专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2012096743A1 METHODS FOR VACUUM ASSISTED UNDERFILLING 审中-公开
标题翻译：真空辅助方法
公开(公告)号：WO2012096743A1
公开(公告)日：2012-07-19
申请号：PCT/US2011/064373
申请日：2011-12-12
申请人： NORDSON CORPORATION , BABIARZ, Alec, J. , RATLEDGE, Thomas, L. , QUINONES, Haratio
发明人： BABIARZ, Alec, J. , RATLEDGE, Thomas, L. , QUINONES, Haratio
IPC分类号： H01L21/56
CPC分类号： H01L21/563 , H01L23/295 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/131 , H01L2224/13147 , H01L2224/16227 , H01L2224/29012 , H01L2224/29026 , H01L2224/2929 , H01L2224/29388 , H01L2224/32225 , H01L2224/73204 , H01L2224/83048 , H01L2224/8309 , H01L2224/83102 , H01L2224/92125 , H01L2924/01029 , H01L2924/15311 , H01L2224/16225 , H01L2924/00 , H01L2924/3512 , H01L2924/0665 , H01L2924/00012 , H01L2924/014
摘要： Methods for applying an underfill (30) with vacuum assistance. The method may include dispensing the underfill (30) onto a substrate (10) proximate to at least one exterior edge (18, 20, 22, 24) of an electronic device (14) attached to the substrate (10). A space (28) between the electronic device (14) and the substrate (10) is evacuated through at least one gap (27, 42, 61, 62) in the underfill (30). The method further includes heating the underfill (30) to cause the underfill (30) to flow into the space (28). Because a vacuum condition is supplied in the open portion of the space (28) before flow is initiated, the incidence of underfill voiding is lowered.
摘要翻译：在真空辅助下应用底部填充物（30）的方法。该方法可以包括将底部填充物（30）分配到靠近附接到衬底（10）的电子器件（14）的至少一个外部边缘（18,20,22,24）上的衬底（10）上。电子设备（14）和基板（10）之间的空间（28）通过底部填充物（30）中的至少一个间隙（27,42,61,62）抽真空。该方法还包括加热底部填充物（30）以使底部填充物（30）流入空间（28）。由于在开始流动之前在空间（28）的开口部分中供应真空条件，所以底部填充空隙的发生率降低。

2. 发明申请

WO2006031235A1 METHOD FOR PREAPPLYING UNDERFILL TO A MICROELECTRONIC PACKAGING AND MICROELECTRONIC PACKAGES FORMED THEREBY 审中-公开
标题翻译：用于预处理到微电子封装的方法和形成的微电子封装
公开(公告)号：WO2006031235A1
公开(公告)日：2006-03-23
申请号：PCT/US2004/030938
申请日：2004-09-22
申请人： NORDSON CORPORATION , QUINONES, Horatio , FANG, Liang , ELLIS, Dave , FISKE, Erik, Andrew , RATLEDGE, Thomas, Laferl , BABIARZ, Alec, J. , CIARDELLA, Robert
发明人： QUINONES, Horatio , FANG, Liang , ELLIS, Dave , FISKE, Erik, Andrew , RATLEDGE, Thomas, Laferl , BABIARZ, Alec, J. , CIARDELLA, Robert
IPC分类号： H01L21/56
CPC分类号： H01L21/563 , H01L23/3114 , H01L23/3171 , H01L24/10 , H01L2224/05572 , H01L2224/05573 , H01L2224/13022 , H01L2224/73203 , H01L2924/0102 , H01L2924/01322
摘要： Apparatus and methods for preapplying discrete amounts (18, 20) of underfill material to a component substrate (12) before the solder bumps (14) of a component (10) carried by the substrate (12) are joined by ref low with a packaging substrate (26) to create a microelectronics package. The amounts (18, 20) of underfill material are preferably applied by a non-contact dispensing technique as discrete amounts at interstitial areas (21) on an active surface of the component substrate (12) defined between nearest-neighbor solder bumps (14). The underfill material forms a continuous meniscus (24) of underfill material across the interstitial areas (21) not occupied by the solder bumps (14) and forms a collar (22) encircling each of the solder bumps (14). The cured underfill material strengthens and improves the reliability of the solder joints (30) formed by the bump reflow.
摘要翻译：在由衬底（12）承载的部件（10）的焊料凸块（14）之前，将分散量（18,20）的底部填充材料预先施加到部件衬底（12）的装置和方法通过引脚衬底（26）以产生微电子封装。底部填充材料的量（18,20）优选通过非接触分配技术作为离散量施加在限定在最近邻焊料凸块（14）之间的部件基板（12）的有源表面上的间隙区域（21）。底部填充材料在未被焊料凸块（14）占据的间隙区域（21）上形成底部填充材料的连续弯液面（24），并形成围绕每个焊料凸块（14）的环（22）。固化的底部填充材料增强并提高由凸点回流形成的焊点（30）的可靠性。

3. 发明申请

WO2014025487A1 METHOD FOR VACUUM ASSISTED UNDERFILLING OF AN ELECTRONIC DEVICE 审中-公开
标题翻译：用于真空辅助电子设备的方法
公开(公告)号：WO2014025487A1
公开(公告)日：2014-02-13
申请号：PCT/US2013/050180
申请日：2013-07-12
申请人： NORDSON CORPORATION
发明人： BABIARZ, Alec, J. , QUINONES, Horatio , RATLEDGE, Thomas, L. , ZHAO, Jiangang
IPC分类号： H01L21/56
CPC分类号： H01L21/563 , H01L24/27 , H01L2224/131 , H01L2224/13147 , H01L2224/16145 , H01L2224/16227 , H01L2224/26175 , H01L2224/2929 , H01L2224/29388 , H01L2224/32225 , H01L2224/73204 , H01L2224/81203 , H01L2224/81815 , H01L2224/83385 , H01L2224/92125 , H01L2224/16225 , H01L2924/00 , H01L2924/014 , H01L2924/00014
摘要： Methods for applying an underfill with vacuum assistance. The method may include dispensing the underfill (30) onto a substrate (12) proximate to at least one exterior edge (18, 20, 22, 24) of an electronic device (14) attached to the substrate (12). A space (28) between the electronic device (14) and the substrate (12) is evacuated through at least one gap (27) in the underfill (30). The method further includes heating the underfill (30) to cause the underfill (30) to flow into the space (28). Because a vacuum condition is supplied in the open portion of the space (28) before flow is initiated, the incidence of underfill voiding is lowered.
摘要翻译：在真空辅助下应用底部填充物的方法。该方法可以包括将底部填充物（30）分配到靠近附接到基底（12）的电子设备（14）的至少一个外部边缘（18,20,22,24）的基底（12）上。电子设备（14）和基板（12）之间的空间（28）通过底部填充物（30）中的至少一个间隙（27）被排出。该方法还包括加热底部填充物（30）以使底部填充物（30）流入空间（28）。由于在开始流动之前在空间（28）的开口部分中供应真空条件，所以底部填充空隙的发生率降低。

4. 发明申请

WO1997013586A1 FLIP CHIP UNDERFILL SYSTEM AND METHOD 审中-公开
标题翻译： FLIP CHIP UNDERFILL系统和方法
公开(公告)号：WO1997013586A1
公开(公告)日：1997-04-17
申请号：PCT/US1996016153
申请日：1996-10-08
申请人： NORDSON CORPORATION
发明人： NORDSON CORPORATION , BOURAS, Carlos, E. , LA, Duong, T. , GAMELIN, Andre, S. , LEWIS, Alan, R. , MEIER, Mark, S. , BABIARZ, Alec, J.
IPC分类号： B05C11/10
CPC分类号： B05C11/1042 , B05C5/0225 , B05C11/101 , B05C11/1013 , B05C11/1015 , B05C11/1018 , B05C11/1021 , H01L2224/16
摘要： A system (30) for dispensing a viscous material onto a substrate (16) which includes a dispensing element (22), a viscous material reservoir (20) and a metering device (25) coupled between the reservoir (20) and the dispensing element (22) for metering a variable amount of a viscous material through the dispensing element (22). The dispensing element (22) and metering device (25) can be moved by a positioner (32) along a predetermined pattern adjacent a surface of a substrate (16). A weigh scale (52) located adjacent the substrate (16) receives a metered amount of the viscous material and produces signals representative of a variable weight of the material dispensed during a predetermined time interval. A controller (40) adjusts a speed of movement of the positioner (32) along the predetermined pattern to cause the dispensing element (22) to dispense a desired amount of material based on a calculated flow rate. Alternatively, the controller (40) adjusts a rate of delivery based on the calculated flow rate.
摘要翻译：一种用于将粘性材料分配到基材（16）上的系统（30），该基材包括分配元件（22），粘性材料储存器（20）和联接在储存器（20）和分配元件（22），用于通过分配元件（22）计量可变量的粘性材料。分配元件（22）和计量装置（25）可以通过定位器（32）沿着与衬底（16）的表面相邻的预定图案移动。位于基板（16）附近的称重秤（52）接收计量量的粘性材料并且产生表示在预定时间间隔内分配的材料的可变重量的信号。控制器（40）根据预定图案来调节定位器（32）的运动速度，以使得分配元件（22）基于计算出的流量来分配所需量的材料。或者，控制器（40）基于所计算的流量来调整输送速率。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式