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    • 3. 发明申请
    • METHOD FOR MANUFACTURING BACK CONTACT SOLAR CELL USING PUNCH-THROUGH
    • 使用PUNCH-THROUGH制造回接触太阳能电池的方法
    • WO2013032256A1
    • 2013-03-07
    • PCT/KR2012/006964
    • 2012-08-31
    • HANWHA CHEMICAL CORPORATION.LEE, Yong HwaCHO, Jae EockLEE, Hong GuSEO, Se-YoungHYUN, Deoc HwanKIM, Gang IlJUNG, Woo Won
    • LEE, Yong HwaCHO, Jae EockLEE, Hong GuSEO, Se-YoungHYUN, Deoc HwanKIM, Gang IlJUNG, Woo Won
    • H01L31/042H01L31/0216H01L31/18
    • H01L31/022458H01L31/0682H01L31/1864Y02E10/547Y02P70/521
    • Provided is a method for manufacturing a back contact solar cell. More particularly, the method includes: (a) forming via holes to penetrate two facing surfaces of a p-type semiconductor substrate by using laser; (b) performing heat treatment on the semiconductor substrate in the presence of n-type impurity, to thereby dope the n-type impurity in the semiconductor substrate; (c) forming an anti-reflective film on one surface of the two surfaces of the semiconductor substrate, and forming a passivation film on an opposite surface to one surface of the semiconductor substrate; (d) applying a first electrode material that penetrates the passivation film at the time of heat treatment, to thereby form first electrodes on opening parts of the via holes which are on the side of the opposite surface and a portion of the passivation film which is adjacent to the opening parts of the via holes, so as to cover the opening parts of the via holes, and applying a second electrode material that does not penetrate the passivation film at the time of heat treatment, to thereby form second electrodes to cover the first electrodes; (e) applying a third electrode material that penetrates the passivation film at the time of heat treatment, to thereby form third electrodes on the passivation film, and applying a fourth electrode material that does not penetrate the passivation film at the time of heat treatment, to thereby form fourth electrodes to cover the third electrodes; and (f) performing heat treatment on the semiconductor substrate having the first, second, third, and fourth electrodes to thereby allow only the first and third electrodes among the first, second, third, and fourth electrodes to be selectively connected with the semiconductor substrate through a punch-through phenomenon.
    • 提供一种背接触太阳能电池的制造方法。 更具体地,该方法包括:(a)通过使用激光形成通孔以穿透p型半导体衬底的两个相对表面; (b)在存在n型杂质的情况下对半导体衬底进行热处理,从而将n型杂质掺杂在半导体衬底中; (c)在半导体衬底的两个表面的一个表面上形成抗反射膜,并在与半导体衬底的一个表面相对的表面上形成钝化膜; (d)施加在热处理时穿透钝化膜的第一电极材料,从而在相对表面侧的通孔的开口部分上形成第一电极,以及钝化膜的一部分 邻近通孔的开口部分,以覆盖通孔的开口部分,并且在热处理时施加不穿透钝化膜的第二电极材料,从而形成第二电极以覆盖 第一电极; (e)施加在热处理时穿透钝化膜的第三电极材料,从而在钝化膜上形成第三电极,并施加在热处理时不穿透钝化膜的第四电极材料, 从而形成覆盖第三电极的第四电极; 和(f)对具有第一,第二,第三和第四电极的半导体衬底进行热处理,从而只允许第一,第二,第三和第四电极中的第一和第三电极与半导体衬底选择性地连接 通过穿透现象。