrane and is configured to electrically and physically contact a corresponding contact location of the plurality of contact locations. The contact engine further includes at least one membrane antenna supported by the flexible dielectric membrane. A probe head assembly includes the contact engine, A probe system includes the probe head assembly. Associated methods include methods of utilizing the contact engine.

6. 发明申请

WO2017094495A1 検査装置及び検査方法审中-公开
标题翻译：检验仪器和检验方法
公开(公告)号：WO2017094495A1
公开(公告)日：2017-06-08
申请号：PCT/JP2016/083855
申请日：2016-11-15
申请人：浜松ホトニクス株式会社
发明人：中村　共則
IPC分类号： G01N27/72 , G01R31/302
CPC分类号： G01N27/72 , G01R31/302
摘要：検査装置１は、第１の波長を有する第１の光及び第２の波長を有する第２の光を出力する光出力部３と、反射膜１３が計測対象物Ｄに対向するように配置される磁気光学結晶６と、第１の光及び前記第２の光を検出する光検出部７と、第１の光及び第２の光を磁気光学結晶６及び計測対象物Ｄに向けて導光すると共に、磁気光学結晶６で反射した第１の光と、計測対象物Ｄで反射した第２の光とを光検出部７に向けて導光する導光光学系４Ａと、を備え、導光光学系４Ａは、第１の光及び第２の光が選択的に光検出部７に入射するように、複数の光学素子による光路を切り替える光路切替素子Ｍを有している。
摘要翻译：
检查装置1，用于输出具有光和第二波长的第二光的第一光输出部分3，反射膜13是具有第一波长的测量对象磁光晶体6被布置成面对所述d，光检测部7，其检测所述第一光和所述第二光，所述第一光和所述第二光磁光晶体6和测量用并且将由磁光晶体6反射的第一光和由测量对象D反射的第二光导向光检测部分7，并将光导向物体D 导光光学系统4A包括用于切换多个光学元件的光路使得第一光和第二光选择性地进入光检测部7的光路切换元件M 它有。

7. 发明申请

WO2017068473A1 SYSTEM FOR DETERMINING MOUNTING STATE OF PINS OF ELECTRONIC CONNECTOR 审中-公开
标题翻译：确定电子连接器引脚安装状态的系统
公开(公告)号：WO2017068473A1
公开(公告)日：2017-04-27
申请号：PCT/IB2016/056170
申请日：2016-10-14
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS UK LTD.
发明人： ZHOU, Lei , ZHANG, Dandan , HU, Lvhai , DAI, Zhiyong , LU, Roberto Francisco-Yi
IPC分类号： H01R43/20 , G01B11/26 , G01R31/302
CPC分类号： H01R43/20 , G01B11/26 , G01R31/302 , H01R2201/20
摘要： A system for determining mounting state of pins (201) of an electronic connector (100) protruding from a mounting surface (203) of an insulating housing (202) of the electronic connector (100), includes: a positioning device constructed to position the electronic connector (100); an image capturing device (1) constructed to capture an image of a pin (201, 2011, 2012, 2013, 2014) to be detected in a direction which is at an acute angle with respect to an extending direction of an ideal pin (201) protruding perpendicularly from the mounting surface (203); and an identifying device (2) constructed to identify whether the captured image is fallen within a predetermined region (3), and to determine a mounting state of the detected pin (2012, 2013, 2014) as unqualified when identifying that the captured image of the pin (2012) extends beyond the predetermined region (3). The operation of identifying whether or not the mounting state of the detected pins (2012) is qualified may be achieved on line and in real time, reducing manual labor and thereby cost of manufacturing of the electronic connectors.
摘要翻译：用于确定从电子连接器（100）的绝缘壳体（202）的安装表面（203）突出的电子连接器（100）的销（201）的安装状态的系统包括：：构造成定位电子连接器（100）的定位装置; （201,2011,2012,2013,2014）的图像捕捉装置（1），所述图像捕捉装置构造成捕捉在相对于理想销（201,2012,2013,2014）的延伸方向成锐角的方向上检测的销（201,2011,2012,2013,2014）的图像。）从所述安装表面（203）垂直地突出; 以及识别装置（2），被构造为识别所捕获的图像是否落入预定区域（3）内，并且在识别出捕获的图像是不合格的时候将所检测到的针（2012,2013,2014）的安装状态确定为不合格销（2012）延伸超过预定区域（3）。识别所检测的引脚（2012）的安装状态是否合格的操作可以在线地并且实时地实现，从而减少手工劳动并由此减少电子连接器的制造成本。

8. 发明申请

WO2015155348A1 CONTACTLESS CONDUCTIVE INTERCONNECT TESTING 审中-公开
标题翻译：无连续导电互连测试
公开(公告)号：WO2015155348A1
公开(公告)日：2015-10-15
申请号：PCT/EP2015/057880
申请日：2015-04-10
申请人： D-CON AB
发明人： DELSING, Jerker , ABDELGHANI, Renbi
IPC分类号： G01R31/28 , G01R31/302
CPC分类号： G01R31/304 , G01R31/2801 , G01R31/2818 , G01R31/312
摘要： A testing device (1) and a method for contactless testing of a conductive interconnect (21) on a circuit board (20) is disclosed. A signal generator (9) is configured to generate an input signal (S i ) to be transmitted from a first terminal (6) to a second terminal (7) via a conductive sensing path (5). A processing circuitry (11) is configured to receive an output signal (S o ) at the second terminal (7) and to determine a property of the conductive interconnect (21) based on the output signal (S o ), where the conductive sensing path (5) is parallel displaced relative to the conductive interconnect (21), along a direction perpendicular to a parallel plane to the conductive interconnect (21), and where the conductive sensing path (5) forms a galvanically isolated connection with the conductive interconnect (21).
摘要翻译：公开了一种测试装置（1）和用于非接触测试电路板（20）上的导电互连（21）的方法。信号发生器（9）被配置为经由导电感测路径（5）产生要从第一端子（6）传输到第二端子（7）的输入信号（Si）。处理电路（11）被配置为在第二终端（7）处接收输出信号（So），并且基于输出信号（So）确定导电互连（21）的属性，其中导电感测路径 5）相对于导电互连（21）沿着垂直于与导电互连（21）的平行平面的方向平行移位，并且其中导电感测路径（5）与导电互连（21）形成电隔离连接）。

9. 发明申请

WO2014169154A1 OPTIMIZED WAVELENGTH PHOTON EMISSION MICROSCOPE FOR VLSI DEVICES 审中-公开
标题翻译：用于VLSI器件的优化波长光子发射显微镜
公开(公告)号：WO2014169154A1
公开(公告)日：2014-10-16
申请号：PCT/US2014/033701
申请日：2014-04-10
申请人： DCG SYSTEMS, INC. , DESLANDES, Herve
发明人： DESLANDES, Herve
IPC分类号： H04N7/18 , G01R31/302 , G01R33/12
CPC分类号： G01R31/2648 , G01R15/246 , G01R31/311
摘要： A method for emission testing of a semiconductor device (DUT), by mounting the DUT onto an test bench of an emission tester, the emission tester having an optical detector; electrically connecting the DUT to an electrical tester; applying electrical test signals to the DUT while keeping test parameters constant; serially inserting one of a plurality of shortpass filters into an optical path of the emission tester and collecting emission test signal from the optical detector until all available shortpass filters have been inserted into the optical path; determining appropriate shortpass filter providing highest signal to noise ratio of the emission signal; inserting the appropriate shortpass filter into the optical path; and,performing emission testing on the DUT.
摘要翻译：一种通过将DUT安装到发射测试仪的测试台上的半导体器件（DUT）的发射测试方法，发射测试仪具有光学检测器; 将DUT电连接到电气测试仪; 将电测试信号施加到DUT，同时保持测试参数不变; 将多个短路滤波器中的一个串联插入到发射测试器的光路中，并收集来自光学检测器的发射测试信号，直到所有可用的短路滤波器已插入光路中; 确定提供发射信号的最高信噪比的适当短路滤波器; 将适当的短路滤波器插入光路; 并对DUT进行发射测试。

10. 发明申请

WO2014073398A1 半導体デバイス検査装置及び半導体デバイス検査方法审中-公开
标题翻译：半导体器件检测器件和半导体器件检测方法
公开(公告)号：WO2014073398A1
公开(公告)日：2014-05-15
申请号：PCT/JP2013/078987
申请日：2013-10-25
申请人：浜松ホトニクス株式会社
发明人：中村　共則
IPC分类号： G01R31/302 , G01N21/00
CPC分类号： G01R31/311 , G01N21/95607 , G01R1/071 , G01R31/26 , G01R31/2601 , G01R31/2851 , G01R31/308
摘要：　半導体デバイス検査装置１は、光を出射するレーザ光源２と、当該光の半導体デバイス１０での反射光を検出し、検出信号を出力する光センサ１２と、検出信号に対して測定周波数帯域及び参照周波数帯域を設定する周波数帯域設定部１６と、測定周波数帯域及び参照周波数帯域における検出信号から測定信号及び参照信号を生成するスペクトラムアナライザ１５と、測定信号と参照信号との差分を算出することで、解析信号を取得する信号取得部１７と、を備える。周波数帯域設定部１６は、検出信号のレベルをパワーに基づいて算出した場合に、当該レベルが、基準となるホワイトノイズレベルに３デシベルを加算したレベル以下となる周波数領域に、参照周波数帯域を設定する。
摘要翻译：该半导体装置检查装置（1）具备：照射光的激光光源（2）检测来自半导体装置（10）的所述光的反射光的光传感器（12），并输出检测信号; 频带设定部（16），其在所述检测信号中设定测定频带和基准频带; 频谱分析器（15），其从测量频带和参考频带中的检测信号产生测量信号和参考信号; 以及通过计算测量信号和参考信号之间的差异来获取分析信号的信号获取单元（17）。当基于功率计算出检测信号电平时，频带设定单元（16）将参考频带设置为频率区域，在该频率区域，该电平变得不大于将3分贝加到基线白色噪音水平。

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