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1. 发明申请

WO2011025153A3 WATER-BASED ADHESIVE COMPOSITION, METHOD FOR MANUFACTURING SAME, AND ADHESIVE FILM 审中-公开
标题翻译：水性胶粘剂组合物，其制造方法和粘合膜
公开(公告)号：WO2011025153A3
公开(公告)日：2011-06-30
申请号：PCT/KR2010005057
申请日：2010-07-30
申请人： LG HAUSYS LTD , KIM JANG SOON , CHO IK HWAN , LIM DONG HOON
发明人： KIM JANG SOON , CHO IK HWAN , LIM DONG HOON
IPC分类号： C09J133/06
CPC分类号： C09J133/06 , C08K5/053 , C08L2201/52 , C09J7/0278 , C09J7/245 , C09J133/066 , C09J133/068 , C09J133/14 , C09J2203/334 , Y10T428/265 , Y10T428/28 , Y10T428/2839
摘要： The present invention relates to a water-based adhesive composition, to a method for manufacturing same, and to an adhesive film. The water-based adhesive composition according to the present invention has excellent physical properties such as detachability and reworkability, and can stably prevent changes in the physical properties thereof caused by longitudinal or environmental factors. In addition, the water-based adhesive composition according to the present invention has excellent wettability against various adherends. Accordingly, the water-based adhesive composition according to the present invention can be effectively applied to various industrial adhesive products such as adhesive films for advertisements.
摘要翻译：本发明涉及水性粘合剂组合物，其制造方法和粘合剂膜。根据本发明的水性粘合剂组合物具有优异的物理性能如可剥离性和再加工性，并且可以稳定地防止由纵向或环境因素引起的物理性能的变化。此外，根据本发明的水性粘合剂组合物对各种被粘物具有优异的润湿性。因此，根据本发明的水性粘合剂组合物可以有效地应用于各种工业粘合剂产品，例如用于广告的粘合剂膜。

2. 发明申请

WO2009139584A2 ADHESIVE COMPOSITION, ADHESIVE SHEET, AND BACK GRINDING METHOD FOR SEMICONDUCTOR WAFER 审中-公开
标题翻译：粘合剂组合物，粘合片和用于半导体滤波器的后研磨方法
公开(公告)号：WO2009139584A2
公开(公告)日：2009-11-19
申请号：PCT/KR2009002559
申请日：2009-05-14
申请人： LG CHEMICAL LTD , KIM SE RA , BAEK YOON JEONG , KIM JANG SOON , LEE JAE GWAN , PARK HYUN WOO
发明人： KIM SE RA , BAEK YOON JEONG , KIM JANG SOON , LEE JAE GWAN , PARK HYUN WOO
IPC分类号： C09J7/02
CPC分类号： C09J7/0246 , C08F220/14 , C08F220/18 , C09J4/06 , C09J7/22 , C09J7/38 , C09J133/04 , C09J133/08 , C09J133/10 , C09J2201/606 , C09J2203/326 , C09J2423/006 , C09J2427/006 , C09J2433/00 , C09J2467/006 , C09J2475/006 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , Y10T428/1476 , Y10T428/264 , Y10T428/266 , Y10T428/2891 , C08F2220/1808 , C08F2220/1825 , C08F2220/281
摘要： The present invention relates to an adhesive composition containing a polymer of a monomer mixture comprising an isobornyl (meta)acrylate, an adhesive sheet, and a back grinding method for a semiconductor wafer. The present invention employs an isobornyl (meta)acrylate which is a hard-type monomer and has a low hydrophilicity, thus providing an adhesive composition with excellent water resistance, peeling properties, re-peelability and wettability to a wafer, as well as an adhesive sheet manufactured by using the composition and a back grinding method using the same.
摘要翻译：本发明涉及包含单体混合物的聚合物的粘合剂组合物，其包含异冰片基（甲基）丙烯酸酯，粘合片和用于半导体晶片的背面研磨方法。本发明采用作为硬质单体的异冰片基（甲基）丙烯酸酯，具有低的亲水性，从而提供具有优异的耐水性，剥离性，再剥离性和对晶片的润湿性的粘合剂组合物以及粘合剂使用该组合物制造的片材和使用该组合物的背面研磨法。

3. 发明申请

WO2010002197A3 ACRYLIC COMPOSITION FOR OPTICAL MEMBERS, PROTECTIVE FILM FOR OPTICAL MEMBERS, POLARIZING PLATE, AND LIQUID CRYSTAL DISPLAY 审中-公开
标题翻译：光学元件的丙烯酸酯组合物，光学成员的保护膜，极化板和液晶显示
公开(公告)号：WO2010002197A3
公开(公告)日：2010-04-22
申请号：PCT/KR2009003603
申请日：2009-07-01
申请人： LG CHEMICAL LTD , YOO HYUN JEE , CHO HYUN JU , KIM HAK LIM , KIM JANG SOON , SONG MUN SEOP
发明人： YOO HYUN JEE , CHO HYUN JU , KIM HAK LIM , KIM JANG SOON , SONG MUN SEOP
IPC分类号： C09J133/08 , C09J133/14
CPC分类号： C09J133/14 , C08F8/30 , C08F2220/1858 , C09D133/14 , Y10T428/266 , Y10T428/269 , Y10T428/2887 , C08F2220/1825 , C08F2220/281 , C08F220/18
摘要： The present invention relates to an acrylic composition for optical members, to a protective film for optical members, to a polarizing plate, and to a liquid crystal display. As the present invention mixes an appropriate amount of additional antistatic agent into a composition containing, by a predetermined ratio, a photopolymerizable acrylic polymer which is cured by radioactive rays such as ultraviolet rays, and a polymerization initiator, an ageing process can be omitted during curing, thus making it possible to simplify manufacturing processes, exhibit improved antistatic properties during peeling or use, and achieve excellent durability and reliability, excellent workability and adhesion properties, and excellent wettability and optical characteristics.
摘要翻译：本发明涉及用于光学部件的丙烯酸类组合物，光学部件用保护膜，偏光板以及液晶显示器。由于本发明将适量的附加抗静电剂混合到通过预定比例混合通过紫外线等放射线固化的光聚合性丙烯酸类聚合物和聚合引发剂的组合物中，可以在固化期间省略时效处理，因此可以简化制造工艺，在剥离或使用时显示出改进的抗静电性能，并且实现优异的耐久性和可靠性，优异的加工性和粘附性，以及优异的润湿性和光学特性。

4. 发明申请

WO2009072742A3 DICING DIE BONDING FILM AND DICING METHOD 审中-公开
标题翻译： DICING模结合膜和DICING方法
公开(公告)号：WO2009072742A3
公开(公告)日：2009-07-23
申请号：PCT/KR2008006081
申请日：2008-10-15
申请人： LG CHEMICAL LTD , HONG JONG WAN , KIM JANG SOON , PARK HYO SOON , YOO HYUN JEE , KHO DONG HAN , JOO HYO SOOK
发明人： HONG JONG WAN , KIM JANG SOON , PARK HYO SOON , YOO HYUN JEE , KHO DONG HAN , JOO HYO SOOK
IPC分类号： C09J163/00
CPC分类号： C09J163/00 , H01L21/6836 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2221/68336 , H01L2221/68377 , H01L2224/2919 , H01L2224/32225 , H01L2224/73265 , H01L2924/1434 , H01L2924/37001 , Y10T428/24
摘要： The present invention relates to a dicing die bonding film, which is able to maintain good workability and reliability in any semiconductor packaging process, such as adhesive property, gap filling property and pick-up property, while controlling burr incidence in a dicing process and thus contamination of die, and a dicing method. Specifically, the present invention is characterized by optimizing tensile characteristics of the dicing die bonding film, or carrying out the dicing on the parts of the die bonding film in the dicing process and separating it through an expanding process. Therefore, the present invention may regulate physical properties of films so as to have the maximized adhesive property, pick-up property and gap filling property without any specific restriction, while controlling burr incidence in the dicing process and contamination of die. As a result, workability and reliability in a packaging process may be excellently maintained.
摘要翻译：切割模片接合薄膜技术领域本发明涉及在控制切割工序中的毛刺入射的同时，能够在粘接性，间隙填充性，拾取性等半导体封装工序中维持良好的加工性和可靠性的切割芯片接合薄膜模具污染和切割方法。具体而言，本发明的特征在于，通过使切割模片接合膜的拉伸特性最优化，或者在切割过程中对芯片接合膜的部分进行切割并通过扩展工艺将其分离。因此，本发明可以控制膜的物理性质，以便在控制切割过程中的毛刺入射和模具污染的同时，在没有任何特定限制的情况下具有最大化的粘附性，拾取性和间隙填充性。结果，可以很好地保持包装过程中的可操作性和可靠性。

5. 发明申请

WO2009131363A3 PRESSURE-SENSITIVE ADHESIVE FILM AND BACK-GRINDING METHOD USING THE SAME 审中-公开
标题翻译：压敏粘合膜和使用其的背面研磨方法
公开(公告)号：WO2009131363A3
公开(公告)日：2010-03-11
申请号：PCT/KR2009002082
申请日：2009-04-21
申请人： LG CHEMICAL LTD , KIM SE RA , BAEK YOON JEONG , KIM JANG SOON , SON HYUN HEE , HONG JONG WAN , PARK HYUN WOO
发明人： KIM SE RA , BAEK YOON JEONG , KIM JANG SOON , SON HYUN HEE , HONG JONG WAN , PARK HYUN WOO
IPC分类号： C09J5/00
CPC分类号： H01L21/6836 , C09J7/22 , C09J2203/326 , C09J2423/006 , C09J2427/006 , C09J2433/00 , C09J2467/006 , C09J2475/006 , H01L21/6835 , H01L2221/68327 , H01L2221/68386 , Y10T428/1476 , Y10T428/264 , Y10T428/266 , Y10T428/28 , Y10T428/2852 , Y10T428/2887 , Y10T428/2891
摘要： The present invention concerns a pressure-sensitive adhesive film and a method for back-grinding semiconductor wafers using the same. The present invention provides, for example, a pressure-sensitive adhesive film having excellent brittleness and adhesion in the semiconductor production process, as well as a superior cushioning, and that is capable of markedly improving production efficiency in the wafer back-grinding process of semiconductor production. In addition, the present invention provides a pressure-sensitive adhesive film having superior releasability, re-releasable characteristics, and wafer wettability, and also exhibiting excellent water resistance; and a back-grinding method using the same.
摘要翻译：本发明涉及一种压敏粘合剂膜和使用其的半导体晶片的背面研磨方法。本发明提供例如在半导体制造工序中具有优异的脆性和粘合性的压敏粘合剂膜以及优异的缓冲性，并且能够显着提高半导体的晶片背面磨削工艺中的生产效率生产。另外，本发明提供了具有优异的剥离性，再剥离特性和晶片润湿性的粘合剂膜，并且还表现出优异的耐水性; 和使用其的背面研磨方法。

6. 发明申请

WO2009131405A3 EPOXY-BASED COMPOSITION, ADHESIVE FILM, DICING DIE-BONDING FILM AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：环氧化合物，粘合膜，定影膜和半导体器件
公开(公告)号：WO2009131405A3
公开(公告)日：2010-01-21
申请号：PCT/KR2009002150
申请日：2009-04-24
申请人： LG CHEMICAL LTD , YOO HYUN JEE , KHO DONG HAN , KIM JANG SOON , PARK HYO SOON , HONG JONG WAN , JOO HYO SOOK
发明人： YOO HYUN JEE , KHO DONG HAN , KIM JANG SOON , PARK HYO SOON , HONG JONG WAN , JOO HYO SOOK
IPC分类号： C09J163/00
CPC分类号： H01L21/02002 , C08G59/621 , C08K5/13 , C08L33/066 , C08L33/068 , C08L61/06 , C08L61/12 , C08L61/20 , C08L63/00 , C08L2666/02 , C09J5/06 , C09J7/20 , C09J133/066 , C09J133/068 , C09J163/00 , C09J2201/36 , C09J2201/60 , C09J2203/326 , C09J2433/00 , C09J2463/00 , H01L21/6836 , Y10T428/269 , Y10T428/287 , Y10T428/2891 , Y10T428/31515
摘要： The present invention relates to an epoxy-based composition, an adhesive film, a dicing die-bonding film and a semiconductor device employing the same. More specifically, it relates to an epoxy-based composition having a gel content of from 5% to 20% when measured under specific conditions and to an application therefor. The epoxy-based composition according to the present invention can minimise the incidence of burrs during processing while at the same time exhibiting outstanding high-temperature adhesive properties and displaying superior resilience characteristics even when a low glass-transition temperature is set when it is made into an adhesive. Consequently, when the present invention is employed, it can prevent die-pushing defects during high-temperature wire bonding or moulding processing, and it allows the production of outstandingly reliable semiconductor devices due to the superior adhesiveness and workability of the adhesive.
摘要翻译：本发明涉及环氧类组合物，粘合剂膜，切割芯片接合膜和使用其的半导体器件。更具体地说，本发明涉及在特定条件下测定时的凝胶含量为5〜20％的环氧类组合物及其用途。根据本发明的环氧基组合物可以在加工过程中最小化毛刺的发生率，同时表现出优异的高温粘合性能，并且即使在制成玻璃化转变温度低时也显示优异的回弹特性粘合剂。因此，当采用本发明时，可以防止在高温引线接合或模塑加工期间的挤压缺陷，并且由于粘合剂的优异的粘合性和可加工性，可以制造出非常可靠的半导体器件。

7. 发明申请

WO2009131363A2 PRESSURE-SENSITIVE ADHESIVE FILM AND BACK-GRINDING METHOD USING THE SAME 审中-公开
标题翻译：压敏粘合膜和使用其的背面研磨方法
公开(公告)号：WO2009131363A2
公开(公告)日：2009-10-29
申请号：PCT/KR2009002082
申请日：2009-04-21
申请人： LG CHEMICAL LTD , KIM SE RA , BAEK YOON JEONG , KIM JANG SOON , SON HYUN HEE , HONG JONG WAN , PARK HYUN WOO
发明人： KIM SE RA , BAEK YOON JEONG , KIM JANG SOON , SON HYUN HEE , HONG JONG WAN , PARK HYUN WOO
IPC分类号： C09J5/00
CPC分类号： H01L21/6836 , C09J7/22 , C09J2203/326 , C09J2423/006 , C09J2427/006 , C09J2433/00 , C09J2467/006 , C09J2475/006 , H01L21/6835 , H01L2221/68327 , H01L2221/68386 , Y10T428/1476 , Y10T428/264 , Y10T428/266 , Y10T428/28 , Y10T428/2852 , Y10T428/2887 , Y10T428/2891
摘要： The present invention concerns a pressure-sensitive adhesive film and a method for back-grinding semiconductor wafers using the same. The present invention provides, for example, a pressure-sensitive adhesive film having excellent brittleness and adhesion in the semiconductor production process, as well as a superior cushioning, and that is capable of markedly improving production efficiency in the wafer back-grinding process of semiconductor production. In addition, the present invention provides a pressure-sensitive adhesive film having superior releasability, re-releasable characteristics, and wafer wettability, and also exhibiting excellent water resistance; and a back-grinding method using the same.
摘要翻译：本发明涉及一种压敏粘合剂膜和使用其的半导体晶片的背面研磨方法。本发明提供例如在半导体制造工序中具有优异的脆性和粘合性的压敏粘合剂膜以及优异的缓冲性，并且能够显着提高半导体的晶片背面研磨工艺中的生产效率生产。另外，本发明提供了具有优异的剥离性，再剥离特性和晶片润湿性的粘合剂膜，并且还表现出优异的耐水性; 和使用其的背面研磨方法。

8. 发明申请

WO2013058570A3 COMPOSITION FOR FORMING ELECTRONIC PAPER WITHOUT PARTICLE FREEZING, AND ADHESIVE FILM PREPARED THEREBY 审中-公开
标题翻译：用于形成无颗粒冷冻的电子纸的组合物和由其制备的粘合膜
公开(公告)号：WO2013058570A3
公开(公告)日：2013-07-04
申请号：PCT/KR2012008531
申请日：2012-10-18
申请人： LG HAUSYS LTD
发明人： KIM JANG SOON , LEE YONG HOON , CHOI WON GU
IPC分类号： C09J181/00 , C09J4/00 , C09J7/02 , G02F1/167
CPC分类号： C09J163/00 , C08L81/02 , C09J4/00 , C09J181/00 , G02F1/167 , G02F2001/1672
摘要： Disclosed is a sealing film for electronic paper having a multilayered structure. The multilayered film for electronic paper comprising a layered structure according to the present invention comprises: (a) a sealing layer formed with a material comprising a UV curable polymer resin composition or a UV transmitting polymer resin composition; and (b) a tack-free adhesive layer formed with a material comprising a UV curable polymer resin. The sealing film has excellent sealing properties and is tack-free at room temperature, and thus it is possible to minimize the freezing of electrostatic particles inside a microcup sticking to the surface of a sealing material during manipulation thereof.
摘要翻译：公开了一种具有多层结构的电子纸用密封膜。根据本发明的包含层状结构的电子纸用多层膜包括：（a）由包含UV可固化聚合物树脂组合物或UV可透过聚合物树脂组合物的材料形成的密封层; 和（b）由包含UV可固化聚合物树脂的材料形成的无粘性粘合剂层。该密封膜具有优异的密封性并且在室温下不发粘，因此可以在操作期间使附着在密封材料表面上的微杯内的静电粒子的冻结最小化。

9. 发明申请

WO2013051876A2 AQUEOUS ADHESIVE COMPOSITION THAT CHANGES LITTLE OVER TIME 审中-公开
标题翻译：随时间变化的水性粘合剂组合物
公开(公告)号：WO2013051876A2
公开(公告)日：2013-04-11
申请号：PCT/KR2012008064
申请日：2012-10-05
申请人： LG HAUSYS LTD
发明人： LEE HAN NA , LEE JAE GWAN , KIM JANG SOON
IPC分类号： C09J4/02 , C09J7/02
CPC分类号： C09J4/06 , C08F220/18 , C08F220/20 , C09J4/00 , C09J7/02 , C09J7/20 , C09J133/066 , C09J133/08 , C08F2220/1825 , C08F220/14 , C08F2222/1013
摘要： Disclosed is an aqueous adhesive composition, the adhesive properties of which are barely degraded due to aging. The aqueous adhesive composition according to the present invention has the technical features of comprising a monomer having a hydroxyl group, and of not forming a chelate compound after polymerization. Thus, the aqueous adhesive composition has the advantages of having little reduction in adhesive properties thereof due to an increase in gel content.
摘要翻译：公开了一种水性粘合剂组合物，其粘合性质由于老化而几乎不会降解。根据本发明的水性粘合剂组合物具有包含具有羟基的单体且在聚合后不形成螯合化合物的技术特征。因此，该水性粘合剂组合物具有由于凝胶含量增加而具有很小的粘合性下降的优点。

10. 发明申请

WO2013055122A3 ADHESIVE TAPE FOR CAR 审中-公开
标题翻译：汽车胶带
公开(公告)号：WO2013055122A3
公开(公告)日：2013-06-13
申请号：PCT/KR2012008260
申请日：2012-10-11
申请人： LG HAUSYS LTD
发明人： JANG AE JUNG , KIM JANG SOON , YOO SEUNG MIN
IPC分类号： C09J121/00 , C08J5/18
CPC分类号： C09J7/0289 , B32B37/1284 , C09J7/0246 , C09J7/22 , C09J7/26 , C09J7/38 , C09J153/02 , Y10T428/249983
摘要： The present invention provides a pressure sensitive adhesive tape comprising: an acrylic foam layer; and rubber-based adhesive layers which are formed on both sides of said acrylic foam layer, wherein the content of gel in said rubber-based adhesive layers is 40% or more. Furthermore, in order to accomplish the object of the present invention, a method for manufacturing a pressure sensitive adhesive layer is provided, and the method comprises the steps of: manufacturing an acrylic foam layer; and forming rubber-based adhesive layers on one side or both sides of said acrylic foam layer, wherein said step of forming the rubber-based adhesive layers comprises the steps of: manufacturing a styrene block copolymer; forming rubber-based adhesive layers by adding an adhesive additive and a plasticizer to said styrene block copolymer; and setting the content of gel in said rubber-based adhesive layers to 40% or more.
摘要翻译：本发明提供一种压敏粘合带，包括：丙烯酸泡沫层; 以及形成在所述丙烯酸类泡沫层的两面上的橡胶类粘合剂层，其中所述橡胶类粘合剂层中的凝胶含量为40％以上。此外，为了实现本发明的目的，提供了一种制造压敏粘合剂层的方法，该方法包括以下步骤：制造丙烯酸泡沫层; 以及在所述丙烯酸泡沫层的一侧或两侧上形成橡胶基粘合剂层，其中所述形成橡胶基粘合剂层的步骤包括以下步骤：制备苯乙烯嵌段共聚物; 通过向所述苯乙烯嵌段共聚物中加入粘合剂添加剂和增塑剂形成橡胶基粘合剂层; 并将所述橡胶类粘合剂层中的凝胶含量设定为40％以上。

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