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2. 发明申请

WO2016166751A1 PRINTING OF MULTI-LAYER CIRCUITS 审中-公开
标题翻译：打印多层电路
公开(公告)号：WO2016166751A1
公开(公告)日：2016-10-20
申请号：PCT/IL2016/050382
申请日：2016-04-12
申请人： PRINTCB LTD.
发明人： KARNI, Yiftah , DAREN, Steve
IPC分类号： H05K3/46 , H05K1/09 , H05K3/40 , H01B1/22 , H01L23/498 , H01L23/532
CPC分类号： H01L21/4867 , H01B1/20 , H01B1/22 , H01L23/488 , H01L23/49883 , H05K1/097 , H05K3/1283 , H05K3/4664 , H05K3/4673 , H05K3/4679 , H05K3/4682 , H05K2201/0272 , H05K2203/0126
摘要： A sheet-fed system designed to print multilayer PCBs is introduced. The system consists of four main blocks; a drilling station, a patterning station, a stacking/bonding station, and a sintering zone. The substrate PCB is shuttled between these various stations, to have vias drilled, to be attached to stacks of previously-processed layers, to be covered with conductive paths by means of the aforementioned ink, and to have the ink sintered under a controlled temperature and atmosphere. Patterning is accomplished by means of a novel two-step method involving both high-temperature conductive elements, low- temperature conductive elements, and flux. Two such compositions are successively applied and individually sintered to form a single conductive path; the second application serves to fill the porosities of the first layer. By this method, a highly-conductive trace is obtained without requiring high temperatures, which in turn allows use of common substrates including polymers.
摘要翻译：介绍了一种设计用于印刷多层PCB的单张纸系统。该系统由四个主要块组成; 钻孔站，图案化站，堆叠/粘合站以及烧结区。衬底PCB穿梭在这些各个工位之间，以便通过钻孔的通孔被连接到预先处理的层的堆叠上，以便通过上述油墨被导电路径覆盖，并使油墨在受控的温度下烧结，大气层。图案化是通过包括高温导电元件，低温导电元件和焊剂两者的新颖的两步法完成的。连续地施加两种这样的组合物并单独地烧结以形成单个导电路径; 第二个应用程序用于填充第一层的孔隙率。通过这种方法，可以获得高导电性的痕迹，而不需要高温，这又允许使用包括聚合物在内的普通基底。

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