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1. 发明申请

WO2008076029A1 A DUAL POLARIZED WAVEGUIDE FEED ARRANGEMENT 审中-公开
标题翻译：双极化波导送料装置
公开(公告)号：WO2008076029A1
公开(公告)日：2008-06-26
申请号：PCT/SE2006/050615
申请日：2006-12-21
申请人： TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) , LIGANDER, Per , JOSEFSSON, Lars , SVENSSON, Bengt
发明人： LIGANDER, Per , JOSEFSSON, Lars , SVENSSON, Bengt
IPC分类号： H01P5/107 , H05K1/18 , H01P3/12 , H01Q21/00 , H05K1/02
CPC分类号： H01P1/161 , H01P5/107
摘要： The present invention relates to a waveguide arrangement having a longitudinal extension, along which an electromagnetic wave may propagate, and comprising at least one waveguide part (10, 10', 55a, 55b, 57a, 57b, 58) 5 and a feeding arrangement which is arranged for feeding said waveguide part (10, 10', 55a, 55b, 57a, 57b, 58) with a first polarization and a second polarization, said polarizations being mutually orthogonal. The feeding arrangement comprises a dielectric carrier material comprising a first feeding conductor (6, 6', 6''), feeding the first polarization and a second feeding 10 conductor (7, 7', 7''), feeding the second polarization, where the first polarization is excited by means of first excitation means (18, 18a, 18', 42, 56a, 56b; 67, 68) fed by said first feeding conductor (6, 6', 6'') and the second polarization is excited by means of second excitation means (26, 28; 26', 28'; 26'', 28''; 30, 31; 32, 33, 35; 37, 38) fed by said second feeding 15 conductor (7, 7', 7''), where at least one excitation means (18, 18a, 18', 42; 56a, 56b; 67, 68; 26, 28; 26', 28'; 26'', 28''; 30, 31; 32, 33, 35; 37, 38) is a symmetrical structure with respect to the longitudinal extension.
摘要翻译：本发明涉及一种具有纵向延伸的波导装置，电磁波沿着该纵向延伸，其可以传播，并且包括至少一个波导部分（10,10'，55a，55b，57a，57b，58）5和馈送装置布置成用第一极化和第二极化馈送所述波导部分（10,10'，55a，55b，57a，57b，58），所述偏振相互正交。馈电装置包括介电载体材料，其包括馈送第一偏振的第一馈电导体（6,6'，6“）和馈送第二偏振的第二馈电10导体（7,7'，7”），其中所述第一偏振通过由所述第一馈电导体（6,6'，6“）馈送的第一激励装置（18,18a，18'，42,56a，56b; 67,68）激励，并且所述第二极化通过由所述第二馈电15导体（7）馈送的第二激励装置（26,28; 26'，28'; 26“，28”; 30,31; 32,33,35; 37,38），7“，7”），其中至少一个激励装置（18,18a，18'，42; 56a，56b; 67,68; 26,28; 26'，28'; 26“，28” ; 30,31; 32,33,35; 37,38）是相对于纵向延伸部的对称结构。

2. 发明申请

WO2012016584A1 AN ELECTRICALLY TUNABLE WAVEGUIDE FILTER AND WAVEGUIDE TUNING DEVICE 审中-公开
标题翻译：电动可调波形滤波器和波导调谐装置
公开(公告)号：WO2012016584A1
公开(公告)日：2012-02-09
申请号：PCT/EP2010/061218
申请日：2010-08-02
申请人： TELEFONAKTIEBOLAGET LM ERICSSON (publ) , LIGANDER, Per , BASTIOLI, Simone , PELLICCIA, Luca , PERSSON, Ove , SORRENTINO, Roberto
发明人： LIGANDER, Per , BASTIOLI, Simone , PELLICCIA, Luca , PERSSON, Ove , SORRENTINO, Roberto
IPC分类号： H01P1/201 , H01P1/207
CPC分类号： H01P3/12 , H01P1/10 , H01P1/2016 , H01P1/207
摘要： The present invention relates to a waveguide tuning device (1) arranged for mounting in a waveguide structure (2) which has a longitudinal extension (L) and comprises a fist inner wall (3), a second inner wall (4), a third inner wall (5) and a fourth inner wall (6). The inner walls are arranged such that a rectangular cross-section is obtained for the waveguide structure. The first inner wall (3) and the second inner wall (4) have a first length (b) and are facing each other. The third inner wall (5) and the fourth inner wall (6) have a second length (a) and are facing each other. The electrical field (E) is parallel to the main surfaces of the first inner wall (3) and the second inner wall (4). The tuning device (1) is electrically controllable and arranged for mounting at the first inner wall (3) and/or the second inner wall (4). The present invention also relates to a tunable waveguide structure.
摘要翻译：本发明涉及一种布置成安装在波导结构（2）中的波导调谐装置（1），波导结构（2）具有纵向延伸部（L），并包括第一内壁（3），第二内壁（4）内壁（5）和第四内壁（6）。内壁被布置成使得波导结构获得矩形横截面。第一内壁（3）和第二内壁（4）具有第一长度（b）并且彼此面对。第三内壁（5）和第四内壁（6）具有第二长度（a）并且彼此面对。电场（E）平行于第一内壁（3）和第二内壁（4）的主表面。调谐装置（1）是电可控制的并且布置成用于安装在第一内壁（3）和/或第二内壁（4）处。本发明还涉及可调波导结构。

3. 发明申请

WO2009082282A1 A WAVEGUIDE TRANSITION ARRANGEMENT 审中-公开
标题翻译：波形转换安排
公开(公告)号：WO2009082282A1
公开(公告)日：2009-07-02
申请号：PCT/SE2007/001152
申请日：2007-12-20
申请人： TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) , LIGANDER, Per , HASSELBLAD, Marcus
发明人： LIGANDER, Per , HASSELBLAD, Marcus
IPC分类号： H01P1/04
CPC分类号： H01P1/042 , H01P3/121 , H01P11/002
摘要： The present invention relates to a transition arrangement comprising a first surface-mountable waveguide part (4) and a second surface-mountable waveguide part (5), each waveguide part (4, 5) comprising a first wall (7, 10), a second wall (8, 11 ) and a third wall (9, 12), which second and third walls (8, 9; 11, 12) are arranged to contact a dielectric carrier material (1 ), all the walls (7, 8, 9; 10, 11, 12) together essentially forming a U-shape, where the surface-mountable waveguide parts (4, 5) are arranged to be mounted on the dielectric carrier material (1 ) in such a way that the surface-mounted waveguide parts (4, 5) comprise ends (4a, 5a) which are positioned to face each other. The transition arrangement further comprises an electrically conducting sealing frame (17) that is arranged to be mounted over the ends (4a, 5a), covering them, where the frame (17) has a first wall (18), a second wall (19) and a third wall (20), where the second and third walls (19, 20) are arranged to contact the dielectric carrier material (1 ), all the walls together essentially forming a U-shape.
摘要翻译：本发明涉及包括第一可表面安装的波导部分（4）和第二可表面安装的波导部分（5）的过渡装置，每个波导部分（4,5）包括第一壁（7,10）第二壁（8,11）和第三壁（9,12），所述第二和第三壁（8,9; 11,12）被布置成接触介电载体材料（1），所有壁（7,8 ，9; 10,11,12），其基本上形成U形，其中表面安装的波导部件（4,5）被布置成安装在电介质载体材料（1）上，安装的波导部件（4,5）包括被定位成彼此面对的端部（4a，5a）。转换装置还包括导电密封框架（17），其布置成安装在端部（4a，5a）上方，覆盖它们，框架（17）具有第一壁（18），第二壁（19））和第三壁（20），其中第二和第三壁（19,20）布置成接触介电载体材料（1），所有壁基本上形成U形。

4. 发明申请

WO2008069714A1 A SURFACE-MOUNTABLE WAVEGUIDE ARRANGEMENT 审中-公开
标题翻译：表面安装波形安排
公开(公告)号：WO2008069714A1
公开(公告)日：2008-06-12
申请号：PCT/SE2006/050543
申请日：2006-12-05
申请人： TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) , LIGANDER, Per , BASTIOLI, Simone , HASSELBLAD, Marcus
发明人： LIGANDER, Per , BASTIOLI, Simone , HASSELBLAD, Marcus
IPC分类号： H05K3/30 , H05K1/02 , H05K3/34 , H01P1/207 , H01P1/208 , H01P5/107 , H05K1/18
CPC分类号： H01P5/107 , H01P1/207 , H01P11/00 , H05K1/0243 , H05K3/3452 , H05K2201/09072 , H05K2201/09909
摘要： The present invention relates to a surface-mountable waveguide arrangement (35) comprising a dielectric carrier material (1, 39) having a first main side (2, 40) and a second main side (3, 41), the second side (3, 41) comprising a ground plane (31), and the first side (2, 40) being arranged to form a microwave circuit layout by means of metalization patterns on the respective sides (2, 3; 40, 41). The microwave circuit layout comprises a footprint (4, 42) for a surface-mountable waveguide part (5, 43), the waveguide part (5, 43) comprising an open side (17, 59), a part of the footprint (4, 42) constituting a closing wall (18, 60) arranged for closing the open side (17, 59). The waveguide part (5, 43) is arranged for being mounted to a footprint solder area (19, 61) comprised in the footprint (4, 42), having an outer contour (20, 62) and corresponding to a solderable contact area (21, 63) on the waveguide part (5, 43). A solderstop line (29, 72) is formed on the footprint (4, 42), at least partly defining a border between the closing wall (18, 60) and the footprint solder area (19, 61). The present invention also relates to a dielectric carrier.
摘要翻译：本发明涉及一种具有第一主侧（2,40）和第二主侧（3,41）的介质载体材料（1,39）的表面可安装的波导装置（35），所述第二侧（3 ，41），其包括接地平面（31），并且所述第一侧（40,40）被布置成通过所述相应侧面（2,3,40,41）上的金属化图案形成微波电路布局。微波电路布局包括用于表面安装的波导部分（5,43）的覆盖区（4,42），波导部分（5,43）包括开放侧（17,59），部分占地面积（4,43），42），其构成用于封闭所述开放侧（17,59）的封闭壁（18,60）。波导部分（5,43）被布置成被安装到包括在占地面积（4,42）中的占位面积焊料区域（19,61），其具有外轮廓（20,62）并且对应于可焊接接触区域 21,33）在波导部分（5,43）上。阻焊线（29,72）形成在占地面积（4,42）上，至少部分地限定封闭壁（18,60）和焊接区域（19,61）之间的边界。本发明还涉及电介质载体。

5. 发明申请

WO2008008006A1 TRIMMING OF WAVEGUIDE FILTERS 审中-公开
标题翻译：波导滤波器的调制
公开(公告)号：WO2008008006A1
公开(公告)日：2008-01-17
申请号：PCT/SE2006/000881
申请日：2006-07-13
申请人： TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) , LIGANDER, Per , HASSELBLAD, Marcus
发明人： LIGANDER, Per , HASSELBLAD, Marcus
IPC分类号： H01P1/208 , H01P7/06
CPC分类号： H01P1/208 , H01P11/007 , Y10T29/49016
摘要： The invention refers to a waveguide filter (1) comprising a matching means (2) for matching the filter. The waveguide filter (1) comprises a housing (3) comprising a cavity (4) having a predetermined first volume. The matching means (2) is in the form of a volume element having a predetermined second volume being matched to the first volume forming a predetermined volume to volume ratio. The invention is characterised in that the matching means (2) is fitted into the cavity (4) in a fixed non-adjustable manner in relationship to the housing (3) The invention refers also to a method for manufacturing of such a waveguide filter.
摘要翻译：本发明涉及一种波导滤波器（1），其包括用于匹配滤波器的匹配装置（2）。波导滤波器（1）包括壳体（3），壳体（3）包括具有预定第一容积的空腔（4）。匹配装置（2）是具有预定的第二容积的体积元件的形式，其与形成预定体积比的第一容积匹配。本发明的特征在于，匹配装置（2）以与壳体（3）相关的固定的不可调节方式装配到空腔（4）中。本发明还涉及一种制造这种波导过滤器的方法。

6. 发明申请

WO2009127253A1 A WAVEGUIDE FILTER ARRANGEMENT 审中-公开
标题翻译：波形滤波器布置
公开(公告)号：WO2009127253A1
公开(公告)日：2009-10-22
申请号：PCT/EP2008/054591
申请日：2008-04-16
申请人： TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) , LIGANDER, Per , HASSELBLAD, Marcus
发明人： LIGANDER, Per , HASSELBLAD, Marcus
IPC分类号： H01P1/20
CPC分类号： H01P1/207
摘要： The present invention relates to a surface-mountable waveguide filter arrangement comprising a first surface-mountable wave-guide part (4), a second surface-mountable wave-guide part (5) and a dielectric carrier material (1), the dielectric carrier material (1) comprising a first main side (2) and a second main side (3), each main side (2, 3) having a respective metalization pattern. Each surface-mountable wave-guide part (4, 5) comprises a first wall (7, 10), a second wall (8, 11) a third wall (9, 12) and an open side (13, 14), which second and third walls (8, 9; 11, 12) are arranged to contact at least a part of the corresponding metalization pattern on the first main side (2) and second main side (3), respectively, when the surface-mountable wave-guide parts (4, 5) are mounted. When the surface- mountable waveguide parts (4, 5) are mounted, their respective open sides (13, 14) face each other, the dielectric carrier material (1) being positioned between the surface-mountable wave-guide parts (4, 5), such that they together form a waveguide filter with separate frequency band defining means (19, 22) being positioned between them.
摘要翻译：本发明涉及一种可表面安装的波导滤波器装置，其包括第一可表面安装的波导部分（4），第二可表面安装的波导部分（5）和介电载体材料（1），介电载体包括第一主侧（2）和第二主侧（3）的材料（1），每个主侧（2,3）具有各自的金属化图案。每个可表面安装的波导部分（4,5）包括第一壁（7,10），第二壁（8,11），第三壁（9,12）和开口侧（13,14），其中第二和第三壁（8,9; 11,12）被布置成分别在第一主侧（2）和第二主侧（3）上接触相应的金属化图案的至少一部分，当表面安装波 - 引导部件（4,5）。当安装表面安装的波导部件（4,5）时，它们各自的开口侧面（13,14）彼此面对，介电载体材料（1）位于可表面安装的波导部件（4,5）之间），使得它们一起形成具有位于它们之间的分离的频带限定装置（19,22）的波导滤波器。

7. 发明申请

WO2008048153A1 FLIPPED MICRO-STRIP FILTER 审中-公开
标题翻译：襟翼微条纹过滤器
公开(公告)号：WO2008048153A1
公开(公告)日：2008-04-24
申请号：PCT/SE2006/001193
申请日：2006-10-20
申请人： TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) , LIGANDER, Per , HASSELBLAD, Marcus
发明人： LIGANDER, Per , HASSELBLAD, Marcus
IPC分类号： H05K1/02 , H01P1/203
CPC分类号： H05K1/0243 , H01P1/20336 , H05K3/3436 , H05K2201/09781 , H05K2201/1006 , H05K2203/048
摘要： The invention concerns a filter device (2) for a printed circuit board (1), wherein the filter device (1) comprises a selected pattern of conductive material (8) arranged to be electromagnetically coupled to an electrically conductive plane (5b) comprised in the printed circuit board. The invention is characterised in that the filter device (2) is a separate unit from the printed circuit board (1) and is connectable to the printed circuit board (1) via first connectors (6) positioned on the filter device (2) and second connectors (7) correspondingly positioned onto the printed circuit board (2).
摘要翻译：本发明涉及一种用于印刷电路板（1）的过滤装置（2），其中过滤器装置（1）包括被选择的导电材料图案（8），其布置成电磁耦合到导电平面（5b）印刷电路板。本发明的特征在于，过滤器装置（2）是与印刷电路板（1）分离的单元，可通过位于过滤装置（2）上的第一连接器（6）与印刷电路板（1）连接，第二连接器（7）相应地定位在印刷电路板（2）上。

8. 发明申请

WO2008044974A1 SURFACE MOUNTED BUS BAR 审中-公开
标题翻译：表面安装总线条
公开(公告)号：WO2008044974A1
公开(公告)日：2008-04-17
申请号：PCT/SE2006/050395
申请日：2006-10-11
申请人： TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) , LIGANDER, Per
发明人： LIGANDER, Per
IPC分类号： H05K1/14
CPC分类号： H05K1/0263 , H05K1/181 , H05K2201/09636 , H05K2201/10272 , H05K2201/10545 , H05K2201/10689
摘要： The invention refers to a power distribution device (12) for a circuit board arrangement (2) comprising a number of electronic devices (IC1-IC7) and wherein the power distribution device (12) comprises a voltage layer (15). The invention is characterized in that the power distribution device (12) forms a separate unit attachable to at least a major part of the electronic devices (IC1-IC7) and that the extension of the power distribution device (12) is customized dependent on the positions of the electronic devices (IC1-IC7) so that the power distribution device (17) distributes power to the at least a major part of the electronic devices (IC1-IC7) when being attached to the electronic devices (IC1-IC7).
摘要翻译：本发明涉及一种用于包括多个电子设备（IC1-IC7）的电路板装置（2）的配电装置（12），其中配电装置（12）包括电压层（15）。本发明的特征在于，配电装置（12）形成可附接到电子装置（IC1-IC7）的至少主要部分的分离单元，并且配电装置（12）的延伸根据电子设备（IC1-IC7）的位置，使得配电装置（17）在附接到电子设备（IC1-IC7）时将电力分配给至少大部分电子设备（IC1-IC7）。

9. 发明申请

WO2007125094A1 A MICROWAVE CHIP SUPPORTING STRUCTURE 审中-公开
标题翻译： MICROWAVE芯片支持结构
公开(公告)号：WO2007125094A1
公开(公告)日：2007-11-08
申请号：PCT/EP2007/054145
申请日：2007-04-27
申请人： TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) , LIGANDER, Per
发明人： LIGANDER, Per
IPC分类号： H01L23/31
CPC分类号： H01L23/24 , H01L23/057 , H01L23/5385 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/16152 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H05K1/0243 , H05K1/183 , H05K2201/10727 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： The present invention relates to a microwave chip supporting structure (1, 1 ', 1 ", 1 '") comprising a first microwave laminate layer (2, 49), with a first side (3, 50) and a second side (4, 51), and an outer limit (6, 7, 8, 9; 53, 54, 55, 56). At least one conductor (21, 22, 23, 24, 25, 26; 60, 61, 62, 63, 64, 65) is formed on said first side (3, 50), extending towards said outer limit (6, 7, 8, 9; 53,54, 55, 56). The microwave chip supporting structure (1, 1 ', 1 ", 1 '") further comprises a second microwave laminate layer (33, 33'; 57), with a first side (34, 58) and a second side (35, 59), the second side (35, 59) of the second laminate layer (33, 33', 57) being fixed to at least a part of the first side (3, 50) of the first laminate layer (2, 49). The first laminate layer (2, 49) and/or the second laminate layer (33, 33'; 57) comprises at least one recess (10, 36, 66) arranged for receiving a microwave chip (11, 67) intended to be connected to said conductor (21, 22, 23, 24, 25, 26; 60, 61, 62, 63, 64, 65). The second laminate layer (33, 57) extends outside the outer limit (6, 7, 8, 9; 53, 54, 55, 56) of the first laminate layer (2, 49), said conductors (21, 22, 23, 24, 25, 26; 60, 61, 62, 63, 64, 65) continuing on the second side (35, 59) of the second laminate layer (33, 57) without contacting the first laminate layer (2,49).
摘要翻译：本发明涉及一种包括第一微波层压层（2,49）的微波芯片支撑结构（1,1'，1“，1”），其具有第一侧（3,50）和第二侧（4 ，51）和外界限（6,7,8,9; 53,54,55,56）。至少一个导体（21,22,23,24,25,26; 60,61,62,63,64,65）形成在所述第一侧（3,50）上，朝向所述外限（6,7）延伸，8,9; 53,54,55,56）。微波芯片支撑结构（1,1'，1“，1”“）还包括具有第一侧面（34,58）和第二侧面（35）的第二微波层压层（33,33'; 57） 59），第二层叠层（33,33'，57）的第二侧（35,59）固定在第一层叠层（2,49）的第一侧（3,50）的至少一部分上，。第一层压层（2,49）和/或第二层压层（33,33'; 57）包括至少一个凹槽（10,36,66），其设置成用于容纳旨在接收的微波芯片（11,67）连接到所述导体（21,22,23,24,25,26; 60,61,62,63,64,65）。第二层压层（33,57）延伸到第一层压层（2,49）的外部极限（6,7,8,9,53,54,55,56）之外，所述导体（21,22,23 ，第二层叠层（33,57）的第二侧（35,59）上不与第一层叠层（2,49）接触的第二侧面（24,25,26; 60,61,62,63,64,65）。

10. 发明申请

WO2007124769A1 A MICROWAVE CHIP SUPPORTING STRUCTURE 审中-公开
标题翻译： MICROWAVE芯片支持结构
公开(公告)号：WO2007124769A1
公开(公告)日：2007-11-08
申请号：PCT/EP2006/003997
申请日：2006-04-28
申请人： TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) , LIGANDER, Per
发明人： LIGANDER, Per
IPC分类号： H01L23/31
CPC分类号： H01L23/24 , H01L23/057 , H01L23/5385 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/16152 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H05K1/0243 , H05K1/183 , H05K2201/10727 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： The present invention relates to a microwave chip supporting structure (1, 1', 1'') comprising a first microwave laminate layer (2, 49), with a first side (3, 50) and a second side (4, 51), and an outer limit (6, 7, 8, 9; 53, 54, 55, 56). At least one conductor (21, 22, 23, 24, 25, 26; 60, 61, 62, 63, 64, 65) is formed on said first side (3, 50), extending towards said outer limit (6, 7, 8, 9; 53, 54, 55, 56). The microwave chip supporting structure (1, 1', 1'') further comprises a second microwave laminate layer (33, 33'; 57), with a first side (34, 58) and a second side (35, 59), the second side (35, 59) of the second laminate layer (33, 33', 57) being fixed to at least a part of the first side (3, 50) of the first laminate layer (2, 49). The first laminate layer (2, 49) and/or the second laminate layer (33, 33'; 57) comprises at least one recess (10, 36, 66) arranged for receiving a microwave chip (11, 67) intended to be connected to said conductor (21, 22, 23, 24, 25, 26; 60, 61, 62, 63, 64, 65). The second laminate layer (33, 57) extends outside the outer limit (6, 7, 8, 9; 53, 54, 55, 56) of the first laminate layer (2, 49), said conductors (21, 22, 23, 24, 25, 26; 60, 61, 62, 63, 64, 65) continuing on the second side (35, 59) of the second laminate layer (33, 57) without contacting the first laminate layer (2, 49).
摘要翻译：本发明涉及一种包括第一微波层压层（2,49）的微波芯片支撑结构（1,1'，1“），其具有第一侧（3,50）和第二侧（4,51），外限（6,7,8,9; 53,54,55,56）。至少一个导体（21,22,23,24,25,26; 60,61,62,63,64,65）形成在所述第一侧（3,50）上，朝向所述外限（6,7）延伸，8,9; 53,54,55,56）。微波芯片支撑结构（1,1'，1“）还包括具有第一侧（34,58）和第二侧（35,59）的第二微波层压层（33,33'; 57）第二层叠层（33,33'，57）的第二面（35,59）固定在第一层叠层（2,49）的第一面（3,50）的至少一部分上。第一层压层（2,49）和/或第二层压层（33,33'; 57）包括至少一个凹槽（10,36,66），其设置成用于容纳旨在接收的微波芯片（11,67）连接到所述导体（21,22,23,24,25,26; 60,61,62,63,64,65）。第二层压层（33,57）延伸到第一层压层（2,49）的外部极限（6,7,8,9,53,54,55,56）之外，所述导体（21,22,23 ，第二层叠层（33,57）的第二侧（35,59）上不与第一层压层（2,49）接触的第二侧面（24,25,26; 60,61,62,63,64,65）。

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