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1. 发明申请

WO2007072249A3 POROUS CIRCUITRY MATERIAL FOR LED SUBMOUNTS 审中-公开
标题翻译： LED电子元件的多孔电路材料
公开(公告)号：WO2007072249A3
公开(公告)日：2008-02-28
申请号：PCT/IB2006054471
申请日：2006-11-28
申请人： KONINKL PHILIPS ELECTRONICS NV , BECKERS LUCAS J A M , VAN OS KOEN
发明人： BECKERS LUCAS J A M , VAN OS KOEN
IPC分类号： H05K1/09 , H01B1/16
CPC分类号： H05K1/092 , H01L23/498 , H01L23/49866 , H01L2224/16 , H01L2924/09701 , H01L2924/12044 , H05K3/38 , H05K2201/0116 , H05K2203/0315
摘要： A submount comprising a ceramic substrate and a circuitry arranged thereon is provided. The circuitry comprises an electrically conducting porous material comprising at least one noble metal doped with at least one non-noble metal, the surface of at least portions of said electrically conducting porous material comprises oxides of said non-noble metals, and said ceramic substrate is bonded to said porous electrically conducting material via said oxides of said non-noble metals.
摘要翻译：提供了一种包括陶瓷基板和布置在其上的电路的基座。电路包括导电多孔材料，其包含掺杂有至少一种非贵金属的至少一种贵金属，所述导电多孔材料的至少部分的表面包括所述非贵金属的氧化物，并且所述陶瓷衬底是通过所述非贵金属的氧化物键合到所述多孔导电材料上。

2. 发明申请

WO2006067689A3 PRINTED CIRCUIT BOARD ARRANGEMENT 审中-公开
标题翻译：印刷电路板布置
公开(公告)号：WO2006067689A3
公开(公告)日：2006-09-21
申请号：PCT/IB2005054244
申请日：2005-12-14
申请人： KONINKL PHILIPS ELECTRONICS NV , DE SAMBER MARC A , VAN OS KOEN
发明人： DE SAMBER MARC A , VAN OS KOEN
IPC分类号： H05K1/02
CPC分类号： H05K1/0206 , H05K2201/066 , H05K2201/09509 , H05K2201/09781
摘要： The present invention relates to a printed circuit board arrangement with a multi- layer substrate (1, 2) having a buried conductor (4) and a contact area (3), connected to the conductor (4) and being disposed on a surface of the substrate. In order to improve the cooling of the buried conductor, a metal cooling area (6) is provided above the conductor (4), and is connected to the conductor by means of one or more via conductors (7).
摘要翻译：本发明涉及一种具有多层衬底（1,2）的印刷电路板装置，所述多层衬底具有埋入导体（4）和接触区域（3），所述接触区域（3）连接到所述导体（4）并且布置在所述导体衬底。为了改善埋入导体的冷却，在导体（4）上方设置金属冷却区域（6），并且通过一个或多个通孔导体（7）将导体连接到导体。

3. 发明申请

WO2006054236A3 COMPOSITE LED MODULES 审中-公开
标题翻译：复合LED模块
公开(公告)号：WO2006054236A3
公开(公告)日：2009-07-30
申请号：PCT/IB2005053756
申请日：2005-11-15
申请人： KONINKL PHILIPS ELECTRONICS NV , WANG LINGLI , VAN OS KOEN , ANSEMS JOHANNES P M
发明人： WANG LINGLI , VAN OS KOEN , ANSEMS JOHANNES P M
IPC分类号： H01L25/075 , H01L33/20 , H01L33/58 , H01L33/60
CPC分类号： H01L25/0756 , H01L33/20 , H01L33/58 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： The present invention provides a composite multi-color light emitting diode device comprising a first light emitting diode unit and a second light emitting diode unit that is arranged on top of the first light emitting diode unit. Thereby, a composite light emitting diode device, capable of emitting two different wavelengths of electromagnetic radiation is provided. It is furthermore possible to arrange a third light emitting diode unit. The third light emitting diode unit can be arranged on top of the second light emitting diode unit, thereby providing a stack of three light emitting diode units, or it can be arranged on the first light emitting diode unit, thereby providing two light emitting diode units side-by-side on top of the first light emitting diode unit.
摘要翻译：本发明提供一种复合多色发光二极管装置，其包括设置在第一发光二极管单元顶部的第一发光二极管单元和第二发光二极管单元。因此，提供能够发射两种不同波长的电磁辐射的复合发光二极管装置。此外，可以设置第三发光二极管单元。第三发光二极管单元可以布置在第二发光二极管单元的顶部，从而提供三个发光二极管单元的堆叠，或者可以将其布置在第一发光二极管单元上，从而提供两个发光二极管单元并排在第一个发光二极管单元的顶部。

4. 发明申请

WO2007057818A3 LIGHTING DEVICE AND METHOD FOR DIRECTING LIGHT 审中-公开
标题翻译：照明设备和方向指示灯
公开(公告)号：WO2007057818A3
公开(公告)日：2008-01-03
申请号：PCT/IB2006054175
申请日：2006-11-09
申请人： PHILIPS INTELLECTUAL PROPERTY , KONINKL PHILIPS ELECTRONICS NV , PETERS RALPH-HUBERT , DE SAMBER MARC ANDRE , VAN OS KOEN , SWEEGERS NORBERTUS ANTONIUS MA , LENDERINK EGBERT , VAN HEESWIJK JOHANNES ANTONIUS , KOHL JOHANN-JOSEF
发明人： PETERS RALPH-HUBERT , DE SAMBER MARC ANDRE , VAN OS KOEN , SWEEGERS NORBERTUS ANTONIUS MA , LENDERINK EGBERT , VAN HEESWIJK JOHANNES ANTONIUS , KOHL JOHANN-JOSEF
IPC分类号： F21S8/12 , F21V7/00 , F21V29/00 , F21Y101/02
CPC分类号： F21S41/43 , F21S41/143 , F21S41/147 , F21S41/19 , F21Y2115/10
摘要： An LED module is described with a base 10 made out of a heat conducting material. An LED element (32) is arranged in a cavity (11) of the base. A collimator reflector (70) is formed by reflective surfaces (24, 64, 66a). Three of these reflective surfaces (66a, 66b, 64) are provided on a plastic insert (60) received in the cavity (11). A further reflective surface (24) is provided on the base (10) itself. This surface (24) has a straight border line (50). The collimator reflector (70) is arranged to reflect light from the LED (32) so that a cut-off (72) is formed by the straight border line (50). By thus integrating the cut-off, as the most critical optical element, into the base (10) itself, high accuracy is achieved.
摘要翻译： LED模块被描述为具有由导热材料制成的基座10。 LED元件（32）布置在基座的空腔（11）中。准直反射器（70）由反射表面（24,64,66a）形成。这些反射表面（66a，66b，64）中的三个设置在容纳在空腔（11）中的塑料插入件（60）上。另一反射表面（24）设置在基座（10）上。该表面（24）具有直线边界线（50）。准直反射器（70）被布置成反射来自LED（32）的光，使得由直线边界线（50）形成截止线（72）。通过这样将作为最关键的光学元件的截止元件集成到基座（10）本身中，实现了高精度。

5. 发明申请

WO2008117213A3 AN ASSEMBLY OF AT LEAST TWO PRINTED CIRCUIT BOARDS AND A METHOD OF ASSEMBLING AT LEAST TWO PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：至少两个印刷电路板的组装和至少两个印刷电路板的组装方法
公开(公告)号：WO2008117213A3
公开(公告)日：2008-12-31
申请号：PCT/IB2008051064
申请日：2008-03-20
申请人： KONINKL PHILIPS ELECTRONICS NV , VAN OS KOEN , COOLEN MARCEL W W
发明人： VAN OS KOEN , COOLEN MARCEL W W
IPC分类号： H05K1/14 , B01L3/00 , B01L7/00 , H01L25/16 , H05K3/36 , H05K3/40
CPC分类号： H05K1/144 , B01L3/5027 , B01L7/52 , B01L2200/147 , B01L2300/0819 , B01L2300/0861 , B01L2300/1822 , B01L2300/1827 , H01L25/162 , H01L2224/48091 , H01L2224/73265 , H01L2924/0002 , H05K1/117 , H05K2201/0379 , H05K2201/042 , H05K2201/09027 , H05K2201/09845 , H05K2201/10242 , H05K2201/1031 , H05K2201/10378 , H05K2201/2036 , Y02P70/611 , H01L2924/00 , H01L2924/00014
摘要： An assembly of at least two printed circuit boards includes an intermediate connection layer (40) for providing electrical and mechanical connections between first and second circuit boards (10,12). The intermediate connection layer comprises a lower set of connection pads connecting the intermediate layer to the first circuit board, and an upper set of connection pads connecting the intermediate layer to the second circuit board. The intermediate connection layer comprises connection regions and a void region, wherein the void region extends between the first and second circuit boards and houses electronic components (16) of the circuit boards. This arrangement uses an intermediate connection layer to provide a stable mechanical connection, provide electrical connections between the circuit boards, and define a spacing for housing the electrical components of one or both of the circuit boards. The connections can be soldered, and this can be performed by reflow soldering methods, and using pick and place equipment.
摘要翻译：至少两个印刷电路板的组件包括用于提供第一和第二电路板（10,12）之间的电连接和机械连接的中间连接层（40）。中间连接层包括将中间层连接到第一电路板的下组连接垫和将中间层连接到第二电路板的上组连接垫。中间连接层包括连接区域和空隙区域，其中空隙区域在第一和第二电路板之间延伸并容纳电路板的电子部件（16）。该布置使用中间连接层来提供稳定的机械连接，提供电路板之间的电连接，并且限定用于容纳一个或两个电路板的电气部件的间隔。连接可以焊接，这可以通过回流焊接方法和使用拾放设备来执行。

6. 发明申请

WO2007054859A2 MINIATURE OPTICAL COMPONENT 审中-公开
标题翻译：微型光学元件
公开(公告)号：WO2007054859A2
公开(公告)日：2007-05-18
申请号：PCT/IB2006054065
申请日：2006-11-02
申请人： PHILIPS INTELLECTUAL PROPERTY , KONINKL PHILIPS ELECTRONICS NV , LUETTGENS GUNNAR , VAN OS KOEN , DE SAMBER MARC ANDRE
发明人： LUETTGENS GUNNAR , VAN OS KOEN , DE SAMBER MARC ANDRE
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , H01L2224/16225 , H01L2924/181 , H01L2924/00012
摘要： The invention relates to a miniature optical component (31) comprising at least one optically active surface and having at least one base surface area on which at least one soldering surface is arranged via which the miniature optical component (31) can be positioned in a defined manner by at least one corresponding soldering surface on a carrier (1) with the use of a solder, wherein the miniature optical component (31) can also be arranged at a defined distance from a solid-state light source (2). The dimensions of the mutually corresponding soldering surfaces and the solder quantity are attuned to one another such that the defined positioning of the miniature optical components (31) on the carrier (1) can be realized by the liquid or liquefied and subsequently solidified solder, and at least one reference element (12) is arranged for the defined distancing of the miniature optical components (31) from the solid-state light source (2).
摘要翻译：本发明涉及一种包括至少一个光学活性表面并且具有至少一个基面表面区域的微型光学组件（31），在该至少一个基面表面区域上布置有至少一个焊接表面，通过该至少一个焊接表面，微型光学部件（31）可以被定位在限定的通过使用焊料在载体（1）上的至少一个对应的焊接表面的方式，其中所述微型光学部件（31）也可以被布置在与固态光源（2）限定的距离处。相互对应的焊接表面和焊料量的尺寸彼此相适应，使得微型光学部件（31）在载体（1）上的限定的定位可以通过液体或液化的和随后的固化的焊料实现，以及至少一个参考元件（12）被布置用于将微型光学部件（31）与固态光源（2）的限定距离。

7. 发明申请

WO2006114745A3 LIGHT SOURCE COMPRISING LED ARRANGED IN RECESS 审中-公开
标题翻译：包含发光二极管的光源
公开(公告)号：WO2006114745A3
公开(公告)日：2007-03-29
申请号：PCT/IB2006051244
申请日：2006-04-21
申请人： KONINKL PHILIPS ELECTRONICS NV , DE SAMBER MARC A , VAN OS KOEN
发明人： DE SAMBER MARC A , VAN OS KOEN
IPC分类号： H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64
CPC分类号： H01L33/642 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A light source comprising a substrate (1) having a first side and an opposing second side, at least one recess (2) being arranged in said first side of said substrate, a circuitry (4) at least partly arranged on said substrate (1), and at least one LED (3) being arranged in said at least one recess (2) and connected to said circuitry (4) is provided. The surface of said at least one recess (2) is continuous and is physically separated from said second side by substrate material. By arranging the LED in such a recess in the substrate, cross talk between adjacent LEDs is reduced, a good mechanical stability of the light source is maintained, and the thermal path through the substrate is reduced.
摘要翻译：一种光源，包括具有第一侧和相对的第二侧的衬底（1），至少一个凹槽（2）布置在所述衬底的所述第一侧中，至少部分地布置在所述衬底（1）上的电路），并且设置在所述至少一个凹部（2）中并连接到所述电路（4）的至少一个LED（3）。所述至少一个凹部（2）的表面是连续的，并且通过基底材料与所述第二侧物理分离。通过将LED布置在基板的这种凹部中，相邻LED之间的串扰减少，保持了良好的光源的机械稳定性，并且减小了通过基板的热路径。

8. 发明申请

WO2006054228A2 ILLUMINATOR AND METHOD FOR PRODUCING SUCH ILLUMINATOR 审中-公开
标题翻译：照明器和用于生产这样的照明器的方法
公开(公告)号：WO2006054228A2
公开(公告)日：2006-05-26
申请号：PCT/IB2005053742
申请日：2005-11-14
申请人： KONINKL PHILIPS ELECTRONICS NV , HOELEN CHRISTOPH G A , VAN DEN ACKERVEKEN ANTONIUS C , RUTJES CORNELIUS F J , VAN OS KOEN , DE SAMBER MARC A , TREURNIET THEODOOR C
发明人： HOELEN CHRISTOPH G A , VAN DEN ACKERVEKEN ANTONIUS C , RUTJES CORNELIUS F J , VAN OS KOEN , DE SAMBER MARC A , TREURNIET THEODOOR C
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , H01L2224/14 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： The present invention relates to an illuminator (10) comprising a substrate (12), a structured conductive layer (16) applied to one surface of the substrate, and at least one light source (18, 26) connected to the structured conductive layer. The illuminator is characterized in that it further comprises an unstructured reflective layer (24) applied on top of said structured conductive layer, which unstructured reflective layer has an essentially continuous extension at least in a surrounding of the at least one light source. Due to the unstructured reflective layer, the optical efficiency of the illuminator can be improved. The invention also relates to a method for producing such illuminator.
摘要翻译：本发明涉及一种包括衬底（12），施加到衬底的一个表面的结构化导电层（16）和连接到结构化导电层的至少一个光源（18,26）的照明器（10）。照明器的特征在于，其还包括施加在所述结构化导电层顶部上的非结构化反射层（24），所述非结构化反射层至少在所述至少一个光源的周围具有基本上连续的延伸。由于非结构化的反射层，可以提高照明器的光学效率。本发明还涉及一种用于制造这种照明器的方法。

9. 发明申请

WO2006003563A3 LIGHT EMITTING DIODE MODULE 审中-公开
标题翻译：发光二极管模块
公开(公告)号：WO2006003563A3
公开(公告)日：2006-03-30
申请号：PCT/IB2005052068
申请日：2005-06-23
申请人： KONINKL PHILIPS ELECTRONICS NV , DE SAMBER MARC A , HOELEN CHRISTOPH G A , VAN GRUNSVEN ERIC C E , VAN OS KOEN
发明人： DE SAMBER MARC A , HOELEN CHRISTOPH G A , VAN GRUNSVEN ERIC C E , VAN OS KOEN
IPC分类号： H01L25/16 , H01L33/62 , H01L33/64
CPC分类号： H01L25/167 , H01L33/62 , H01L33/64 , H01L2224/16 , H01L2224/16225 , H01L2924/00014 , H01L2924/12041 , H01L2224/0401
摘要： The present invention relates to a LED module (10) comprising a substrate (12), at least one LED chip (20) mounted on a first side of said substrate, and an optical element (21) covering the LED chip(s) (20). The substrate (12) is further provided with at least one via channel (22) extending from the first side of the substrate to a second opposite side of the substrate, whereby the via channel(s) is provided with conducting means for electrically connecting the at least one LED chip (20) to a control circuit (32). By providing the substrate with via channels with conducting means, the control circuit may be connected at the second side (the bottom side) or at the edge of the substrate. Thus, no top mounted electrical interface is required from the substrate, which is advantageous with respect to miniaturization, light emission, etcetera.
摘要翻译：本发明涉及一种LED模块（10），其包括基板（12），安装在所述基板的第一侧上的至少一个LED芯片（20）以及覆盖所述LED芯片（一个或多个）的光学元件（21） 20）。衬底（12）还设置有从衬底的第一侧延伸到衬底的第二相对侧的至少一个通孔通道（22），其中通孔通道设置有用于将至少一个LED芯片（20）连接至控制电路（32）。通过提供具有导电装置的通孔通道的衬底，控制电路可以连接在衬底的第二侧（底侧）或边缘处。因此，不需要来自基板的顶部安装的电接口，这在小型化，发光等方面是有利的。

10. 发明申请

WO2006013503A2 LIGHT EMITTING DIODE ASSEMBLY 审中-公开
标题翻译：发光二极管组件
公开(公告)号：WO2006013503A2
公开(公告)日：2006-02-09
申请号：PCT/IB2005052412
申请日：2005-07-19
申请人： KONINKL PHILIPS ELECTRONICS NV , HOELEN CHRISTOPH G A , VAN OS KOEN , TREURNIET THEODOOR C , VAN LIER EDWIN , ANSEMS JOHANNES P M
发明人： HOELEN CHRISTOPH G A , VAN OS KOEN , TREURNIET THEODOOR C , VAN LIER EDWIN , ANSEMS JOHANNES P M
IPC分类号： H01L35/00 , H01L33/64
CPC分类号： H01L33/641 , H01L25/0753 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A light emitting diode (LED) assembly, comprising a metal substrate which is partly covered on one side with a dielectric layer on which an electric circuit is present, and a multitude of LED units each comprising a LED chip, wherein each LED unit is mounted in a gap in said dielectric layer on the metal substrate by a heat conducting adhesive layer, wherein electrical conductors connect each LED unit with the electric circuit on the adjacent dielectric layer, and wherein at least two LED units are mounted together in one gap in the dielectric layer.
摘要翻译：一种发光二极管（LED）组件，包括金属基板，该金属基板在一侧部分地覆盖有存在电路的电介质层，以及多个LED单元，每个LED单元包括LED芯片，其中每个LED单元被安装在金属基板上的导电粘合剂层中的所述电介质层的间隙中，其中电导体将每个LED单元与相邻电介质层上的电路连接，并且其中至少两个LED单元一起安装在一个间隙中电介质层。

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