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1. 发明申请

WO2014158196A1 ELECTRONIC APPARATUS HAVING A COOLING APPARATUS 审中-公开
标题翻译：具有冷却装置的电子装置
公开(公告)号：WO2014158196A1
公开(公告)日：2014-10-02
申请号：PCT/US2013/034691
申请日：2013-03-29
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人： CADER, Tahir , KUMARI, Niru , FRANZ, John P. , BASH, Cullen E. , MOORE, David A. , ESCOBAR-VARGAS, Sergio
IPC分类号： H05K7/20 , F28D15/02
CPC分类号： H05K7/20263 , F28D15/025 , F28D15/0266 , F28D15/04 , F28D15/06 , F28D2021/0028 , G06F1/20 , G06F1/206 , G06F2200/201 , H01L23/427 , H05K7/20272 , H05K7/20281 , H05K7/20836 , Y02D10/16
摘要： According to an example, a cooling system includes a cooling fluid reservoir, a cooling apparatus in fluid communication with the cooling fluid reservoir, a chamber having a side in thermal contact with a portion of the heat generating component, in which cooling fluid delivered by the cooling apparatus is to be heated through receipt of heat from the heat generating component, a cooling plate positioned at a distance and separated from the chamber, and a cooling fluid tube connecting the chamber and the cooling plate, in which the heated cooling fluid is to flow through the cooling fluid tube to the cooling plate. The cooling plate is also to be in thermal contact with a heat exchanger that that is to remove heat from the cooling fluid.
摘要翻译：根据一个实例，冷却系统包括冷却流体储存器，与冷却流体储存器流体连通的冷却装置，具有与发热部件的一部分热接触的一侧的室，其中由冷却装置将通过从发热部件接收热量，一定距离并与腔室分离的冷却板加热，以及连接腔室和冷却板的冷却流体管，其中加热的冷却流体为流经冷却流体管至冷却板。冷却板也将与热交换器热接触，热交换器是从冷却流体中除去热量。

2. 发明申请

WO2013137847A1 LIQUID TEMPERATURE CONTROL COOLING 审中-公开
标题翻译：液体温度控制冷却
公开(公告)号：WO2013137847A1
公开(公告)日：2013-09-19
申请号：PCT/US2012/028718
申请日：2012-03-12
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , FRANZ, John P. , SABOTTA, Michael L. , CADER, Tahir , MOORE, David A.
发明人： FRANZ, John P. , SABOTTA, Michael L. , CADER, Tahir , MOORE, David A.
IPC分类号： H05K7/20 , F28D15/02
CPC分类号： G06F1/20 , F28D15/0275 , G06F1/206 , H05K7/20772 , H05K7/20781
摘要： Examples of the present disclosure may include methods and systems for liquid temperature control cooling. An example of a liquid temperature control cooling system for an electronics rack (100, 200a, 200b) can include a number of electronic devices (102, 202) in the electronics rack (100, 200a, 200b), a panel (108-1, 108-2, 208-1, 224-1, 224-2) that extends from a roof (226) to a floor (228) inside the electronics rack (100, 200a, 200b), where a face of the panel (108-1, 108-2, 208-1, 224-1, 224-2) is parallel to a direction in which the number of electronic devices (100, 200a, 200b) slide into the electronics rack (100, 200a, 200b) and perpendicular to a front of the electronics rack, and a heat receiving structure (112, 212, 312, 412) that is integrated into the panel (108-1, 108-2, 208-1, 224-1, 224-2) and that is thermally coupled to the number of electronic devices (102, 202) through the panel (108-1, 108-2, 208-1, 224-1, 224-2), where the heat receiving structure (112, 212, 312, 412) can include a liquid flow compartment (330, 442) an input (216, 316, 416) to receive cool liquid into the liquid flow compartment (330, 442), and a control valve (214, 314, 414-1, 414-2, 414-3, 414-4) to release warm liquid from the liquid flow compartment (330, 442).
摘要翻译：本公开的实例可以包括用于液体温度控制冷却的方法和系统。用于电子机架（100,200a，200b）的液体温度控制冷却系统的示例可以包括电子机架（100,200a，200b）中的多个电子设备（102,202），面板（108-1 ，108-2,208-1,224-1,224-2），其从所述电子机架（100,200a，200b）内部的屋顶（226）延伸到地板（228），其中所述面板 108-1,108-2,208-1,224-1,224-2）平行于电子设备（100,200a，200b）的数量滑入电子机架（100,200a，200b）的方向）和垂直于所述电子机架的前部的热接收结构（112,212,312,412），其被集成到所述面板（108-1,108-2,208-1,224-1,224-212）中， 2），并且其通过面板（108-1,108-2,208-1,224-1,224-2）与电子设备（102,202）的数量热耦合，其中热接收结构（112），212,312,412）可以包括液体流动隔室（330,442），输入端（216,316,416）以将冷却液体接收到液体流动室（330,442）和用于从液体流动室（330,442）释放温热液体的控制阀（214,314,414-1,414-2,414-3,414-4）。

3. 发明申请

WO2016171660A1 PUMP HAVING FREELY MOVABLE MEMBER 审中-公开
标题翻译：具有可移动构件的泵
公开(公告)号：WO2016171660A1
公开(公告)日：2016-10-27
申请号：PCT/US2015/026716
申请日：2015-04-20
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人： NAELI, Kianoush , MOORE, David A.
IPC分类号： F04B45/04 , F04B53/10 , H05K7/20
CPC分类号： F04B43/043 , B41J2/17596 , F04B53/10 , G06F1/20 , G06F1/203 , G06F2200/201 , H05K7/20272
摘要： A pump includes a main chamber and a pair of valves on opposite ends of the main chamber. The respective valves each contain a freely movable member to selectively open and close each respective valve, wherein the freely movable member is formed from at least some of the same material used to form a chamber portion of the respective valves. A force applicator is coupled relative to the main chamber to alternately induce a suction action and an expulsion action.
摘要翻译：泵包括主室和在主室的相对端上的一对阀。各个阀各自包含可自由移动的构件，以选择性地打开和关闭每个相应的阀，其中可自由移动的构件由用于形成各个阀的腔室部分的至少一些相同的材料形成。力施加器相对于主室耦合以交替地引起抽吸动作和排出动作。

4. 发明申请

WO2014070167A1 THERMAL STABILIZATION SHIPPING SYSTEM AND METHOD 审中-公开
标题翻译：热稳定运输系统和方法
公开(公告)号：WO2014070167A1
公开(公告)日：2014-05-08
申请号：PCT/US2012/062789
申请日：2012-10-31
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人： WENNER, Stefan J. , HODGE, Richard H. , MOORE, David A. , DRAKE, John R.
IPC分类号： B65D81/18 , B65D81/38 , C09K5/06 , B65B11/00
CPC分类号： B65D81/3816 , B65B11/585 , B65D19/38 , B65D81/38 , B65D2519/0086 , C09K5/063
摘要： A thermal stabilization shipping system comprises a pallet (30, 130, 330) to underlie a palletized load (22) and a blanket (50, 250 150, 350) dimensioned to drape over a top of the palletized load (22) and reach down to the pallet (30, 130, 330). The blanket (50, 250 150, 350) has compartments (54, 154, 454) containing a phase change material (60).
摘要翻译：一种热稳定运输系统包括一个托盘（30,130,330），该托盘位于码垛的装载（22）和一个橡皮布（50,250,150,350）之下，该橡皮布的尺寸适于悬挂在托盘化的货物（22）的顶部上，到所述托盘（30,130,330）。毯子（50,250,150,350）具有包含相变材料（60）的隔室（54,154,454）。

5. 发明申请

WO2016171659A1 PUMP HAVING FREELY MOVABLE MEMBER 审中-公开
标题翻译：具有可移动构件的泵
公开(公告)号：WO2016171659A1
公开(公告)日：2016-10-27
申请号：PCT/US2015/026714
申请日：2015-04-20
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人： NAELI, Kianoush , MOORE, David A.
IPC分类号： F04B45/04 , F04B53/10 , H05K7/20
CPC分类号： F04B43/043 , F04B45/04 , F04B53/10 , G06F1/1656 , G06F1/20 , G06F1/203 , H05K7/20272
摘要： A pump includes a main chamber and a pair of valves on opposite ends of the main chamber. At least a portion of the respective valves and of the main chamber is formed from a single, unitary piece. The respective valves each contain a freely movable member to permit selective opening and closing of each respective valve. A force applicator alternately induces a suction action and an expulsion action in the main chamber.
摘要翻译：泵包括主室和在主室的相对端上的一对阀。各个阀门和主室的至少一部分由单一的整体件形成。各个阀各自包含可自由移动的构件，以允许各个阀的选择性地打开和关闭。力施加器在主室中交替地引起抽吸动作和排出动作。

6. 发明申请

WO2013137849A1 RACK COOLING SYSTEM WITH A COOLING SECTION 审中-公开
标题翻译：具有冷却段的机架冷却系统
公开(公告)号：WO2013137849A1
公开(公告)日：2013-09-19
申请号：PCT/US2012/028744
申请日：2012-03-12
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , MOORE, David A. , SABOTTA, Michael L. , FRANZ, John P. , CADER, Tahir
发明人： MOORE, David A. , SABOTTA, Michael L. , FRANZ, John P. , CADER, Tahir
IPC分类号： H05K7/20 , H05K7/18
CPC分类号： H05K7/20736 , G06F1/20 , H05K7/20754 , H05K7/20781
摘要： Examples of the present disclosure may include methods and systems for cooling electronic components housed in a rack. An example system for cooling a rack may include a frame (100, 200a, 200b, 200c, 300a, 300b, 300c, 450, 452, 454) including a number of dividers (108-1, 208-1, 308-1, 408-1) internal to the rack that define a plurality of sections (104, 106, 112, 204, 206, 212, 304, 306, 312, 404-1, 404-2, 406-1, 406-2, 412-1, 412-2) within the rack. Moreover, an example system for cooling electronic components housed in a rack may further include a number of electronics sections (104, 106, 204, 206, 304, 306, 404-1, 404-2, 406-1, 406-2, 412-2) including at least a first number of electronic components (114-1, 114-2, 214-1, 214-2, 214-3, 214-4, 214-5, 214-6, 214-7, 214-8, 314-1, 314-2, 414), and a number of cooling sections (112, 212, 312, 412-1) including at least a first cooling system (102, 202, 402) that cools at least the first number of electronic components (114-1, 114-2, 214-1, 214-2, 214-3, 214-4, 214-5, 214-6, 214-7, 214-8, 314-1, 314-2, 414) via heat transfer through the number of dividers(108-1, 208-1, 308-1, 408-1).
摘要翻译：本公开的示例可以包括用于冷却容纳在机架中的电子部件的方法和系统。用于冷却机架的示例性系统可以包括包括多个分配器（108-1,208-1,308-1,40）的框架（100,200a，200b，200c，300a，300b，300c，450,452,454）（104,106,112,204,206,212,304,306,312,404-1,404-2,406-1,406-2,412）的所述机架内部定位多个部分 -1,412-2）。此外，用于冷却容纳在机架中的电子部件的示例性系统还可以包括多个电子部分（104,106,204,206,304,306,404-1,404-2,406-1,406-2，包括至少第一数量的电子部件（114-1,114-2,214-1,214-2,214-3,214-4,214-5,214-6,214-7， 214-1,314-1,314-2,414）和多个冷却段（112,212,312,412-1），其包括至少冷却至少第一冷却系统（102,202,402）第一数量的电子部件（114-1,114-2,214-1,214-2,214-3,214-4,214-5,214-6,214-7,214-8,314-1），314-2,414），经由分配器（108-1,208-1,308-1,408-1）的数量的热传递。

7. 发明申请

WO2013089794A1 DETERMINING RACK POSITION OF DEVICE 审中-公开
标题翻译：确定设备的机架位置
公开(公告)号：WO2013089794A1
公开(公告)日：2013-06-20
申请号：PCT/US2011/065687
申请日：2011-12-17
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , MOORE, David A. , COCHRAN, Charles W. , BHUTTA, Haseeb Ahsun
发明人： MOORE, David A. , COCHRAN, Charles W. , BHUTTA, Haseeb Ahsun
IPC分类号： G06K17/00 , G06F1/00
CPC分类号： H05K7/1498 , G06Q10/087 , G06Q50/28
摘要： Certain embodiments of the present invention provide a device, process and server for keeping track of device locations by identifying devices as they are inserted into a rack, for example, by reading data from tags mounted on the devices or reading data from device communications ports, and by transferring the data to a database associating hardware with data-center rack locations.
摘要翻译：本发明的某些实施例提供了一种设备，过程和服务器，用于通过在设备插入机架中时识别设备来跟踪设备位置，例如通过从安装在设备上的标签读取数据或从设备通信端口读取数据，并将数据传输到将硬件与数据中心机架位置相关联的数据库。

8. 发明申请

WO2009139765A1 SENSOR ASSEMBLY WITH OPTIMIZED RESPONSE TIME 审中-公开
标题翻译：传感器总成优化响应时间
公开(公告)号：WO2009139765A1
公开(公告)日：2009-11-19
申请号：PCT/US2008/063442
申请日：2008-05-12
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , MOORE, David A. , MORRISON, Allen T. , NGUYEN, Hoang Thanh , FELCMAN, Chris F.
发明人： MOORE, David A. , MORRISON, Allen T. , NGUYEN, Hoang Thanh , FELCMAN, Chris F.
IPC分类号： G01D11/24 , G01D11/00
CPC分类号： G01D11/30 , G01D11/24
摘要： An apparatus and system for optimized response time, the apparatus comprising a first housing; a second housing; wherein the first housing and the second housing are coupled together to form an enclosure, at least one of the first housing and the second housing comprising at least one ventilation opening therein to allow air to circulate through the at least one of the first housing and second housing; a printed circuit board enclosed within the enclosure, wherein the printed circuit board is mounted on at least one elevated pedestal; and at least one environmental sensor centrally mounted on the printed circuit board in a position which is exposed to air circulating through the enclosure, wherein the periphery of the at least one environmental sensor includes at least one cut-out portion of the printed circuit board.
摘要翻译：一种用于优化响应时间的装置和系统，该装置包括第一壳体; 第二个住房; 其中所述第一壳体和所述第二壳体联接在一起以形成外壳，所述第一壳体和所述第二壳体中的至少一个在其中包括至少一个通气开口，以允许空气循环通过所述第一壳体和所述第二壳体中的至少一个住房; 封装在外壳内的印刷电路板，其中印刷电路板安装在至少一个升高的基座上; 以及至少一个环境传感器，其集中安装在所述印刷电路板上的暴露于通过所述外壳循环的空气的位置，其中所述至少一个环境传感器的周边包括所述印刷电路板的至少一个切口部分。

9. 发明申请

WO2016171658A1 ELECTRONIC DEVICE HAVING A COOLANT 审中-公开
标题翻译：具有冷却剂的电子设备
公开(公告)号：WO2016171658A1
公开(公告)日：2016-10-27
申请号：PCT/US2015/026713
申请日：2015-04-20
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人： MOORE, David A. , NAELI, Kianoush , MARTY, Valerie J. , MCKINNELL, James
IPC分类号： H05K7/20 , H05K5/06
CPC分类号： G06F1/206 , F28F2250/08 , G06F1/203 , H01L23/473 , H01L2924/097 , H05K5/06 , H05K7/20 , H05K9/0007
摘要： An electronic device includes a housing enclosure, which at least sealingly contains an electronic component, a barrier, a pump, and a coolant. The electronic component is located on a substrate, while the barrier defines a circulation loop in which the coolant is exposed to the electronic component. The pump is positioned within the circulation loop to cause flow of the coolant through the circulation loop.
摘要翻译：电子设备包括壳体，其至少密封地包含电子部件，屏障，泵和冷却剂。电子部件位于基板上，而屏障限定了循环回路，其中冷却剂暴露于电子部件。泵定位在循环回路内以使冷却剂流过循环回路。

10. 发明申请

WO2014120182A1 LIQUID COOLING 审中-公开
标题翻译：液体冷却
公开(公告)号：WO2014120182A1
公开(公告)日：2014-08-07
申请号：PCT/US2013/024037
申请日：2013-01-31
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人： FRANZ, John P. , CADER, Tahir , SABOTTA, Michael L. , MOORE, David A.
IPC分类号： H05K7/20 , H01L23/46
CPC分类号： F28F1/40 , H01L23/473 , H01L2924/0002 , H05K7/20254 , H05K7/20781 , H01L2924/00
摘要： An assembly for liquid cooling is provided herein. The assembly includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.
摘要翻译：本文提供了用于液体冷却的组件。组件包括热构件，支撑构件和衬垫。热构件包括由导热材料形成的冷却销的阵列，以从热构件延伸。支撑构件包括入口通道和出口通道。用于向冷却销阵列提供流体的入口通道。从冷却销阵列接收流体的出口通道。加热构件和支撑构件之间的垫圈以形成冷却通道，其间具有流体密封。

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