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    • 2. 发明申请
    • A LIGHT EMITTING DEVICE WITH A STOPPER LAYER STRUCTURE
    • 具有停止层结构的发光装置
    • WO2009065215A1
    • 2009-05-28
    • PCT/CA2008/002034
    • 2008-11-20
    • GROUP IV SEMICONDUCTOR INC.MACELWEE, ThomasNOEL, Jean-PaulDUCHARME, DeanXIN, Yongbao
    • MACELWEE, ThomasNOEL, Jean-PaulDUCHARME, DeanXIN, Yongbao
    • H05B33/02H01L29/12H05B33/06
    • H01L33/02H01L33/42
    • Electroluminescent (EL) devices structures are provided comprising a hot electron stopper layer structure to capture hot electrons and dissipate their energy, thereby reducing damage to the transparent conducting oxide (TCO) layer and reducing other hot electron effects, such as charging effects, which impact reliability of EL device structures. The stopper layer structure may comprise a single layer or multiple layers provided between the TCO electrode layer and the emitter structure, and may also function to reduce diffusion or chemical interactions between the TCO and the emitter layer structure. Optionally, stopper layers may also be provided within the emitter structure. Suitable stopper layer materials are wideband gap semiconductors or dielectrics, preferably transparent at wavelengths emitted by the EL device characterized by high impact ionization rates, and/or high relative permittivity relative to adjacent layers of the emitter structure.
    • 提供电致发光(EL)器件结构,其包括热电子阻挡层结构以捕获热电子并耗散其能量,从而减少对透明导电氧化物(TCO)层的损伤并减少其他热电子效应,例如充电效应,其影响 EL器件结构的可靠性。 阻挡层结构可以包括设置在TCO电极层和发射极结构之间的单层或多层,并且还可以起到减少TCO和发射极层结构之间的扩散或化学相互作用的作用。 可选地,也可以在发射器结构内设置阻挡层。 合适的阻挡层材料是宽带间隙半导体或电介质,优选在由EL器件发射的波长处是透明的,其特征在于高冲击电离速率和/或相对于发射极结构的相邻层的高相对介电常数。
    • 4. 发明申请
    • DEPOSITION OF THIN FILM DIELECTRICS AND LIGHT EMITTING NANO-LAYER STRUCTURES
    • 薄膜电沉积和发光纳米结构的沉积
    • WO2011106860A1
    • 2011-09-09
    • PCT/CA2010/000287
    • 2010-03-01
    • GROUP IV SEMICONDUCTOR, INC.NOEL, Jean-PaulLI, Ming
    • NOEL, Jean-PaulLI, Ming
    • H01L21/469G02F1/015H01L33/00H01L33/34H01L49/02H01S5/30
    • H01L21/02164C23C16/0218C23C16/345C23C16/401C23C16/56H01L21/0217H01L21/022H01L21/02312H01L21/02337H05B33/10
    • A method is disclosed for deposition of thin film dielectrics, and in particular for chemical vapour deposition of nano-layer structures comprising multiple layers of dielectrics, such as, silicon dioxide, silicon nitride, silicon oxynitride and/or other silicon compatible dielectrics. The method comprises post-deposition surface treatment of deposited layers with a metal or semiconductor source gas, e.g. a silicon source gas. Deposition of silicon containing dielectrics preferably comprises silane-based chemistry for deposition of doped or undoped dielectric layers, and surface treatment of deposited dielectric layers with silane. Surface treatment provides dielectric layers with improved layer-to-layer uniformity and lateral continuity, and substantially atomically flat dielectric layers suitable for multilayer structures for electroluminescent light emitting structures, e.g. active layers containing rare earth containing luminescent centres. Doped or undoped dielectric thin films or nano-layer dielectric structures may also be provided for other semiconductor devices.
    • 公开了一种用于沉积薄膜电介质的方法,特别是用于化学气相沉积包括多层电介质的纳米层结构,例如二氧化硅,氮化硅,氮氧化硅和/或其它与硅相容的电介质。 该方法包括用金属或半导体源气体沉积表面处理沉积层,例如, 硅源气体。 含硅电介质的沉积优选包括用于沉积掺杂或未掺杂的电介质层的硅烷基化学,以及用硅烷表面处理沉积的介电层。 表面处理提供具有改进的层间均匀性和横向连续性的电介质层,以及适用于电致发光发光结构的多层结构的基本上原子平坦的电介质层。 含有含稀土的发光中心的活性层。 也可以为其它半导体器件提供掺杂或未掺杂的电介质薄膜或纳米层介电结构。