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1. 发明申请

WO2008088570A1 REINFORCING STRUCTURES FOR THIN-FILM PHOTOVOLTAIC DEVICE SUBSTRATES, AND ASSOCIATED METHODS 审中-公开
标题翻译：薄膜光电器件基板的增强结构及相关方法
公开(公告)号：WO2008088570A1
公开(公告)日：2008-07-24
申请号：PCT/US2007/066902
申请日：2007-04-18
申请人： ITN ENERGY SYSTEMS, INC. , DOW CORNING CORPORATION , WOODS, Lawrence, M. , ARMSTRONG, Joseph, H. , RIBELIN, Rosine, M. , BARNARD, Thomas, Duncan , HARIMOTO, Yukinari , HATANAKA, Hidekatsu , ITOH, Maki , KATSOULIS, Dimitris, Elias , SUTO, Michitaka , ZHU, Bizhong , ANDERSON, Nicole, R. , REESE, Herschel, Henry
发明人： WOODS, Lawrence, M. , ARMSTRONG, Joseph, H. , RIBELIN, Rosine, M. , BARNARD, Thomas, Duncan , HARIMOTO, Yukinari , HATANAKA, Hidekatsu , ITOH, Maki , KATSOULIS, Dimitris, Elias , SUTO, Michitaka , ZHU, Bizhong , ANDERSON, Nicole, R. , REESE, Herschel, Henry
IPC分类号： H01L31/02 , H01L31/042
CPC分类号： H01L31/0392 , H01L31/03921 , H01L31/03928 , H01L31/046 , H01L31/0463 , H01L31/0749 , Y02E10/541
摘要： In an embodiment, one reinforced substrate for use in a photovoltaic device includes a polymer base material and a reinforcing structure bonded with the base material. The reinforced substrate presents a surface in a condition that is made-ready for deposition of thin film layers of the photovoltaic device. A thin film photovoltaic device includes the reinforced substrate, a back contact layer formed on the surface of the reinforced substrate, and a solar absorber layer formed on the back contact layer. A plurality of thin film photovoltaic devices may be formed on a common reinforced substrate. A process of producing a reinforced substrate includes combining a fluid base material and a fiber reinforcing structure to form an impregnated fiber reinforcement. The impregnated fiber reinforcement is cured to form the reinforced substrate, and the reinforced substrate is annealed.
摘要翻译：在一个实施例中，用于光伏器件的一个增强衬底包括聚合物基材和与基材结合的增强结构。增强的基底呈现出一个表面，该表面处于准备好沉积光伏器件的薄膜层的状态。薄膜光伏器件包括增强衬底，形成在增强衬底的表面上的背接触层和形成在后接触层上的太阳能吸收层。多个薄膜光伏器件可以形成在共同的增强衬底上。制造增强基材的方法包括组合流体基材和纤维增强结构以形成浸渍的纤维增强材料。浸渍的纤维增强材料被固化以形成增强的基底，并且加强的基底被退火。

2. 发明申请

WO2007123898A1 COPPER INDIUM DISELENIDE-BASED PHOTOVOLTAIC DEVICE AND METHOD OF PREPARING THE SAME 审中-公开
标题翻译：铜箔基紫外线照射器件及其制备方法
公开(公告)号：WO2007123898A1
公开(公告)日：2007-11-01
申请号：PCT/US2007/009359
申请日：2007-04-18
申请人： DOW CORNING CORPORATION , ITN ENERGY SYSTEMS, INC. , BARNARD, Thomas, Duncan , HARIMOTO, Yukinari , HATANAKA, Hidekatsu , ITOH, Maki , KATSOULIS, Dimitris, Elias , SUTO, Michitaka , ZHU, Bizhong , WOODS, Lawrence, M. , ARMSTRONG, Joseph, H. , RIBELIN, Rosine, M.
发明人： BARNARD, Thomas, Duncan , HARIMOTO, Yukinari , HATANAKA, Hidekatsu , ITOH, Maki , KATSOULIS, Dimitris, Elias , SUTO, Michitaka , ZHU, Bizhong , WOODS, Lawrence, M. , ARMSTRONG, Joseph, H. , RIBELIN, Rosine, M.
IPC分类号： H01L31/0336 , H01L31/032 , H01L31/072 , C08L83/04
CPC分类号： H01L31/0322 , C08G77/12 , C08G77/16 , C08G77/20 , C08L83/04 , H01L31/072 , H01L31/0749 , Y02E10/541 , C08L83/00
摘要： A copper indium diselenide (CIS)-based photovoltaic device includes a CIS- based solar absorber layer including copper, indium, and selenium. The CIS-based photovoltaic device further includes a substrate including a silicone layer formed from a silicone composition and a metal foil layer. The substrate, due to the presence of the silicone layer and the metal foil layer, is both flexible and sufficiently able to withstand annealing temperatures in excess of 500 °C to obtain maximum efficiency of the device.
摘要翻译：基于铜铟锡（CIS）的光伏器件包括基于CIS的太阳能吸收层，包括铜，铟和硒。所述基于CIS的光电装置还包括由硅氧烷组合物和金属箔层形成的硅氧烷层的基板。由于硅树脂层和金属箔层的存在，衬底既柔软又足以承受超过500℃的退火温度，以获得器件的最大效率。

3. 发明申请

WO2011083879A1 CURED ORGANOPOLYSILOXANE RESIN FILM HAVING GAS BARRIER PROPERTIES AND METHOD OF PRODUCING THE SAME 审中-公开
标题翻译：具有气体阻隔性的固化有机聚硅氧烷树脂膜及其制造方法
公开(公告)号：WO2011083879A1
公开(公告)日：2011-07-14
申请号：PCT/JP2011/050608
申请日：2011-01-07
申请人： DOW CORNING TORAY CO., LTD. , DOW CORNING CORPORATION , ITOH, Maki , SUTO, Michitaka , ZHU, Bizhong , KATSOULIS, Dimitris, Elias , ZAMBOV, Ludmil
发明人： ITOH, Maki , SUTO, Michitaka , ZHU, Bizhong , KATSOULIS, Dimitris, Elias , ZAMBOV, Ludmil
IPC分类号： C09D183/04 , C08J5/04
CPC分类号： C09D183/04 , C08J5/24 , C08J2383/04 , Y10T428/31663 , Y10T442/2098
摘要： A cured organopolysiloxane resin film having gas barrier properties comprising a fiber-reinforced film made of a hydrosilylation-cured organopolysiloxane resin and having a transparent inorganic layer selected from silicon oxynitride layer, silicon nitride layer, and silicon oxide layer formed on the fiber-reinforced film wherein a layer of cured organopolysiloxane that contains an organic functional group, silanol group, hydrosilyl group, or an organic group produced by the polymerization of polymerizable organic functional groups is interposed between said fiber-reinforced film and inorganic layer. Also, a method of producing this cured organopolysiloxane resin film having gas barrier properties.
摘要翻译：具有阻气性的固化的有机聚硅氧烷树脂膜包含由氢化硅烷化固化的有机聚硅氧烷树脂制成的纤维增强膜，并且具有选自形成在纤维增强膜上的氧氮化硅层，氮化硅层和氧化硅层的透明无机层其中含有有机官能团，硅烷醇基，氢化硅烷基或通过可聚合有机官能团的聚合制备的有机基团的固化的有机聚硅氧烷层被插入在所述纤维增强膜和无机层之间。另外，制造具有阻气性的固化的有机聚硅氧烷树脂膜的方法。

4. 发明申请

WO2006088645A1 REINFORCED SILICONE RESIN FILM AND METHOD OF PREPARING SAME 审中-公开
标题翻译：增强硅树脂薄膜及其制备方法
公开(公告)号：WO2006088645A1
公开(公告)日：2006-08-24
申请号：PCT/US2006/003535
申请日：2006-02-01
申请人： DOW CORNING CORPORATION , DOW CORNING TORAY CO., LTD. , BAILEY, Debbie , KATSOULIS, Dimitris, Elias , SUTO, Michitaka , ZHU, Bizhong
发明人： BAILEY, Debbie , KATSOULIS, Dimitris, Elias , SUTO, Michitaka , ZHU, Bizhong
IPC分类号： C08L83/04 , B32B25/20
CPC分类号： C08J5/04 , C08J2383/04 , C08L83/04 , C08L83/00
摘要： A method of preparing a reinforced silicone resin film, the method comprising the steps of impregnating a fiber reinforcement in a condensation-curable silicone composition comprising a silicone resin, and curing the silicone resin in the condensation-curable silicone composition of the impregnated fiber reinforcement; wherein the reinforced silicone resin film comprises from 10 to 99% (w/w) of the cured silicone resin and the film has a thickness of from 15 to 500 μm; and a reinforced silicone resin film prepared according to the method.
摘要翻译：一种制备增强有机硅树脂膜的方法，所述方法包括以下步骤：将纤维增强物浸渍在包含硅树脂的可缩合固化的硅氧烷组合物中，并使浸渍的纤维增强物的可缩合固化的硅氧烷组合物中的硅树脂固化; 其中所述增强硅树脂膜包含10至99％（w / w）的所述固化的有机硅树脂，并且所述膜具有15至500μm的厚度; 和根据该方法制备的增强硅树脂膜。

5. 发明申请

WO2006088646A1 REINFORCED SILICONE RESIN FILM AND METHOD OF PREPARING SAME 审中-公开
标题翻译：增强硅树脂薄膜及其制备方法
公开(公告)号：WO2006088646A1
公开(公告)日：2006-08-24
申请号：PCT/US2006/003536
申请日：2006-02-01
申请人： DOW CORNING CORPORATION , DOW CORNING TORAY CO., LTD. , BAILEY, Debbie , KATSOULIS, Dimitris, Elias , SUTO, Michitaka , ZHU, Bizhong
发明人： BAILEY, Debbie , KATSOULIS, Dimitris, Elias , SUTO, Michitaka , ZHU, Bizhong
IPC分类号： C08L83/04 , B32B25/20
CPC分类号： C08J5/04 , C08J5/24 , C08J2383/04
摘要： A method of preparing a reinforced silicone resin film, the method comprising the steps of impregnating a fiber reinforcement in a hydrosilylation-curable silicone composition comprising a silicone resin, and heating the impregnated fiber reinforcement at a temperatu sufficient to cure the silicone resin, wherein the reinforced silicone resin film comprises fro 10 to 99% (w/w) of the cured silicone resin and the film has a thickness of from 15 to 500 μm; and a reinforced silicone resin film prepared according to the method.
摘要翻译：一种制备增强有机硅树脂膜的方法，所述方法包括以下步骤：将纤维增强物浸渍在包含有机硅树脂的氢化硅烷化可固化的有机硅组合物中，并在足以固化硅树脂的温度下加热浸渍的纤维增强体，其中增强的有机硅树脂膜包含10至99％（w / w）的固化的有机硅树脂，并且该膜具有15至500μm的厚度; 和根据该方法制备的增强硅树脂膜。

6. 发明申请

WO2010004932A1 CURED ORGANOPOLYSILOXANE RESIN FILM HAVING GAS BARRIER PROPERTIES AND METHOD OF PRODUCING THE SAME 审中-公开
标题翻译：具有气体阻隔性能的固化有机聚硅氧烷树脂膜及其制造方法
公开(公告)号：WO2010004932A1
公开(公告)日：2010-01-14
申请号：PCT/JP2009/062174
申请日：2009-06-26
申请人： DOW CORNING TORAY CO., LTD. , DOW CORNING CORPORATION , ITOH, Maki , SUTO, Michitaka , KUSHIBIKI, Nobuo , HATANAKA, Hidekatsu , EGUCHI, Katsuya , KATSOULIS, Elias Dimitris
发明人： ITOH, Maki , SUTO, Michitaka , KUSHIBIKI, Nobuo , HATANAKA, Hidekatsu , EGUCHI, Katsuya , KATSOULIS, Elias Dimitris
IPC分类号： B32B27/08 , C08J7/04 , C08L83/04 , G02F1/1333
CPC分类号： C08J7/045 , C08J2383/04 , C08L83/04 , Y10T428/31515 , Y10T428/31663 , C08L83/00
摘要： A cured organopolysiloxane resin film having gas barrier properties in which a layer of cured organopolysiloxane that contains an organic functional group, an organic group produced by the polymerization of polymerizable organic functional groups, or the hydrosilyl group or silanol group, is formed on a visible region-transparent film comprising cured organopolysiloxane resin yielded by hydrosilylation reaction-mediated crosslinking, and in which a silicon oxynitride layer, silicon nitride layer, or silicon oxide layer is formed on the aforementioned layer of cured organopolysiloxane. Also, a method of producing this cured organopolysiloxane resin film having gas barrier properties.
摘要翻译：具有气体阻隔性的固化的有机聚硅氧烷树脂膜，其中包含有机官能团的固化的有机聚硅氧烷层，通过可聚合的有机官能团聚合产生的有机基团或氢化硅烷基或硅烷醇基团形成在包含通过氢化硅烷化反应介导的交联获得的固化的有机聚硅氧烷树脂的可见光透射区域的膜上，并且其中在上述固化的有机基聚硅氧烷层上形成氮氧化硅层，氮化硅层或氧化硅层。此外，还提供了这种具有阻气性的固化的有机聚硅氧烷树脂膜的制造方法。

7. 发明申请

WO2009044938A2 METHOD OF FORMING A CERAMIC SILICON OXIDE TYPE COATING, METHOD OF PRODUCING AN INORGANIC BASE MATERIAL, AGENT FOR FORMING A CERAMIC SILICON OXIDE TYPE COATING, AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：形成陶瓷氧化硅类型涂层的方法，生产无机基材的方法，形成陶瓷氧化硅类型涂层的代理和半导体器件
公开(公告)号：WO2009044938A2
公开(公告)日：2009-04-09
申请号：PCT/JP2008/068509
申请日：2008-10-03
申请人： Dow Corning Toray Co., Ltd. , Dow Corning Corporation , HARIMOTO, Yukinari , MICHINO, Tetsuyuki , KATSOULIS, Elias, Dimitris , KUSHIBIKI, Nobuo , SUTO, Michitaka
发明人： HARIMOTO, Yukinari , MICHINO, Tetsuyuki , KATSOULIS, Elias, Dimitris , KUSHIBIKI, Nobuo , SUTO, Michitaka
IPC分类号： C09D183/04 , H01L31/0216 , C09D183/05 , C23C18/12
CPC分类号： H01L21/316 , C09D183/04 , C23C18/1208 , C23C18/122 , C23C18/1241 , C23C18/1279 , C23C2222/20 , H01L21/02126 , H01L21/02216 , H01L21/02282 , H01L21/3122 , Y02E10/541
摘要： A method of forming a ceramic silicon oxide type coating and a method of producing an inorganic base material having this coating, by coating an organohydrogensiloxane/hydrogensiloxane copolymer on the surface of an inorganic base material and converting the coating into a ceramic silicon oxide type coating by heating to high temperatures in an inert gas or an oxygen-containing inert gas (oxygen gas less than 20 volume%). A coating-forming agent comprising an organohydrogensiloxane/hydrogensiloxane copolymer or its solution. A semiconductor device comprising at least a semiconductor layer formed on a silicon oxide type coating on an inorganic substrate.
摘要翻译：一种形成陶瓷氧化硅类涂层的方法以及具有这种涂层的无机基材的制造方法，通过在无机基材的表面上涂布有机氢硅氧烷/氢硅氧烷共聚物，并将涂层转化为陶瓷氧化硅类涂层，在惰性气体或含氧惰性气体（氧气小于20体积％）中加热至高温。包含有机氢硅氧烷/氢硅氧烷共聚物或其溶液的涂层形成剂。一种半导体器件，其至少包括在无机基板上的氧化硅类型的涂层上形成的半导体层。

8. 发明申请

WO2010129123A2 VINYLHYDROGENPOLYSILOXANE ADHESIVE COMPOSITION 审中-公开
标题翻译：乙烯基硅氧烷粘合剂组合物
公开(公告)号：WO2010129123A2
公开(公告)日：2010-11-11
申请号：PCT/US2010/030023
申请日：2010-04-06
申请人： DOW CORNING CORPORATION , GREER, Nathan , SHOPE, Marilyn , SUTO, Michitaka , ZHONG, Bianxiao , ZHU, Bizhong
发明人： GREER, Nathan , SHOPE, Marilyn , SUTO, Michitaka , ZHONG, Bianxiao , ZHU, Bizhong
IPC分类号： B32B27/28
CPC分类号： C08G77/20 , B32B17/10 , B32B27/28 , B32B2383/00 , C08G77/12 , Y10T428/24802
摘要： Vinylhydrogenpolysiloxanes are provided. The vinylhydrogenpolysiloxanes comprise organopolysiloxanes having at least two silicon-bonded hydrogen atoms and at least two silicon-bonded vinyl groups. As a fraction of the total number of silicon atoms in the vinylhydrogenpolysiloxanes, about 25% to about 90% of the silicon atoms are bonded to a hydrogen atom and about 10% to about 45% are bonded to a vinyl group. The ratio of the number of silicon-bonded hydrogen groups to the number of silicon-bonded vinyl groups is about 1.3 to about 6. Also provided are silicone compositions comprising at least one vinylhydrogenpolysiloxane and a hydrosilylation catalyst; silicone adhesives comprising a cured product of at least one vinylhydrogenpolysiloxane; and laminates comprising at least one such silicone adhesive. When subjected to high temperatures or direct flame, the vinylhydrogenpolysiloxanes form chars that retain adhesion to various substrates.
摘要翻译：提供乙烯基聚硅氧烷。乙烯基氢聚硅氧烷包括具有至少两个与硅键合的氢原子和至少两个与硅键合的乙烯基的有机聚硅氧烷。作为乙烯基聚硅氧烷中硅原子总数的一部分，约25％至约90％的硅原子与氢原子结合，约10％至约45％与乙烯基结合。与硅键合的乙烯基基团的数量的比例为约1.3至约6.还提供了包含至少一种乙烯基氢聚硅氧烷和氢化硅烷化催化剂的硅氧烷组合物; 包含至少一种乙烯基氢聚硅氧烷的固化产物的硅氧烷粘合剂; 以及包含至少一种这种硅氧烷粘合剂的层压材料。当经受高温或直接火焰时，乙烯基氢聚硅氧烷形成保留对各种基材的粘合性的炭。

9. 发明申请

WO2012078582A1 SILOXANE COMPOSITIONS INCLUDING METAL-OXIDE NANOPARTICLES SUITABLE FOR FORMING ENCAPSULANTS 审中-公开
标题翻译：含有金属氧化物纳米粒子的硅氧烷组合物，适用于形成包封剂
公开(公告)号：WO2012078582A1
公开(公告)日：2012-06-14
申请号：PCT/US2011/063446
申请日：2011-12-06
申请人： DOW CORNING CORPORATION , DOW CORNING TORAY CO., LTD. , HARKNESS, Brian, R. , NORRIS, Ann, W. , THURSTON, Shellene, K. , AMAKO, Masaaki , ITOH, Maki , SUTO, Michitaka
发明人： HARKNESS, Brian, R. , NORRIS, Ann, W. , THURSTON, Shellene, K. , AMAKO, Masaaki , ITOH, Maki , SUTO, Michitaka
IPC分类号： C08G77/20 , C08L83/04 , C08K3/20 , C09D7/12 , H01L23/29
CPC分类号： H01L33/56 , C08G77/20 , C08K3/22 , C08L83/04 , C09D7/61 , C09D7/67 , H01L23/3171 , H01L2924/0002 , H01L2924/00
摘要： A composition includes an organopolysiloxane component (A) having at least one aryl group and having an average of at least two alkenyl groups per molecule. The composition further includes an organohydrogensiloxane component (B) having at least one of an alkyl group and an aryl group and an average of at least two silicon-bonded hydrogen atoms per molecule. Components (A) and (B) each independently have a number average molecular weight less than or equal to 1500. The composition yet further includes a catalytic amount of a hydrosilylation catalyst component (C), and metal-oxide nanoparticles (D) other than titanium dioxide (TiO 2 ) nanoparticles. The composition has a molar ratio of alkyl groups to aryl groups ranging from 1:0.25 to 1:3.0. A product of the present invention is the reaction product of the composition, which may be used to make a light emitting diode.
摘要翻译：组合物包括每分子具有至少一个芳基并且平均具有至少两个烯基的有机聚硅氧烷组分（A）。该组合物还包括具有烷基和芳基中的至少一个并且每个分子具有至少两个与硅键合的氢原子平均的有机氢硅氧烷组分（B）。组分（A）和（B）各自独立地具有小于或等于1500的数均分子量。该组合物还包括催化量的氢化硅烷化催化剂组分（C）和金属氧化物纳米颗粒（D）二氧化钛（TiO2）纳米粒子。该组合物的烷基与芳基的摩尔比范围为1:0.25至1:3.0。本发明的产品是可用于制造发光二极管的组合物的反应产物。

10. 发明申请

WO2013103330A2 SILICONE COMPOSITION, SILICONE ADHESIVE, COATED AND LAMINATED SUBSTRATES 审中-公开
标题翻译：硅胶组合物，硅胶，涂层和层压基材
公开(公告)号：WO2013103330A2
公开(公告)日：2013-07-11
申请号：PCT/US2011/066350
申请日：2011-12-21
申请人： DOW CORNING CORPORATION , SHOPE, Marilyn , SUTO, Michitaka , ZHONG, Bianxiao , ZHU, Bizhong
发明人： SHOPE, Marilyn , SUTO, Michitaka , ZHONG, Bianxiao , ZHU, Bizhong
IPC分类号： B32B17/10
CPC分类号： C09J183/06 , B32B17/067 , C08G77/12 , C08G77/20 , C09J183/04 , Y10T428/249921 , Y10T428/2848 , Y10T428/2852 , Y10T442/2746
摘要： A silicone composition and more particularly to a silicone composition comprising at least one organosilicon compound having an average of at least two silicon-bonded hydrogen atoms per molecule, at least one silicone resin having the formula (R 1 R 4 R 5 SiO 1/2 ) w (R 1 2 Si0 2/2 ) x (R 4 Si0 3/2 ) y (Si0 4/2 ) z (II), wherein R 1 is C 1 to C 10 hydrocarbyl or C 1 to C 10 halogen-substituted hydrocarbyl, both free of aliphatic unsaturation, R 4 is C 2 to C 4 alkenyl, R 5 is R 1 or R 4 , w is from 0.01 to 0.6, x is from 0 to 0.5, y is from 0.1 to 0.95, z is from 0 to 0.4, and w+x+y+z)=1, and a hydrosilylation catalyst; a silicone adhesive comprising a cured product of the silicone composition, and a coated substrate and a laminated substrate, each comprising the silicone adhesive.
摘要翻译：一种硅氧烷组合物，更具体地说，涉及一种含有至少一种有机硅化合物的有机硅组合物，每个分子具有平均至少两个与硅键合的氢原子，至少一种具有式（R1R4R5SiO1 / 2）w（R1S2O2 / 2 ）x（R 4 SiO 3/2）y（SiO 4/2）z（II）其中R 1为C 1至C 10烃基或C 1至C 10卤素取代的烃基，均不含脂族不饱和基团，R 4为C 2至C 4烯基，R 5为R 1 或R4，w为0.01〜0.6，x为0〜0.5，y为0.1〜0.95，z为0〜0.4，w + x + y + z）= 1，氢化硅烷化催化剂; 包含硅氧烷组合物的固化产物的硅氧烷粘合剂，以及涂覆的基材和层压基材，各自包含硅氧烷粘合剂。

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