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    • 1. 发明申请
    • SPUTTERING TARGET CONSTRUCTIONS
    • 溅射目标结构
    • WO2005007924A1
    • 2005-01-27
    • PCT/US2004/021362
    • 2004-07-02
    • HONEYWELL INTERNATIONAL INC.HORT, Werner, H.JAEYEON, Kim
    • HORT, Werner, H.JAEYEON, Kim
    • C23C14/34
    • H01J37/3414C23C14/3407H01J37/3435
    • The invention includes a physical vapor deposition target having an inner radial portion which has a radius extending from a center point of the target to an outer edge of a sputtering region. The deposition target has a flange region surrounding the inner radial portion. Two channels are positioned within the flange region with one of the channels being configured to receive an o-ring. The invention also includes a sputtering target having a flange region with a planar flange surface and having an o-ring channel disposed within the flange region. The o-ring channel has a pair of opposing channel walls and a base surface with a portion of the base surface being non-parallel relative to the planar flange surface. Invention further includes a physical vapor deposition target backing plate having an o-ring groove and a stress relief groove, and target assemblies which utilize such backing plate.
    • 本发明包括具有内径向部分的物理气相沉积靶,其具有从靶的中心点延伸到溅射区的外边缘的半径。 沉积靶具有围绕内部径向部分的凸缘区域。 两个通道位于凸缘区域内,其中一个通道被配置为接收O形环。 本发明还包括具有凸缘区域的溅射靶,其具有平坦的凸缘表面并且具有设置在凸缘区域内的O形环通道。 O形环通道具有一对相对的通道壁和基部表面,其中基部表面的一部分相对于平面凸缘表面不平行。 本发明还包括具有O形环槽和应力释放槽的物理气相沉积靶背衬板和利用这种背板的靶组件。