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    • 3. 发明申请
    • METHOD FOR DETACHING A SUBSTRATE, DEVICE FOR CARRYING OUT SUCH A METHOD AND PUMPING DEVICE FOR PUMPING ETCHING SOLUTION
    • 去除基板的方法,执行该方法的装置和用于泵浦沉积溶液的泵送装置
    • WO2016066645A3
    • 2016-06-23
    • PCT/EP2015074875
    • 2015-10-27
    • OSRAM OPTO SEMICONDUCTORS GMBH
    • SUNDGREN PETRUSENGLHARD MARCOBEHRINGER MARTIN RUDOLFKLEMP CHRISTOPH
    • H01L21/67
    • H01L33/0079C23F1/20H01L21/67086H01L21/67092H01L24/95
    • The invention relates to a method for detaching a substrate (11) from a layer sequence (13), comprising the following steps: a) providing a composite (1, 2) having - a wafer (1) with the substrate (11), the layer sequence (13) and a sacrificial layer (12) arranged between the substrate (11) and the layer sequence (13); - a support (2) on a cover surface (13a) of the layer sequence (13), which faces away from the substrate (11), and - at least two separating trenches (14) which extend in the vertical direction (Z) through the layer sequence (13); b) attaching a pumping device (3) on the composite (1, 2); c) introducing the composite (1, 2) into an etching bath (4) with an etching solution (41); and subsequently d) generating a pressure gradient (5) between the separating trenches (14) and the etching solution (41) with the pumping device (3) such that the etching solution (41) flows through the separating trenches (14) in some places along the sacrificial layer (12) and is in some places in direct contact with the sacrificial layer (12); e) detaching the substrate (11).
    • 本发明提供了一种用于一个层序列(13)的衬底(11)的分离,包括以下步骤:a)提供一个复合物(1,2),包括: - 一个晶片(1)与基板(11) 在背离(11)远的层序列(13)的基板顶面(13a)的支撑件(2),以及 - 布置一系列的层(13)和所述基板(11)和所述层序列(13)之间的牺牲层(12)的, - 在通过该层序列(13)的垂直方向(Z)延伸的至少两个隔离沟槽(14),b)将泵送装置(3)向复合物(1,2),c)将复合材料(1,2) 在具有蚀刻溶液(41)的蚀刻槽(4)中,然后d)利用泵送装置(3)在分离槽(14)和蚀刻溶液(41)之间产生压力梯度(5),使得蚀刻溶液(41) 沿着牺牲层(12)的位置处的分离沟槽(14)流动并且处于直接接触的位置 与牺牲层(12),e)衬底(11)分离。