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    • 4. 发明申请
    • COMPOSITE PROCESSORS
    • 复合处理器
    • WO2012099590A1
    • 2012-07-26
    • PCT/US2011/021891
    • 2011-01-20
    • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.BEAUSOLEIL, Raymond G.FIORENTINO, MarcoMCLAREN, MorayASTFALK, GregBINKERT, Nathan LorenzoFATTAL, David A.
    • BEAUSOLEIL, Raymond G.FIORENTINO, MarcoMCLAREN, MorayASTFALK, GregBINKERT, Nathan LorenzoFATTAL, David A.
    • G06F15/16
    • G06F15/80G06E3/00G06F3/00G06F13/4063
    • In one example, a composite processor (100) includes a circuit board (1200), a first processor element package (1230), and a second processor element package (1240). The circuit board has an optical link (1211) and an electrical link (1221). The first processor element package (1230) includes a substrate (1231) with an integrated circuit (240), a sub-wavelength grating optical coupler (1232), and an electrical coupler (1233) coupled to the electrical link (1221) of the circuit board (1200). The second processor element package (1240) includes a substrate (1241) with an integrated circuit (240), a sub-wavelength grating optical coupler (1242), and an electrical coupler (1243) coupled to the electrical link (1221) of the circuit board (1220). The sub-wavelength grating optical coupler (1232) of the first processor element package (1230), the optical link (1211) of the circuit board (1220), and the sub-wavelength grating optical coupler (1242) of the second processor element package (1240) collectively define an optical communications path (1270) between the substrate (1231) of the first processor element package (1230) and the substrate (1241) of the second processor element package (1240).
    • 在一个示例中,复合处理器(100)包括电路板(1200),第一处理器元件封装(1230)和第二处理器元件封装(1240)。 电路板具有光学链路(1211)和电连接(1221)。 第一处理器元件封装(1230)包括具有集成电路(240)的基板(1231),子波长光栅光耦合器(1232)和耦合到所述电连接器(1221)的电耦合器(1233) 电路板(1200)。 第二处理器元件封装(1240)包括具有集成电路(240)的基板(1241),子波长光栅光耦合器(1242)和耦合到所述电连接器(1221)的电耦合器(1243) 电路板(1220)。 第一处理器元件封装(1230)的子波长光栅光耦合器(1232),电路板(1220)的光链路(1211)和第二处理器元件的子波长光栅光耦合器(1242) 封装(1240)共同地限定了第一处理器元件封装(1230)的衬底(1231)与第二处理器元件封装(1240)的衬底(1241)之间的光通信路径(1270)。
    • 9. 发明申请
    • ELECTRONIC SYSTEM HAVING FANOUT OPTICAL BUSES
    • 具有散热光纤的电子系统
    • WO2012047233A1
    • 2012-04-12
    • PCT/US2010/052052
    • 2010-10-08
    • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.TAN, Michael, Renne, TyMCLAREN, MorayROSENBERG, Paul, Kessler
    • TAN, Michael, Renne, TyMCLAREN, MorayROSENBERG, Paul, Kessler
    • G02B6/43G02B6/28H04B10/12
    • H04B10/278G02B6/43H04B10/803
    • An electronic system (100, 200, 250) includes a plurality of electronic nodes (110a-110d), each having a transmitter module (112) and a plurality of receiver modules (114-118), in which the transmitter module is positioned at a same location with respect to the receiver modules in each of the electronic nodes, and a plurality of fanout optical buses (121a-121d, 212a-212d, 302-308, 402-408), each fanout optical bus comprising a transmitter section (122, 214), a plurality of receiver sections (124-128, 216-222), and at least one substantially straight optical waveguide (130, 230) extending between the plurality of receiver sections, wherein each transmitter section (122, 214) is optically connected to a transmitter module (112) of a respective one of the electronic nodes (110a-110d) and wherein the receiver sections of each of the fanout optical buses is connected to respective ones of the receiver modules (114a-118) of the electronic nodes.
    • 电子系统(100,200,250)包括多个电子节点(110a-110d),每个电子节点具有发射器模块(112)和多个接收器模块(114-118),其中发射器模块位于 相对于每个电子节点中的接收器模块的相同位置,以及多个扇出光学总线(121a-121d,212a-212d,302-308,402-408),每个扇出光学总线包括发射机部分 122,214),多个接收器部分(124-128,216-222)以及在所述多个接收器部分之间延伸的至少一个基本上直的光波导(130,230),其中每个发射器部分(122,214) 光电连接到电子节点(110a-110d)中的相应一个的发射机模块(112),并且其中每个扇出光学总线的接收机部分连接到相应的一个接收机模块(114a-118) 电子节点。