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1. 发明申请

WO2007134206A2 MULTI-SUBSTRATE PACKAGE ASSEMBLY 审中-公开
标题翻译：多基板封装组件
公开(公告)号：WO2007134206A2
公开(公告)日：2007-11-22
申请号：PCT/US2007/068730
申请日：2007-05-11
申请人： HONEYWELL INTERNATIONAL INC. , COLE, Barrett E. , HIGASHI, Robert E. , ZINS, Christopher J. , KRISHNANKUTTY, Subash
发明人： COLE, Barrett E. , HIGASHI, Robert E. , ZINS, Christopher J. , KRISHNANKUTTY, Subash
CPC分类号： G01J3/02 , G01J3/0256 , G01J3/26 , H01L31/02162 , H01L31/105 , H01L31/109
摘要： A multi-substrate package assembly having a first substrate, a second substrate and a package, each with a number of bond pads. The package includes a cavity for receiving either or both of the first and second substrates, with a number of bond pads positioned along at least part of the periphery of the cavity. The first substrate and the second substrate are preferably positioned in the cavity of the package, with selected bond pads of the first substrate and second substrate electrically connected to selected bond pads of the package. In some embodiments, the bond pads of the first substrate are only connected to bond pads on one or more sides of the cavity, and the bond pads of the second substrate are only connected to bond pads on one or more of the remaining sides of the cavity. The packaging assembly of the present invention can be used in many applications, including spectrally tunable optical detectors.
摘要翻译：一种具有第一基板，第二基板和封装的多基板封装组件，每个具有多个接合焊盘。该封装包括用于接收第一和第二基板中的一个或两个的空腔，其中多个接合焊盘沿着空腔的至少一部分周边定位。第一基板和第二基板优选地定位在封装的空腔中，其中第一基板和第二基板的选定的接合焊盘电连接到封装的选定的接合焊盘。在一些实施例中，第一衬底的接合焊盘仅连接到空腔的一个或多个侧面上的接合焊盘，并且第二衬底的接合焊盘仅连接到第一衬底的一个或多个侧面上的接合焊盘腔。本发明的包装组件可用于许多应用中，包括光谱可调光学检测器。

2. 发明申请

WO2007143464A2 MICROMECHANICAL THERMAL SENSOR 审中-公开
标题翻译：微电子传感器
公开(公告)号：WO2007143464A2
公开(公告)日：2007-12-13
申请号：PCT/US2007/069939
申请日：2007-05-30
申请人： HONEYWELL INTERNATIONAL INC. , WOOD, Roland A. , COX, James A. , HIGASHI, Robert E. , NUSSEIBEH, Fouad A.
发明人： WOOD, Roland A. , COX, James A. , HIGASHI, Robert E. , NUSSEIBEH, Fouad A.
CPC分类号： G01J5/12 , G01J3/42 , G01J3/4532 , G01J5/02 , G01J5/023 , G01J5/08 , G01J5/0837 , G01J5/40 , G01J2005/0077
摘要： A radiation sensor that can operate in the THz regime comprising: a micro antenna, which may comprise a two-dimensional patterned thin-film metallizations on a thin dielectric pellicle fabricated by micro machining of a silicon wafer; a thermally isolated microstructure; a coupling mechanism for coupling the energy from the micro antenna to the microstructure, the coupling mechanism providing high thermal isolation between the micro antenna and the microstructure; a temperature signal detector on the microstructure; and signal processing electronics for receiving the temperature signal and processing it into useful data.
摘要翻译：一种能够以太赫兹方式操作的辐射传感器，包括：微天线，其可以包括通过硅晶片的微加工制造的薄介电薄膜上的二维图案化薄膜金属化; 热隔离微结构; 用于将来自微天线的能量耦合到微结构的耦合机构，所述耦合机构在微天线和微结构之间提供高热隔离; 微结构的温度信号检测器; 以及用于接收温度信号并将其处理成有用数据的信号处理电子装置。

3. 发明申请

WO2009023484A2 SHELL FLOW SENSOR 审中-公开
标题翻译：壳流量传感器
公开(公告)号：WO2009023484A2
公开(公告)日：2009-02-19
申请号：PCT/US2008/072266
申请日：2008-08-06
申请人： HONEYWELL INTERNATIONAL INC. , LU, Son T. , HIGASHI, Robert E. , RIDLEY, Jeffrey A.
发明人： HIGASHI, Robert E. , RIDLEY, Jeffrey A.
CPC分类号： G01F1/6845 , G01F1/6842 , Y10T29/49002
摘要： A flow sensor system and a method for fabricating the same. A substrate is provided, comprising a detector wafer upon which a flow sensor is formed. One or more shells can then be configured upon the substrate whose walls form a flow channel. The flow channel is fabricated directly upon the substrate in a manner that allows the flow channel to couple heat transfer directly to the flow sensor in order to eliminate the need for two or more different types of sacrificial layers during the fabrication of the flow sensor upon the substrate and in which the shell(s) is coupled with fluidic measurement to provide for the flow sensor.
摘要翻译：流量传感器系统及其制造方法。提供了一种衬底，包括检测器晶片，在其上形成流量传感器。然后可以在其壁形成流动通道的基底上配置一个或多个壳体。流动通道直接制造在基板上，以允许流动通道将热传递直接耦合到流量传感器的方式，以便在流量传感器制造期间不需要两个或多个不同类型的牺牲层衬底，并且其中壳与流体测量结合以提供流量传感器。

4. 发明申请

WO2008100838A2 SHELLED THERMAL STRUCTURES FOR FLUID SENSING 审中-公开
标题翻译：用于流体感测的散热结构
公开(公告)号：WO2008100838A2
公开(公告)日：2008-08-21
申请号：PCT/US2008/053538
申请日：2008-02-11
申请人： HONEYWELL INTERNATIONAL INC. , HIGASHI, Robert E.
发明人： HIGASHI, Robert E.
IPC分类号： B81C1/00
CPC分类号： B81B3/0081 , B01L3/5027 , B01L3/502707 , B01L2200/14 , B01L2300/0627 , B01L2300/0816 , B01L2300/1827 , B81B2201/051 , B81B2201/058 , G01N30/6095 , G01N2030/025
摘要： Embodiments of the invention relate to a fluid containment structure for a micro analyzer comprising one or more shelled thermal structures in contact with a thermally isolated component of the analyzer and wherein the shelled thermal structure comprises a conformal film and also comprises three walls of a channel and the thermally isolated component forms the fourth wall.
摘要翻译：本发明的实施例涉及一种用于微分析器的流体容纳结构，其包括与分析仪的热隔离部件接触的一个或多个外壳热结构，并且其中所述带壳热结构包括保形膜，并且还包括三个通道壁和热隔离部件形成第四壁。

5. 发明申请

WO2008089121A2 A THERMAL VACUUM GAUGE 审中-公开
标题翻译：热真空计
公开(公告)号：WO2008089121A2
公开(公告)日：2008-07-24
申请号：PCT/US2008/050963
申请日：2008-01-14
申请人： HONEYWELL INTERNATIONAL INC. , HIGASHI, Robert E.
发明人： HIGASHI, Robert E.
IPC分类号： G01L21/10
CPC分类号： G01L21/10 , G01L11/002
摘要： A system for determining a gas pressure or gauging a vacuum in a hermetically sealed enclosure. One or more heater structures and one or more temperature sensor structures situated on a substrate may be used in conjunction for measuring a thermal conductivity of a gas in the enclosure. Each heater has significant thermal isolation from each sensor structure. Electronics connected to each heater and sensor of their respective structures may provide processing to calculate the pressure or vacuum in the enclosure. The enclosure may contain various electronic components such as bolometers.
摘要翻译：用于确定气体压力或在气密密封的外壳中测量真空的系统。位于基板上的一个或多个加热器结构和一个或多个温度传感器结构可以结合用于测量外壳中的气体的导热性。每个加热器具有与每个传感器结构相当的热隔离。连接到每个加热器和各自结构的传感器的电子器件可提供计算外壳中的压力或真空度的处理。外壳可能包含各种电子部件，如辐射热计。

6. 发明申请

WO2018111652A1 POLYCRYSTALLINE TUNGSTEN TRIOXIDE THIN FILM GAS SENSOR DECORATED WITH GOLD ISLANDS AND FABRICATION METHOD THEREOF 审中-公开
公开(公告)号：WO2018111652A1
公开(公告)日：2018-06-21
申请号：PCT/US2017/064930
申请日：2017-12-06
申请人： HONEYWELL INTERNATIONAL INC.
发明人： HIGASHI, Robert E. , NEWSTROM-PEITSO, Karen M.
IPC分类号： G01N27/12 , G01N33/00
摘要： A gas sensor that includes a heat source and a gas sensing film. The gas sensing film includes a polycrystalline tungsten trioxide film thermally connected to the heat source and a plurality of islands of gold on a surface of the polycrystalline tungsten trioxide film. The surface of the polycrystalline tungsten trioxide film is exposed between the islands of gold to allow the polycrystalline tungsten trioxide film to sense gas. A first electrode that electrically connected to the polycrystalline tungsten trioxide film and a second electrode is electrically connected to the polycrystalline tungsten trioxide film. The resistance of the polycrystalline tungsten trioxide film between the first electrode and the second electrode changes when the polycrystalline tungsten trioxide film is exposed to a particular type of gas.

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