会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明申请
    • METHOD FOR FORMING THERMAL INKJET PRINTHEAD, THERMAL INKJET PRINTHEAD, AND SEMICONDUCTOR WAFER
    • 形成热喷墨打印头,热喷墨打印头和半导体晶片的方法
    • WO2018072822A1
    • 2018-04-26
    • PCT/EP2016/075108
    • 2016-10-19
    • SICPA HOLDING SA
    • SCHINA, PaoloBALDI, SilviaDISEGNA, IrmaPERINI, Miriam
    • B41J2/14
    • The present invention provides a method for forming a thermal inkjet printhead, comprising at least the following steps: providing a semiconductor wafer including an integrated electronic circuit and a section for forming a thermal actuator element, the integrated circuit comprising at least: a thermal insulating layer formed over a substrate; and a first metal layer formed over the thermal insulating layer; wherein the first metal layer extends into the section for forming the thermal actuator element; and etching a section for forming a thermal actuator element to the first metal layer such that the first metal layer is acting as an etch stop layer. Further there is provided a thermal inkjet printhead formed by a method of the present invention and a semiconductor wafer for forming the thermal inkjet printheads by a method of the present invention.
    • 本发明提供了一种用于形成热喷墨打印头的方法,该方法至少包括以下步骤:提供包括集成电子电路和用于形成热致动器元件的部分的半导体晶片,集成电路 至少包括:在衬底上形成的绝热层; 以及形成在绝热层上的第一金属层; 其中第一金属层延伸到用于形成热致动器元件的部分中; 以及将用于形成热致动器元件的部分蚀刻到第一金属层,使得第一金属层充当蚀刻停止层。 此外,提供了通过本发明的方法形成的热喷墨打印头和用于通过本发明的方法形成热喷墨打印头的半导体晶片。
    • 4. 发明申请
    • METHOD OF MANUFACTURING AN INK-JET PRINTHEAD
    • 制造喷墨打印机的方法
    • WO2016150715A1
    • 2016-09-29
    • PCT/EP2016/055126
    • 2016-03-10
    • SICPA HOLDING SA
    • GIOVANOLA, LuciaBALDI, SilviaMERIALDO, AnnaSCHINA, Paolo
    • B41J2/14B41J2/16
    • B41J2/1433B41J2/162B41J2/1623B41J2/1628B41J2/1629B41J2/1631B41J2/1632
    • The present application relates to a method of manufacturing an ink-jet printhead comprising: providing a silicon substrate (10) including active ejecting elements (11); providing a hydraulic structure layer (20) for defining hydraulic circuits configured to enable a guided flow of ink; providing a silicon orifice plate (30) having a plurality of nozzles (31) for ejection of the ink; assembling the silicon substrate (10) with the hydraulic structure layer (20) and the silicon orifice plate (30); wherein providing the silicon orifice plate (30) comprises: providing a silicon wafer (40) having a planar extension delimited by a first surface (41) and a second surface (42) on opposite sides of the silicon wafer (40); performing a thinning step at the second surface (42) so as to remove from the second surface (42) a central portion (43) having a preset height (H), the silicon wafer (40) being formed, following the thinning step, by a base portion (44) having a planar extension and a peripheral portion (45) extending from the base portion (44), transversally with respect to the planar extension of the base portion (44); and forming in the silicon wafer (40) a plurality of through holes, each defining a respective nozzle (31) for ejection of the ink. The method according to the present invention is characterized in that the silicon wafer (40) is a silicon-on-insulator wafer, wherein the silicon-on- insulator wafer comprises a silicon device layer (38) adjacent to the first surface (41), a silicon handle layer (37) adjacent to the second surface (42) and an insulator layer (39) in- between.
    • 本申请涉及一种制造喷墨打印头的方法,包括:提供包括有效喷射元件(11)的硅基板(10); 提供用于限定液压回路的液压结构层(20),所述液压回路构造成能够引导油墨流动; 提供具有用于喷射墨水的多个喷嘴(31)的硅孔板(30); 用液压结构层(20)和硅孔板(30)组装硅衬底(10); 其中提供硅孔板(30)包括:提供具有由第一表面(41)限定的平面延伸的硅晶片(40)和在硅晶片(40)的相对侧上的第二表面(42); 在所述第二表面(42)处进行变薄步骤,以便从所述第二表面(42)移除具有预设高度(H)的中心部分(43),所述硅晶片(40)在所述变薄步骤之后形成, 通过具有平面延伸部的基部(44)和从基部(44)延伸的周边部分(45),相对于基部(44)的平面延伸部横向延伸; 以及在硅晶片(40)中形成多个通孔,每个通孔限定用于喷射墨水的相应喷嘴(31)。 根据本发明的方法的特征在于,硅晶片(40)是绝缘体上硅晶片,其中绝缘体上硅晶片包括与第一表面(41)相邻的硅器件层(38) ,与第二表面(42)相邻的硅手柄层(37)和介于其间的绝缘体层(39)。