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1. 发明申请

WO2012012206A3 SELF COMPENSATED DIRECTIONAL COUPLER 审中-公开
公开(公告)号：WO2012012206A3
公开(公告)日：2012-01-26
申请号：PCT/US2011/043291
申请日：2011-07-08
申请人： SKYWORKS SOLUTIONS, INC. , HOANG, Dinhphuoc, V. , ZHANG, Guohao , AGARWAL, Anil, K.
发明人： HOANG, Dinhphuoc, V. , ZHANG, Guohao , AGARWAL, Anil, K.
IPC分类号： H01P5/18
摘要： A self-compensated strip-coupled directional coupler. In one example, the self-compensated directional coupler includes a main arm formed in a single first layer of a multi-layer substrate, and a coupled arm formed in a single second layer of the multi-layer substrate. One of the coupled arm and the main arm includes a zigzag structure to compensate for misalignment between the first and second layers that can occur during manufacturing.

2. 发明申请

WO2008018959A2 OVERMOLDED SEMICONDUCTOR PACKAGE WITH A WIREBOND CAGE FOR EMI SHIELDING 审中-公开
标题翻译：带有用于EMI屏蔽的线束的超模半导体封装
公开(公告)号：WO2008018959A2
公开(公告)日：2008-02-14
申请号：PCT/US2007/015284
申请日：2007-07-09
申请人： SKYWORKS SOLUTIONS, INC. , HOANG, Dinhphuoc, V. , NOLL, Thomas, E. , AGARWAL, Anil, K. , WARREN, Robert, W. , READ, Matthew, S. , LOBIANCO, Anthony
发明人： HOANG, Dinhphuoc, V. , NOLL, Thomas, E. , AGARWAL, Anil, K. , WARREN, Robert, W. , READ, Matthew, S. , LOBIANCO, Anthony
IPC分类号： H01L23/49
CPC分类号： H01L23/552 , H01L21/4853 , H01L21/52 , H01L21/56 , H01L23/3121 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/181 , H01L2924/19042 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , Y10T29/49126 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： According to one exemplary embodiment, an overmolded package (100,300) includes a component (102,302) situated on a substrate (114,314). The overmolded package further includes an overmold ( 116,316) situated over the component and the substrate. The overmolded package further includes a wirebond cage (106,306) situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds (110a,l 10b,310a,310b). The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer (108,308) situated on a top surface (118,318) of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
摘要翻译：根据一个示例性实施例，包覆成型的封装（100,300）包括位于衬底（114,314）上的部件（102,302）。包覆成型的包装进一步包括位于组件和衬底之上的包覆模制（116,316）。包覆成型的封装还包括位于衬底上方和覆盖模制体中的引线键合笼（106,306），其中引线键合框围绕组件，并且其中引线键合框架包括多个引线键（110a，10b，310a，310b）。引线键盘在组件周围形成EMI屏蔽。根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面（118,318）上并连接到引线键合框架的导电层（108,308），其中导电层在部件上形成EMI屏蔽。

3. 发明申请

WO2013009637A3 RADIO-FREQUENCY MODULES HAVING TUNED SHIELDING-WIREBONDS 审中-公开
公开(公告)号：WO2013009637A3
公开(公告)日：2013-01-17
申请号：PCT/US2012/045806
申请日：2012-07-06
申请人： SKYWORKS SOLUTIONS, INC. , AGARWAL, Anil, K. , VU HOANG, Dinhphuoc , CHEN, Howard, E. , LOBIANCO, Anthony, James , READ, Matthew, Sean , NGUYEN, Hoang, Mong , ZHANG, Guohao
发明人： AGARWAL, Anil, K. , VU HOANG, Dinhphuoc , CHEN, Howard, E. , LOBIANCO, Anthony, James , READ, Matthew, Sean , NGUYEN, Hoang, Mong , ZHANG, Guohao
IPC分类号： H04B1/00 , H05K9/00
摘要： Disclosed are devices and methods related to radio-frequency (RF) shielding of RF modules. In some embodiments, tuned shielding can be achieved by utilizing different structures and/or arrangements of shielding- wirebonds to increase shielding in areas where needed, and to decrease shielding where not needed. Such tuning of shielding requirements can be obtained by measuring RF power levels at different locations of a module having a given design. Such tuned RF shielding configurations can improve the overall effectiveness of shielding, and can also be more cost effective to implement.

4. 发明申请

WO2009002381A2 MOLD COMPOUND CIRCUIT STRUCTURE FOR ENHANCED ELECTRICAL AND THERMAL PERFORMANCE 审中-公开
标题翻译：用于增强电气和热性能的模具化合物电路结构
公开(公告)号：WO2009002381A2
公开(公告)日：2008-12-31
申请号：PCT/US2008/006063
申请日：2008-05-12
申请人： SKYWORKS SOLUTIONS, INC. , KUHLMAN, Mark, A. , AGARWAL, Anil, K.
发明人： KUHLMAN, Mark, A. , AGARWAL, Anil, K.
IPC分类号： H01L23/36
CPC分类号： H01L23/3121 , H01L23/3677 , H01L23/4334 , H01L23/49822 , H01L23/5389 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/82 , H01L24/91 , H01L25/0655 , H01L25/105 , H01L25/165 , H01L2224/24226 , H01L2224/451 , H01L2224/48091 , H01L2224/4813 , H01L2224/48227 , H01L2224/92 , H01L2224/92247 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H05K1/0206 , H05K1/16 , H05K1/185 , H05K1/186 , H05K3/361 , H05K3/4046 , H05K3/4644 , H05K2201/10287 , H05K2203/1316 , H01L2224/83 , H01L2224/85 , H01L2224/82 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： According to an exemplary embodiment, an overmolded semiconductor package includes at least one semiconductor die situated over a package substrate. The overmolded semiconductor package further includes a mold compound overlying the at least one semiconductor die and the package substrate and having a top surface. The overmolded semiconductor package further includes a first patterned conductive layer situated on the top surface of the mold compound. The overmolded semiconductor package can further include at least one conductive interconnect situated in the mold compound, where the at least one conductive interconnect is electrically connected to the first patterned conductive layer. The first patterned conductive layer can include at least one passive component.
摘要翻译：根据示例性实施例，包覆成型的半导体封装包括位于封装衬底上的至少一个半导体管芯。包覆模制的半导体封装还包括覆盖至少一个半导体管芯和封装衬底并具有顶表面的模制化合物。包覆成型的半导体封装还包括位于模具化合物的顶表面上的第一图案化导电层。包覆模制的半导体封装还可以包括位于模具化合物中的至少一个导电互连，其中至少一个导电互连电连接到第一图案化导电层。第一图案化导电层可以包括至少一个无源部件。

5. 发明申请

WO2002084476A1 METHOD FOR DYNAMIC LOAD MANAGEMENT OF RANDOM ACCESS SHARED COMMUNICATIONS CHANNELS 审中-公开
标题翻译：随机访问共享通信的动态负载管理方法
公开(公告)号：WO2002084476A1
公开(公告)日：2002-10-24
申请号：PCT/US2002/008255
申请日：2002-04-11
申请人： COMSAT CORPORATION , AGARWAL, Anil, K.
发明人： AGARWAL, Anil, K.
IPC分类号： G06F9/00
CPC分类号： H04B7/18582 , H04B7/18513 , H04B7/2043 , H04W28/12 , H04W74/08 , H04W74/0866 , H04W84/06
摘要： A novel method for dynamic load management of random access channels (also known as Aloha channels) in shared communications systems, such as satellite (4), cable, and wireless communications networks is provided. The method provides algorithms and procedures to accurately estimate traffic load offered by multiple distributed terminals (1a, 1b, ... 1n) into the channel (2). And also provides for regulating traffic so that the channel (2) is not overloaded. The traffic load management algorithms can be done at a central site, such as a Network Control Center (3) or a cable head-end. Alternatively, traffic load management can be done in a distributed manner by all terminals. Traffic regulation is done in a fair manner across all terminals. The algorithms are designed for efficient implementation in software and/or hardware.
摘要翻译：提供了一种用于共享通信系统（如卫星（4），有线和无线通信网络）中的随机接入信道（也称为Aloha信道）的动态负载管理的新颖方法。该方法提供了将多个分布式终端（1a，1b，... 1n）提供的通信负载精确估计到信道（2）中的算法和过程。并且还提供调节流量，使得通道（2）不会过载。业务负载管理算法可以在中心站点进行，如网络控制中心（3）或电缆头端。或者，业务负载管理可以由所有终端以分布式方式进行。交通管制在所有终端上以公平的方式进行。这些算法设计用于在软件和/或硬件中高效实现。

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