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1. 发明申请

WO2007034352A2 GRID FOR SELECTIVE ABSORPTION OF ELECTROMAGNETIC RADIATION AND METHOD FOR ITS MANUFACTURE 审中-公开
标题翻译：用于选择性吸收电磁辐射的网格及其制造方法
公开(公告)号：WO2007034352A2
公开(公告)日：2007-03-29
申请号：PCT/IB2006/053208
申请日：2006-09-11
申请人： PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH , KONINKLIJKE PHILIPS ELECTRONICS N. V. , DORSCHEID, Ralf , VOGTMEIER, Gereon , STEADMAN, Roger , GROOM, Roy K. , ELGALY, Avner
发明人： DORSCHEID, Ralf , VOGTMEIER, Gereon , STEADMAN, Roger , GROOM, Roy K. , ELGALY, Avner
CPC分类号： G21K1/025 , A61B6/032 , A61B6/037 , A61B6/06 , A61B6/4258 , A61B6/4291
摘要： A Grid (1) for selective absorption of electromagnetic radiation (2, 3), as used e.g. in CT or NM imaging, comprises a block of a rigid foam material (4), where the foam material is essentially transparent to the electromagnetic radiation (2, 3), a first set of radiation absorbing lamellae (5), and a second set of radiation absorbing lamellae (6), the first and the second set of lamellae are arranged in the block of foam material so that a radiation transmission direction (T) is defined, the first set of lamellae and the second set of lamellae being arranged on top of each other with respect to the transmission direction (T). Such a grid arrangement is rigid due to the use of a carrier material, can be manufactured precisely and, furthermore, two-dimensional grids can be manufactured without the need to physically intersect the lamellae.
摘要翻译：用于选择性吸收电磁辐射（2,3）的格栅（1）在CT或NM成像中包括刚性泡沫材料块（4），其中泡沫材料对电磁辐射（2,3）基本上是透明的，第一组辐射吸收薄片（5）和第二组的辐射吸收薄片（6），第一和第二组薄片布置在泡沫材料块中，从而定义辐射透射方向（T），第一组薄片和第二组薄片布置在相对于传输方向（T）彼此相邻。由于使用载体材料，这种格栅布置是刚性的，因此可以精确地制造，此外，可以制造二维格栅，而不需要物理地与薄片相交。

2. 发明申请

WO2007023422A2 INSPECTION METHOD AND INSPECTION DEVICE FOR SUBSTRATES 审中-公开
标题翻译：检测方法和基底检测装置
公开(公告)号：WO2007023422A2
公开(公告)日：2007-03-01
申请号：PCT/IB2006/052825
申请日：2006-08-16
申请人： PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH , KONINKLIJKE PHILIPS ELECTRONICS N. V. , DORSCHEID, Ralf , VOGTMEIER, Gereon , STEADMAN, Roger
发明人： DORSCHEID, Ralf , VOGTMEIER, Gereon , STEADMAN, Roger
CPC分类号： G01R1/0735 , G01R31/2635 , G01R31/2889
摘要： An inspection method for through- wafer interconnects of a through- wafer interconnects substrate (105) the substrate having a front-side and a back-side on which back-side at least one contact (218) is formed, comprises the steps of placing a multi-contact foil (108) on the back-side and contacting the multi-contact foil (108) with a contacting substrate (109). An inspection device (107) for a through-wafer interconnects substrate (105) comprising a multi-contact foil (108) contactable to a through-wafer interconnects substrate (105) and contacted to a contacting substrate (105).
摘要翻译：用于贯穿晶片的贯穿晶片互连的检查方法将衬底（105）与具有正面和背面的衬底互连，在正面和背面上，背面至少一个触点（218）包括在背面放置多接触箔（108）并使多接触箔（108）与接触衬底（109）接触的步骤。一种用于贯穿晶片互连衬底（105）的检查装置（107），包括可与贯穿晶片互连衬底（105）接触并与接触衬底（105）接触的多触点箔片（108）。

3. 发明申请

WO2005096946A1 MODULAR DEVICE FOR THE DETECTION AND/OR TRANSMISSION OF RADIATION 审中-公开
标题翻译：用于检测和/或传输辐射的模块化设备
公开(公告)号：WO2005096946A1
公开(公告)日：2005-10-20
申请号：PCT/IB2005/050971
申请日：2005-03-22
申请人： PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH , KONINKLIJKE PHILIPS ELECTRONICS N. V. , DORSCHEID, Ralf , VOGTMEIER, Gereon , STEADMAN, Roger
发明人： DORSCHEID, Ralf , VOGTMEIER, Gereon , STEADMAN, Roger
IPC分类号： A61B6/03
CPC分类号： G01T1/2018 , A61B6/032 , A61B6/4233 , A61B6/4291 , A61B6/4411
摘要： The invention relates to a device for the detection and/or transmission of radiation, particularly an X-ray detector 1, that consists of a carrier 10 on which an array of detector modules 20 is arranged. The carrier 10 comprises holes 11 through which a ball at the backside of the detector modules 20 can be inserted in order to fix the modules such that they can still rotate to a certain degree. Due to this freedom, the sensor modules 20 can align themselves during assembly.
摘要翻译：本发明涉及一种用于检测和/或传输辐射的装置，特别是一种X射线检测器1，其由载体10组成，其上布置有检测器模块阵列20。载体10包括孔11，通过该孔11可以插入检测器模块20的后侧的球，以便固定模块，使得它们仍然可以一定程度地旋转。由于这种自由度，传感器模块20可以在组装期间自己对准。

4. 发明申请

WO2005052636A1 RADIATION DETECTOR MODULE 审中-公开
标题翻译：辐射探测器模块
公开(公告)号：WO2005052636A1
公开(公告)日：2005-06-09
申请号：PCT/IB2004/052490
申请日：2004-11-19
申请人： PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH , KONINKLIJKE PHILIPS ELECTRONICS N. V. , VOGTMEIER, Gereon , DORSCHEID, Ralf
发明人： VOGTMEIER, Gereon , DORSCHEID, Ralf
IPC分类号： G01T1/20
CPC分类号： A61B6/4233 , G01T1/2018 , G01T1/202 , Y10T29/5313
摘要： The present invention relates to a detector, in which detector modules are two-dimensionally arranged. The problem of the two-dimensional arrangement of detector modules is solved by a base structure (1) with guide elements (2) on which the detector modules (3) with at least one respective guide structure (4), are positioned relative to at least one of the respective guide elements, the guide elements (2) extending in a first direction (R1), at least two of the detector modules (3) being positioned consecutively on one of the guide elements (2) in the first direction (R1), and there are guide elements (2) that are separated from one another in a second direction (R2).
摘要翻译：检测器技术领域本发明涉及检测器，其中检测器模块是二维布置的。检测器模块的二维布置的问题通过具有引导元件（2）的基部结构（1）来解决，其上具有至少一个相应引导结构（4）的检测器模块（3）相对于其定位在其上相应的引导元件中的至少一个，所述引导元件（2）沿第一方向（R1）延伸，所述检测器模块（3）中的至少两个在所述第一方向上连续地定位在所述引导元件（2）中的一个上 R1），并且具有在第二方向（R2）上彼此分离的引导元件（2）。

5. 发明申请

WO2005027143A2 ARRANGEMENT FOR COLLIMATING ELECTROMAGNETIC RADIATION 审中-公开
标题翻译：电磁辐射校正装置
公开(公告)号：WO2005027143A2
公开(公告)日：2005-03-24
申请号：PCT/IB2004/051683
申请日：2004-09-03
申请人： PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH , KONINKLIJKE PHILIPS ELECTRONICS N. V. , VOGTMEIER, Gereon , ECKENBACH, Wolfgang , DORSCHEID, Ralf
发明人： VOGTMEIER, Gereon , ECKENBACH, Wolfgang , DORSCHEID, Ralf
IPC分类号： G21K1/00
CPC分类号： G21K1/02
摘要： The invention relates to an arrangement for collimating electromagnetic radiation, comprising a macrocollimator which has at least two cutouts, and microcollimator structures which are positioned in the cutouts of the macrocollimator and have lamellae that absorb electromagnetic radiation, so that collimator channels are formed which in each case extend such that they are transparent in a transmission direction.
摘要翻译：本发明涉及一种用于准直电磁辐射的装置，其包括具有至少两个切口的宏观准直器和位于大直径光学器件的切口中并具有吸收电磁辐射的薄片的微准直器结构，所以形成准直器通道，其分别延伸以使得它们在传输方向上是透明的。

6. 发明申请

WO2007110799A2 LOW OHMIC THROUGH SUBSTRATE INTERCONNECTION FOR SEMICONDUCTOR CARRIERS 审中-公开
标题翻译：通过半导体载体的基板互连实现低欧姆性
公开(公告)号：WO2007110799A2
公开(公告)日：2007-10-04
申请号：PCT/IB2007/050914
申请日：2007-03-16
申请人： PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH , KONINKLIJKE PHILIPS ELECTRONICS N.V. , VOGTMEIER, Gereon , STEADMAN, Roger , DORSCHEID, Ralf , JONKERS, Jeroen
发明人： VOGTMEIER, Gereon , STEADMAN, Roger , DORSCHEID, Ralf , JONKERS, Jeroen
IPC分类号： H01L23/48
CPC分类号： H01L21/76898 , H01L23/481 , H01L2224/0401 , H01L2224/05 , H01L2224/131 , H01L2924/014
摘要： It is described a low ohmic Through Wafer Interconnection (TWI) for electronic chips formed on a semiconductor substrate (600). The TWI comprises a first connection (610) extending between a front surface and a back surface of the substrate (600). The first connection (610) comprises a through hole filled with a low ohmic material having a specific resistivity lower than poly silicon. The TWI further comprises a second connection (615) also extending between the front surface and the back surface. The second connection (615) is spatially separated from the first connection (610) by at least a portion of the semiconductor substrate (600). The front surface is provided with a integrated circuit arrangement (620) wherein the first connection (610) is electrically coupled to at least one node of the integrated circuit arrangement (620) without penetrating the integrated circuit arrangement (620). During processing the TWI the through hole may be filled first with a non-metallic material, e.g. poly silicon. After forming integrated components (620) on top of the front surface the substrate (600) may be thinned and the non-metallic material may be substituted with the low ohmic material, which is in particular a metallic material.
摘要翻译：描述了形成在半导体衬底（600）上的用于电子芯片的低欧姆直通晶片互连（TWI）。 TWI包括在衬底（600）的前表面和后表面之间延伸的第一连接（610）。第一连接（610）包括填充有比多晶硅电阻率低的低欧姆材料的通孔。 TWI还包括也在前表面和后表面之间延伸的第二连接（615）。第二连接（615）通过半导体衬底（600）的至少一部分与第一连接（610）在空间上分离。前表面设置有集成电路布置（620），其中第一连接（610）电耦合到集成电路布置（620）的至少一个节点而不穿透集成电路布置（620）。在处理TWI期间，通孔可以首先用非金属材料填充，例如，多晶硅。在前表面顶部形成集成组件（620）之后，衬底（600）可以变薄，并且非金属材料可以用特别是金属材料的低欧姆材料替代。

7. 发明申请

WO2007023416A1 ELECTRICALLY SHIELDED THROUGH-WAFER INTERCONNECT 审中-公开
标题翻译：电气屏蔽通过波形互连
公开(公告)号：WO2007023416A1
公开(公告)日：2007-03-01
申请号：PCT/IB2006/052809
申请日：2006-08-15
申请人： PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH , KONINKLIJKE PHILIPS ELECTRONICS N.V. , STEADMAN, Roger , VOGTMEIER, Gereon , DORSCHEID, Ralf
发明人： STEADMAN, Roger , VOGTMEIER, Gereon , DORSCHEID, Ralf
IPC分类号： H01L23/48 , H01L23/60
CPC分类号： H01L23/481 , H01L23/552 , H01L2223/6622 , H01L2224/13 , H01L2224/13025
摘要： Through-Wafer Interconnections allow for the usage of cost-effective substrates for detector chips . According to an exemplary embodiment of the present invention, detecting element for application in an examination apparatus may be provided, comprising a wafer with a sensitive region and a coaxial through-wafer interconnect structure. This may reduce the susceptibility of the interconnection by providing an effective shielding.
摘要翻译：通过晶片互连允许为检测器芯片使用经济高效的基板。根据本发明的示例性实施例，可以提供用于检查装置中的检测元件，其包括具有敏感区域的晶片和同轴贯通晶片互连结构。这可以通过提供有效的屏蔽来降低互连的敏感性。

8. 发明申请

WO2008020363A2 A BED WITH INTEGRATED SENSOR UNIT FOR A PATIENT 审中-公开
标题翻译：具有综合传感器单元的床单
公开(公告)号：WO2008020363A2
公开(公告)日：2008-02-21
申请号：PCT/IB2007/053108
申请日：2007-08-07
申请人： PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH , KONINKLIJKE PHILIPS ELECTRONICS N. V. , BRAUERS, Andreas , DORSCHEID, Ralf , JOHNEN, Frank
发明人： BRAUERS, Andreas , DORSCHEID, Ralf , JOHNEN, Frank
CPC分类号： A61G7/015 , A61B5/11 , A61B5/1102 , A61B5/113 , A61B5/6887 , A61B5/6891 , A61G7/05 , A61G2203/36
摘要： The present invention relates to a bed with an integrated sensor unit for a patient. Furthermore the invention relates to a method of providing a bed with a sensor unit for a patient. In order to provide a simple and reliable technique for monitoring patients a bed is suggested, comprising a bedframe (3) with at least a first and a second bedframe section (1, 2), said bedframe sections (1, 2) being connected to each other by means of at least one hinge (4), the bed further comprising a sensor unit (5, 5'), characterized in that the sensor unit (5, 5') is connected with the pivot (9) of the hinge (4), and is adapted to measure the movement of a bedframe section (1, 2) in a direction (21) substantially perpendicular to the rotary axis (22) of the pivot (9).
摘要翻译：本发明涉及一种具有用于患者的集成传感器单元的床。此外，本发明涉及一种为患者提供具有传感器单元的床的方法。为了提供用于监测患者的简单和可靠的技术，建议床，包括具有至少第一和第二床架部分（1,2）的床架（3），所述床架部分（1,2）连接到通过至少一个铰链（4）彼此相连，所述床还包括传感器单元（5,5'），其特征在于，传感器单元（5,5'）与铰链的枢轴（9）连接（4），并且适于在基本上垂直于枢轴（9）的旋转轴线（22）的方向（21）上测量床架部分（1,2）的运动。

9. 发明申请

WO2010016026A1 GRID AND METHOD OF MANUFACTURING A GRID FOR SELECTIVE TRANSMISSION OF ELECTROMAGNETIC RADIATION, PARTICULARLY X-RAY RADIATION 审中-公开
标题翻译：用于选择性传输电磁辐射，特别是X射线辐射的网格和方法
公开(公告)号：WO2010016026A1
公开(公告)日：2010-02-11
申请号：PCT/IB2009/053429
申请日：2009-08-06
申请人： PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH , KONINKLIJKE PHILIPS ELECTRONICS N.V. , VOGTMEIER, Gereon , DORSCHEID, Ralf
发明人： VOGTMEIER, Gereon , DORSCHEID, Ralf
IPC分类号： G21K1/02 , B22F3/105 , B22F3/26
CPC分类号： G21K1/025 , B22F3/114 , B22F7/002 , B22F2998/10 , B33Y70/00 , B33Y80/00 , Y02P10/295 , B22F3/1055
摘要： A grid (1) for selective transmission of electromagnetic radiation and a method for manufacturing such grid is proposed. Therein, the grid (1) comprises a structural element with walls (3) comprising a plurality of particles (19) of a radiation- absorbing material wherein the particles (19) are sintered together such that pores (21) are present between neighbouring particles (19). The pores (21) are at least partially filled with a second solid material. The filling of the pores (21) can be done by inserting the second material in a liquid, preferably molten form into the pores. The second material can be itself radiation-absorbing as well and may help to both, increase the mechanical stability of the grid and to enhance the radiation-absorbing properties.
摘要翻译：提出了用于电磁辐射选择性传输的电网（1）及其制造方法。其中，网格（1）包括具有壁（3）的结构元件，所述壁（3）包括多个辐射吸收材料的颗粒（19），其中所述颗粒（19）被烧结在一起，使得孔（21）存在于相邻颗粒之间（19）。孔（21）至少部分地填充有第二固体材料。孔（21）的填充可以通过将第二材料以液体，优选熔融形式插入孔中来完成。第二种材料本身也可以是吸收辐射的，并且可以帮助两者，增加电网的机械稳定性并增强辐射吸收性能。

10. 发明申请

WO2009019645A3 METHOD AND APPARATUS FOR APPLYING MATERIAL TO A SURFACE OF AN ANODE OF AN X-RAY SOURCE, ANODE AND X-RAY SOURCE 审中-公开
公开(公告)号：WO2009019645A3
公开(公告)日：2009-02-12
申请号：PCT/IB2008/053102
申请日：2008-08-04
申请人： PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH , KONINKLIJKE PHILIPS ELECTRONICS N.V. , DORSCHEID, Ralf , VOGTMEIER, Gereon , PIETIG, Rainer
发明人： DORSCHEID, Ralf , VOGTMEIER, Gereon , PIETIG, Rainer
IPC分类号： H01J35/08
摘要： A method and an apparatus for locally applying material to the surface of an anode of an X-ray source as well as a corresponding anode is presented. Anode material such as a repair material for filling a recess (121) in an X-ray emitting surface (115) is applied to the X-ray emitting surface of an anode (101). The location where such material is to be applied may be detected using a laser beam (133). The applied repair material including particles (41) of anode material such as tungsten, rhenium or molybdenum, is subsequently locally sintered using a high-energy laser beam (151). The sintered material may then be melted using a high-energy electron beam (163). Using such method, a damaged surface of an anode may be locally repaired. Alternatively, structures of different anode materials or of protrusions having different levels can be provided on the X-ray emitting surface (115) in order to selectively manipulate the X-ray emitting characteristics of the anode (101).

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