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    • 1. 发明申请
    • DEVICE AND METHOD FOR TEMPERATURE CORRECTION USING A PROXIMITY SENSOR IN A NON-CONTACT THERMOPILE THERMOMETER
    • 使用非接触式热电偶温度计中的临近传感器进行温度校正的装置和方法
    • WO2016145319A1
    • 2016-09-15
    • PCT/US2016/022023
    • 2016-03-11
    • MAXIM INTEGRATED PRODUCTS, INC.
    • LEE, Janice, C.PECORARO, DavidPEI, Cheng-Wei
    • G01J5/22G01F1/688G01J5/46
    • G01J5/46G01J5/22G01K1/00G01K1/20
    • A temperature measurement device having a thermopile temperature sensor and a proximity sensor, a mobile temperature measurement device, and a method for determining a corrected temperature with a temperature measurement device are described. In an implementation, a temperature measurement device includes a semiconductor device; a thermopile temperature sensor disposed on the semiconductor device, where the thermopile temperature sensor is configured to receive radiation from an object; a proximity sensor disposed on the semiconductor device, the proximity sensor configured to detect a distance between the thermopile temperature sensor and the object; and a controller configured determine a corrected temperature measurement using at least an indication of received radiation and an indication of distance between the thermopile temperature sensor and the object.
    • 描述了具有热电堆温度传感器和接近传感器的温度测量装置,移动温度测量装置和用温度测量装置确定校正温度的方法。 在实施方式中,温度测量装置包括半导体器件; 设置在所述半导体器件上的热电堆温度传感器,其中所述热电堆温度传感器被配置为接收来自物体的辐射; 设置在所述半导体器件上的接近传感器,所述接近传感器被配置为检测所述热电堆温度传感器和所述物体之间的距离; 并且控制器配置使用至少接收到的辐射的指示和热电堆温度传感器和物体之间的距离的指示来确定校正的温度测量。