会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明申请
    • AUTOMATED VACUUM ASSISTED VALVE PRIMING SYSTEM AND METHODS OF USE
    • 自动真空辅助阀预灌装系统及其使用方法
    • WO2010033758A1
    • 2010-03-25
    • PCT/US2009/057403
    • 2009-09-18
    • NORDSON CORPORATIONCROWELL, CutlerFISKE, ErikQUINONES, HoratioSAWATZKY, Brian
    • CROWELL, CutlerFISKE, ErikQUINONES, HoratioSAWATZKY, Brian
    • B67D7/08
    • G05D16/20B05C5/0225B05C11/1005B05C11/1034Y10T137/0396Y10T137/85986
    • An automated system (10) and methods (11) for priming a fluid chamber (12) of a fluid dispensing valve (14) with fluid (16) from fluid material source that includes a vacuum source (46), a valve priming station (32), a vacuum switch (54), and a controller (62). The valve priming station (32) has a boot (40), a vacuum chamber (36), and a vacuum channel (42) in the boot (40). The vacuum channel (42) connects with the vacuum source (46) via the vacuum chamber (36). The boot (40) sealingly engages a valve nozzle (28) of the fluid dispensing valve (14) so that the vacuum chamber (36) connects the vacuum source (46) with the fluid chamber (12). The vacuum switch (54) couples with the vacuum channel (42) via the vacuum chamber (36) and has an opened and closed position based upon a vacuum level in the vacuum chamber (36). The controller (62) is electrically connected with the vacuum source (46) and vacuum switch (54) and controls priming of the fluid dispensing valve (14) based upon whether the vacuum switch (54) is opened or closed.
    • 一种自动化系统(10)和方法(11),用于利用来自流体材料源的流体(16)起动流体分配阀(14)的流体室(12),流体材料源包括真空源(46),阀启动站 32),真空开关(54)和控制器(62)。 阀门启动台(32)具有一个罩(40),一个真空室(36)和一个位于靴子(40)中的真空通道(42)。 真空通道(42)通过真空室(36)与真空源(46)连接。 护罩(40)密封地接合流体分配阀(14)的阀喷嘴(28),使得真空室(36)将真空源(46)与流体室(12)连接。 真空开关(54)经由真空室(36)与真空通道(42)联接,并且基于真空室(36)中的真空水平具有打开和关闭位置。 基于真空开关(54)是打开还是关闭,控制器(62)与真空源(46)和真空开关(54)电连接并控制流体分配阀(14)的启动。
    • 7. 发明申请
    • METHOD AND APPARATUS FOR UNDERFILLING ELECTRONIC COMPONENTS USING VACUUM ASSIST
    • 使用真空辅助设备来减少电子元件的方法和装置
    • WO2003006230A1
    • 2003-01-23
    • PCT/US2002/021458
    • 2002-07-08
    • NORDSON CORPORATIONHUEY, BrettPADGETT, David, N.QUINONES, Horatio
    • HUEY, BrettPADGETT, David, N.QUINONES, Horatio
    • B29C70/72
    • B29C70/84B29L2031/3406H01L2224/73204H01L2224/743H01L2224/92125
    • A bead of liquid encapsulant or underfilled material (16) is dispensed along one or more edges of the flip chip (12). A plenum is located along the sides of the chip (12) in which encapsulant or underfilled material has not been deposited, such as opposite the dispensed material. Thereafter, the plenum is subject to a negative pressure source for drawing a vacuum to the area beneath the chip (12) and the substrate (10). The negative pressure aids in the natural capillary underfilling action and for quicker and more effective underfilling of the chip. Simultaneous underfilling of a plurality of chips (12) can be achieved by mounting a like plurality of vacuum tools to a plate which is moved into registration with a like plurality of chip/substrate workstations. By operatively connecting the vacuum tools to a controller, and to appropriate valves which can be set to adjust the vacuum level.
    • 沿着倒装芯片(12)的一个或多个边缘分配液体密封剂或未填充材料(16)的珠粒。 沿着芯片(12)的侧面设置增压室,其中密封剂或未填充材料未被沉积,例如与分配的材料相对。 此后,通气室经受负压源,用于向芯片(12)和基板(10)下面的区域抽真空。 负压有助于天然毛细管底部填充动作,并有助于更快,更有效地填充芯片。 可以通过将相同的多个真空工具安装到移动到与相同的多个芯片/基板工作站对准的板上来实现多个芯片(12)的同时欠灌装。 通过将真空工具可操作地连接到控制器,以及适当的阀,其可以被设置以调节真空水平。