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    • 8. 发明申请
    • SPUTTER TARGETS
    • SPUTTER目标
    • WO0231218B1
    • 2003-03-20
    • PCT/US0132019
    • 2001-10-11
    • HONEYWELL INT INC
    • LI JIANXINGPINTER MICHAEL RWU CHI TSE
    • C23C14/34C25D7/04H01J37/34
    • H01J37/342C23C14/3414C25D7/04
    • The invention encompasses a method of forming a container-shaped physical vapor deposition target. A conductive material (56) is provided in a container-shape. The container-shape comprises an interior region and an exterior region, and the conductive material comprises an interior surface along the interior region as well as an exterior surface alon44the exterior region. A sputtering material is electrolytically deposited on at least one of the interior and exterior surfaces of the container-shaped conductive material. The invention also encompasses a container-shaped physical vapor deposition target. The target includes a first conductive material in a container-shape, with the container-shape comprising an interior region and an exterior region. The first conductive material comprises an interior surface (62) along the interior region of the container-shape and an exterior surface (64) along the exterior region of the container shape. The physical vapor deposition target further includes a second conductive material on an entirety of at least one of the interior and exterior surfaces of the first conductive material, with the second conductive material having at least one different metallurgical property than the first conductive material.
    • 本发明包括形成容器状物理气相沉积靶的方法。 导电材料(56)设置成容器形状。 容器形状包括内部区域和外部区域,并且导电材料包括沿内部区域的内表面以及外部区域的外部表面。 溅射材料电解沉积在容器形导电材料的至少一个内表面和外表面上。 本发明还包括容器形物理气相沉积靶。 靶包括容器形状的第一导电材料,容器形状包括内部区域和外部区域。 第一导电材料包括沿着容器形状的内部区域的内表面(62)和沿着容器形状的外部区域的外表面(64)。 物理气相沉积靶还包括在第一导电材料的内表面和外表面的至少一个整体上的第二导电材料,其中第二导电材料具有比第一导电材料至少一种不同的冶金特性。
    • 9. 发明申请
    • CONTAINER-SHAPED PHYSICAL VAPOR DEPOSITION TARGETS, AND METHODS OF FORMING CONTAINER-SHAPED PHYSICAL VAPOR DEPOSITION TARGETS
    • 容器形状的物理蒸气沉积目标和形成容器形状的物理蒸气沉积目标的方法
    • WO0231218A2
    • 2002-04-18
    • PCT/US0132019
    • 2001-10-11
    • HONEYWELL INT INC
    • LI JIANXINGPINTER MICHAEL RWU CHI TSE
    • C23C14/34C25D7/04
    • H01J37/342C23C14/3414C25D7/04
    • The invention encompasses a method of forming a container-shaped physical vapor deposition target. A conductive material is provided in a container-shape. The container-shape comprises an interior region and an exterior region, and the conductive material comprises an interior surface along the interior region as well as an exterior surface along the exterior region. A sputtering material is electrolytically deposited on at least one of the interior and exterior surfaces of the container-shaped conductive material. The invention also encompasses a container-shaped physical vapor deposition target. The target includes a first conductive material in a container-shape, with the container-shape comprising an interior region and an exterior region. The first conductive material comprises an interior surface along the interior region of the container-shape and an exterior surface along the exterior region of the container shape. The physical vapor deposition target further includes a second conductive material on an entirety of at least one of the interior and exterior surfaces of the first conductive material, with the second conductive material having at least one different metallurgical property than the first conductive material.
    • 本发明包括形成容器状物理气相沉积靶的方法。 导电材料设置成容器形状。 容器形状包括内部区域和外部区域,并且导电材料包括沿着内部区域的内表面以及沿着外部区域的外部表面。 溅射材料电解沉积在容器形导电材料的至少一个内表面和外表面上。 本发明还包括容器形物理气相沉积靶。 靶包括容器形状的第一导电材料,容器形状包括内部区域和外部区域。 第一导电材料包括沿着容器形状的内部区域的内表面和沿着容器形状的外部区域的外表面。 物理气相沉积靶还包括在第一导电材料的内表面和外表面的至少一个整体上的第二导电材料,其中第二导电材料具有比第一导电材料至少一种不同的冶金特性。