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1. 发明申请

WO1998024057A1 CONTACTLESS CHIP CARD 审中-公开
标题翻译：无缝芯片卡
公开(公告)号：WO1998024057A1
公开(公告)日：1998-06-04
申请号：PCT/FR1997002100
申请日：1997-11-20
申请人： SOLAIC , THEVENOT, Benoît , BILLEBAUD, Pascal
发明人： SOLAIC
IPC分类号： G06K19/077
CPC分类号： G06K19/0775 , G06K19/077 , G06K19/07749 , G06K19/07779 , G06K19/07783 , H01L2924/0002 , H01L2924/00
摘要： The invention concerns a contactless chip card, comprising a card body (1), an integrated circuit (3) set in said body, and a coupling antenna (4) connected to two contact blocks (6) of the integrated circuit (3). The antenna (4) is made in a spiral pattern the spires of which pass over the flush surface (5) of the integrated circuit (3).
摘要翻译：本发明涉及一种非接触式芯片卡，包括卡体（1），集成电路（3）和所述集成电路（3）的两个接触块（6）连接的耦合天线（4）。天线（4）制成螺旋图案，其尖端通过集成电路（3）的齐平表面（5）。

2. 发明申请

WO1998006063A1 INTEGRATED CIRCUIT CARD WITH TWO CONNECTION MODES 审中-公开
标题翻译：具有两个连接模式的集成电路卡
公开(公告)号：WO1998006063A1
公开(公告)日：1998-02-12
申请号：PCT/FR1997001434
申请日：1997-07-31
申请人： SOLAIC , THEVENOT, Benoît , BILLEBAUD, Pascal , BITSCHNAU, Thierry , FLETOUT, Christophe
发明人： SOLAIC
IPC分类号： G06K19/077
CPC分类号： G06K19/07769 , G06K19/07749 , G06K19/0775 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49109 , H01L2924/01087 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit card with two connection modes, comprising a card body containing an embedded circuit for connection to a contactless coupling member (1) to enable connection thereof to a module including an integrated circuit (6) connected to conductive pads (18). The connection circuit lies directly beneath the conductive pads (18) and is connected thereto via a conductive member (10, 11) extending through the card body.
摘要翻译：一种具有两种连接模式的集成电路卡，包括卡体，该卡体包含用于连接到非接触耦合构件（1）的嵌入式电路，以使得能够连接到包括连接到导电焊盘（18）的集成电路（6）的模块。连接电路直接位于导电焊盘（18）的正下方，并通过延伸穿过卡体的导电部件（10,11）与其连接。

3. 发明申请

WO1997048074A1 MEMORY CARD AND METHOD FOR PRODUCING SAME 审中-公开
标题翻译：记忆卡及其制造方法
公开(公告)号：WO1997048074A1
公开(公告)日：1997-12-18
申请号：PCT/FR1997000995
申请日：1997-06-05
申请人： SOLAIC , BILLEBAUD, Pascal
发明人： SOLAIC
IPC分类号： G06K19/077
CPC分类号： G06K19/07728 , G06K19/077 , H01L24/19 , H01L24/82 , H01L2224/04105 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/01061 , H01L2924/01082 , H01L2924/01084 , H01L2924/01087 , H01L2924/14 , Y10T428/24802
摘要： The invention discloses a memory card, comprising a card body (1) in one surface of which is mounted an integrated circuit (2), with on this surface a conductor pattern (3) constituted by a plurality of conducting zones (4) and associated conducting lines (5). A reinforcing element (10), arranged in the shape of a closed ring, is located in the thickness of the card body (1), opposite the integrated circuit (2) zone, so as to locally stiffen the card zone which bears the integrated circuit.
摘要翻译：本发明公开了一种存储卡，包括卡体（1），其一个表面安装有集成电路（2），在该表面上由多个导电区（4）构成的导体图案（3）导线（5）。位于卡体（1）的与集成电路（2）区相对的厚度上的，以闭环形状设置的加强元件（10），以局部加强卡片区域电路。

4. 发明申请

WO1997042657A1 ELECTRIC COMPONENT IN INTEGRATED CIRCUIT FORM FOR HOT INSERTION IN A SUBSTRATE AND METHODS FOR MANUFACTURING SAME 审中-公开
标题翻译：用于基板中热插入的集成电路中的电气部件及其制造方法
公开(公告)号：WO1997042657A1
公开(公告)日：1997-11-13
申请号：PCT/FR1997000789
申请日：1997-05-05
申请人： SOLAIC , BILLEBAUD, Pascal , THEVENOT, Benoît
发明人： SOLAIC
IPC分类号： H01L23/495
CPC分类号： H01L24/83 , H01L23/49513 , H01L24/31 , H01L2224/274 , H01L2224/83191 , H01L2224/83855 , H01L2224/8388 , H01L2924/01005 , H01L2924/01006 , H01L2924/01058 , H01L2924/01063 , H01L2924/01079 , H01L2924/01094 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/15165
摘要： The invention discloses an electronic component in the form of a circuit (10, 13) on a chip (1), comprising at least on its inactive surface (4) a thermoplastic or thermosetting heat-reactivatable adhesive coating (5).
摘要翻译：本发明公开了一种在芯片（1）上形成电路（10,13）形式的电子部件，至少在其非活性表面（4）上包括热塑性或热固性热可再生粘合剂涂层（5）。

5. 发明申请

WO1997000497A1 SMART CARD HAVING A TRANSLATABLE SWITCH 审中-公开
标题翻译：具有可转换开关的智能卡
公开(公告)号：WO1997000497A1
公开(公告)日：1997-01-03
申请号：PCT/FR1996000900
申请日：1996-06-13
申请人： SOLAIC
发明人： SOLAIC , LARCHEVESQUE, Alain
IPC分类号： G06K19/077
CPC分类号： G06K19/077 , G06K19/07345 , H01H2231/05
摘要： A smart card comprising a card body (1) with a printed circuit (2) having two electrodes (2a, 2b) spaced apart at the bottom (5) of a recess (4) provided in the card body and having two parallel side surfaces (6), a switch (8) movably arranged in the recess in a direction parallel to the side surfaces thereof between an operative position in which it electrically connects the two electrodes, and an inoperative position in which the two electrodes are mutually electrically disconnected, as well as complementary abutment means (12, 11) protected by the recess and the switch. Said complementary abutment means include two notches (12) in one of the two side surfaces (6) of the recess (4), and a projection (11) provided on the switch (8) for engaging the notches (12) when said switch is moved into the operative and inoperative positions.
摘要翻译：一种智能卡，包括具有印刷电路（2）的卡体（1），所述印刷电路具有设置在卡体内的凹部（4）的底部（5）间隔开的两个电极（2a，2b），并具有两个平行的侧面（6），在与所述凹部电连接的操作位置和所述两个电极相互电断开的不工作位置之间，在与所述凹部中的与所述侧面平行的方向上可移动地配置的开关（8）以及由凹部和开关保护的互补的抵靠装置（12,11）。所述互补的邻接装置包括在凹部（4）的两个侧表面（6）中的一个中的两个凹口（12）和设置在开关（8）上用于接合凹口（12）的突起（11），当所述开关被移动到手术和非手术位置。

6. 发明申请

WO1996027855A1 PROCESS FOR ATTACHING A MODULE TO A CARD BODY, AND ELECTRONIC CARD COMPRISING A MODULE 审中-公开
标题翻译：连接卡片模块的程序和包含模块的电子卡
公开(公告)号：WO1996027855A1
公开(公告)日：1996-09-12
申请号：PCT/FR1996000136
申请日：1996-01-26
申请人： SOLAIC
发明人： SOLAIC , VERE, Denis
IPC分类号： G06K19/077
CPC分类号： G06K19/07747 , G06K19/07745 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to an electronic card comprising a card body (1) made of a first plastic material as well as a module (9) comprising a microcircuit (11) and made at least partially of a second plastic material, and a film (2) made of a third plastic material is fixed to the card body (1) and comprises a cavity (6) having a bearing surface (7) to which is fixed a module portion (10) made of the second plastic material.
摘要翻译：本发明涉及一种电子卡，其包括由第一塑料材料制成的卡体（1）以及包括微电路（11）并且至少部分地由第二塑料材料制成的模块（9），以及膜（2））固定在所述卡体（1）上并且包括具有支承表面（7）的空腔（6），固定有由所述第二塑料材料制成的模块部分（10）。

7. 发明申请

WO1997018531A1 INTEGRATED CIRCUIT CARD AND INTEGRATED CIRCUIT MODULE 审中-公开
标题翻译：集成电路卡和集成电路模块
公开(公告)号：WO1997018531A1
公开(公告)日：1997-05-22
申请号：PCT/FR1996000031
申请日：1996-01-09
申请人： SOLAIC
发明人： SOLAIC , GAUMET, Michel , GOUILLER, Michel , THEVENOT, Benoît , AUDOUX, Jean-Noël , LARCHEVESQUE, Alain , HERISSON-GARIN, Jean
IPC分类号： G06K19/077
CPC分类号： G06K19/07728 , G06K19/07745 , H01L24/19 , H01L2924/14 , H01L2924/00
摘要： A card comprising an ultra-thin integrated circuit (10) having a thickness of no more than 120 mu m, and preferably lying in a plane corresponding to the neutral axis (LN) of the board.
摘要翻译：一种卡，包括厚度不超过120μm的超薄集成电路（10），并且优选地位于对应于电路板的中性轴线（LN）的平面中。

8. 发明申请

WO1997042656A1 INTEGRATED CIRCUIT COMPRISING CONNECTION PADS EMERGING ON ONE SURFACE 审中-公开
标题翻译：集成电路，包括连接垫在一个表面上的启动
公开(公告)号：WO1997042656A1
公开(公告)日：1997-11-13
申请号：PCT/FR1997000790
申请日：1997-05-05
申请人： SOLAIC , AUDOUX, Jean-Noël , THEVENOT, Benoît
发明人： SOLAIC
IPC分类号： H01L23/485
CPC分类号： H01L24/02 , H01L2924/01014 , H01L2924/01033 , H01L2924/01058 , H01L2924/014 , H01L2924/14
摘要： The printed circuit comprises connection pads emerging on a surface of the integrated circuit, which is coated with a first insulating layer (5) comprising apertures opposite the connection pads, at least one conductive track (7) extending from the first insulating layer and having one end connected to one of the integrated circuit connection pads, a second insulating layer (8) covering the first insulating layer and comprising apertures (9) opposite each conductive track (7) of the first layer and opposite the connection pads not connected to a track (7), and at least one repositioning track (10) extending on the second insulating layer (8) and having one end connected to a track (7) of the first insulating layer.
摘要翻译：印刷电路包括出现在集成电路的表面上的连接焊盘，其被涂覆有包括与连接焊盘相对的孔的第一绝缘层（5），至少一个导电轨道（7），其从第一绝缘层延伸并具有一个端部连接到所述集成电路连接焊盘中的一个，覆盖所述第一绝缘层的第二绝缘层（8），并且包括与所述第一层的每个导电轨道（7）相对并且与未连接到轨道的连接焊盘相对的孔（7），以及至少一个在所述第二绝缘层（8）上延伸并具有连接到所述第一绝缘层的轨道（7）的端部的重新定位轨道（10）。

9. 发明申请

WO1996042109A1 SMART CARD CHIP COATED WITH A LAYER OF INSULATING MATERIAL, AND SMART CARD COMPRISING SAME 审中-公开
标题翻译：用一层绝缘材料包裹的智能卡芯片，以及包含相同的智能卡
公开(公告)号：WO1996042109A1
公开(公告)日：1996-12-27
申请号：PCT/FR1996000030
申请日：1996-01-09
申请人： SOLAIC
发明人： SOLAIC , BITSCHNAU, Thierry , THEVENOT, Benoît
IPC分类号： H01L23/498
CPC分类号： H01L23/3171 , G06K19/07743 , G06K19/07745 , H01L23/49855 , H01L2224/24225 , H01L2224/274 , H01L2924/01079
摘要： A smart card chip including a semiconductor chip (4) with an operative side provided with contact pads (5) and projections (6) of varying heights. The operative side of the chip (4) is at least partially coated with a layer of insulating material (7) that is at least as thick as the height of the tallest projection (6), said layer being shaped in such a way that the contact pads (5) are freely accessible, and having an outer surface parallel to the periphery (12) of the operative side of the chip (4). Said layer (7) enables the chip to be mounted in a card body while remaining perfectly parallel thereto, this being necessary to enable conductive pattern screen printing at a later stage.
摘要翻译：一种包括半导体芯片（4）的智能卡芯片，其操作侧设置有不同高度的接触焊盘（5）和突起（6）。芯片（4）的操作侧至少部分地涂覆有至少与最高突起（6）的高度一样厚的绝缘材料层（7），所述层被成形为使得接触焊盘（5）可自由接近，并且具有平行于芯片（4）的操作侧的外围（12）的外表面。所述层（7）使得芯片能够安装在卡体中，同时保持与其完全平行，这是为了在稍后阶段实现导电图案丝网印刷所必需的。

10. 发明申请

WO1996013041A1 ELECTRICALLY CONDUCTING INK WITH METAL GRAINS OF DIFFERENT MELTING POINTS 审中-公开
标题翻译：具有不同熔点的金属颗粒导电墨水
公开(公告)号：WO1996013041A1
公开(公告)日：1996-05-02
申请号：PCT/FR1995001365
申请日：1995-10-17
申请人： SOLAIC
发明人： SOLAIC , GAUMET, Michel
IPC分类号： H01B01/22
CPC分类号： H01B1/22 , H05K1/095 , Y10T428/12028 , Y10T428/12167
摘要： Conducting ink in which first and second metal grains are inserted in an organic material to form a conducting line, the second metal grains (4) being interspersed among the first metal grains (2). The melting temperature of the second metal grains (4) is in the range of the melting temperature of the first metal grains (2) and the hardening temperature of the organic matter.
摘要翻译：将第一和第二金属颗粒插入有机材料中以形成导电线的导电油墨，第二金属颗粒（4）散布在第一金属颗粒（2）中。第二金属颗粒（4）的熔融温度在第一金属颗粒（2）的熔融温度和有机物的硬化温度的范围内。

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