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    • 4. 发明申请
    • METHOD OF MANUFACTURING A THERMOELECTRIC DEVICE AND THERMOELECTRIC DEVICE OBTAINED BY MEANS OF SUCH A METHOD
    • 制造这种方法的热电装置和热电装置的制造方法
    • WO2004105146A1
    • 2004-12-02
    • PCT/IB2004/050710
    • 2004-05-17
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.OUWERKERK, MartinDEKKER, RonaldMELLIER, Maxime, R., L.EGNER, SebastianLASANCE, Clemens, J., M.
    • OUWERKERK, MartinDEKKER, RonaldMELLIER, Maxime, R., L.EGNER, SebastianLASANCE, Clemens, J., M.
    • H01L35/34
    • H01L35/34
    • The invention relates to a method of manufacturing a thermoelectric device (10), in particular a thermoelectric generator (10), comprising a flexible foil (1) on which two groups (2, 3) of series-connected strip-shaped parts (2A, 3A) are formed, where the materials chosen for the two groups of parts (2A, 3A) are materials with a different thermoelectric coefficient and said two groups of parts are formed in a pattern (100) such that the connections (4) between one part (2A) of one group (2) and another part (3A) of the other group (3) are alternately positioned in two spaced apart areas (G1, G2) of the foil (1), and after the formation of the parts (2A, 3A) on a substrate (5), the foil (1) is attached to the strip­shaped parts (2A, 3A), after which the substrate (5) is removed. According to the invention, for the substrate (5) use is made of a rigid (=relatively thick) substrate (5), and before the substrate (5) is removed a rigid (= relatively thick) carrier plate (6) is attached to the foil (1) that is removed again from the foil (1) after removal of the rigid substrate (5). In this way, the method is particularly suitable for the use of semiconductor substrates (5) which can be rapidly removed by chemical-mechanical polishing. Preferably, the foil (1) with the device (10) is folded or coiled before use.
    • 本发明涉及一种制造热电装置(10)的方法,特别是一种热电发生器(10),其包括柔性箔(1),两组(2,3)串联连接的带状部件(2A ,3A),其中为两组部件(2A,3A)选择的材料是具有不同热电系数的材料,并且所述两组部件以图案(100)形成,使得连接(4)在 一组(2)的一部分(2A)和另一组(3)的另一部分(3A)交替地位于箔(1)的两个间隔开的区域(G1,G2)中,并且在形成 在基板(5)上的部分(2A,3A),箔(1)附接到条状部分(2A,3A),之后移除基板(5)。 根据本发明,对于基底(5),使用刚性(=相对较厚)的基底(5),并且在移除基底(5)之前,附接刚性(=较厚)的载体板(6) 涉及在去除刚性基材(5)之后再次从箔(1)上除去的箔(1)。 以这种方式,该方法特别适用于可通过化学机械抛光快速去除的半导体衬底(5)。 优选地,具有装置(10)的箔(1)在使用之前被折叠或盘绕。