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1. 发明申请

WO02093639A3 ARRANGEMENT AND METHOD FOR DETECTING DEFECTS ON A SUBSTRATE IN A PROCESSING TOOL 审中-公开
标题翻译：用于检测处理工具中基板上的缺陷的布置和方法
公开(公告)号：WO02093639A3
公开(公告)日：2003-03-20
申请号：PCT/EP0205189
申请日：2002-05-10
申请人： INFINEON TECHNOLOGIES AG , SEIDEL TORSTEN , OTTO RALF , SCHUMACHER KARL , SCHEDEL THORSTEN , MARX ECKHARD , HRASCHAN GUENTHER
发明人： SEIDEL TORSTEN , OTTO RALF , SCHUMACHER KARL , SCHEDEL THORSTEN , MARX ECKHARD , HRASCHAN GUENTHER
IPC分类号： G03F1/08 , G03F7/20 , H01L21/00 , H01L21/027 , H01L21/66 , H01L21/677
CPC分类号： H01L21/67225 , G03F7/7065 , H01L21/67271 , H01L21/67288 , H01L22/12
摘要： A processing tool (1) for manufacturing semiconductor devices (2), e.g. a lithography cluster, comprises a device transfer area (8) with an optical sensor (10), preferably a CCD-camera, and an illumination system (11) mounted within, such that a substrate (2) being transferred to or from one of its processing chambers (1a, 1b, 1c) can be scanned during its movement at low resolution. The substrate (2) may be either a semiconductor wafer to be manufactured or a reticle or mask used to perform an exposure on said wafer. The scanning is performed twice, prior and after processing in at least one the processing chambers (1a, 1b, 1c) of the processing tool (1). Both images are compared and optionally subtracted from each other. Defects imposed to the substrate due to contaminating particles only during the present processes with sizes larger than 10 microm are visible on the subtracted image, while defects imposed earlier are diminished as well as structures formed from e.g. a mask pattern below 10 microm. Pattern recognition allows an efficient classification of the defects being just detected in a processing tool (1). Thus, semiconductor device yield and metrology capacity are advantageously increased.
摘要翻译：一种用于制造半导体器件（2）的加工工具（1），例如，光刻簇包括具有光学传感器（10）的装置传送区域（8），优选地是CCD照相机，以及安装在其内的照明系统（11），使得基板（2）被转移到其处理室（1a，1b，1c）可以在其低分辨率的运动期间被扫描。衬底（2）可以是要制造的半导体晶片或用于在所述晶片上进行曝光的掩模版或掩模。在处理工具（1）的至少一个处理室（1a，1b，1c）中处理之前和之后进行两次扫描。两个图像被比较并且可选地相互减去。仅在尺寸大于10微米的本工艺过程中由于污染颗粒而施加到基材上的缺陷在减去的图像上是可见的，而较早施加的缺陷以及由例如形成的结构减少。 10微米以下的掩模图案。模式识别允许在处理工具（1）中刚刚检测到的缺陷的有效分类。因此，有利地增加了半导体器件的产量和计量能力。

2. 发明申请

WO02065509A8 MEASUREMENT ARRANGEMENT 审中-公开
标题翻译：测量安排
公开(公告)号：WO02065509A8
公开(公告)日：2003-02-27
申请号：PCT/EP0115346
申请日：2001-12-27
申请人： INFINEON TECHNOLOGIES SC300 , ABRAHAM MICHAEL , MARX ECKHARD
发明人： ABRAHAM MICHAEL , MARX ECKHARD
IPC分类号： H01L21/00 , H01L21/02 , H01L21/677
CPC分类号： H01L21/67253 , H01L21/67772
摘要： A measurement device (1), i.e. a metrology tool, and a vehicle (2) are combined to provide a mobile metrology in a fabrication facility. Peripheral equipment such as a device transfer unit (3), for, e.g., FOUPs in semiconductor manufacturing, an electronic control system (5) with, e.g., a PC, monitor and keyboard and optionally a vacuum pump (9) is also provided in module frames of the vehicle (2). The measurement arrangement particularly reduces bottleneck situations in equipment qualifying of processing tools (40) during fast ramp-up phases of, e.g., semiconductor manufacturing facilities, thereby saving costs. The construction is based on PGVs or AGVs and allows a fast operation directly at the location of a processing tool (40). With the possible exception of power supply or operator control, the measurement arrangement can operate fully autonomous.
摘要翻译：组合测量装置（1），即计量工具和车辆（2），以在制造设备中提供移动计量。诸如设备传送单元（3）的外围设备，例如用于半导体制造中的FOUP，具有例如PC，监视器和键盘以及可选的真空泵（9）的电子控制系统（5）也被提供在车辆（2）的模块框架。测量装置特别减少了在例如半导体制造设备的快速上升阶段期间加工工具（40）的设备合格性中的瓶颈情况，从而节省成本。该结构基于PGV或AGV，并且允许在加工工具（40）的位置处直接快速操作。除了电源或操作者控制之外，测量装置可以完全自主地运行。

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