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1. 发明申请

WO2007023288A3 SOLDER ALLOY 审中-公开
标题翻译：焊锡合金
公开(公告)号：WO2007023288A3
公开(公告)日：2007-07-12
申请号：PCT/GB2006003167
申请日：2006-08-24
申请人： FRY METALS INC , SETNA ROHAN PILOO , LEWIS BRIAN , SINGH BAWA , LAUGHLIN JOHN , PANDHER RANJIT
发明人： LEWIS BRIAN , SINGH BAWA , LAUGHLIN JOHN , PANDHER RANJIT
IPC分类号： B23K35/26 , C22C12/00
CPC分类号： C22C13/00 , B23K35/262 , H01L2924/0002 , H05K3/3436 , H05K3/3463 , H01L2924/00
摘要： An alloy suitable for use in a ball grid array, the alloy comprising from 0.15 - 1.5 wt.% copper, from 0.1 - 4 wt.% silver, from 0 - 0.1 wt.% phosphorus, from 0 - 0.1 wt.% germanium, from 0 - 0.1 wt.% gallium, from 0 - 0.3 wt.% of one or more rare earth elements, from 0 - 0.3 wt.% indium, from 0 - 0.3 wt.% magnesium, from 0 - 0.3 wt.% calcium, from 0 - 0.3 wt.% silicon, from 0 - 0.3 wt.% aluminium, from 0 - 0.3 wt.% zinc, from 0 - 1 wt.% antimony, and at least one of the following elements from 0.02 - 0.3 wt% nickel, from 0.008 - 0.2 wt% manganese, from 0.01 - 0.3 wt% cobalt, from 0.005 - 0.3 wt% chromium, from 0.02 - 0.3 wt% iron, and from 0.008 - 0.1 wt% zirconium, and the balance tin, together with unavoidable impurities.
摘要翻译：适合用于球栅阵列的合金，所述合金包含0.15-1.5重量％的铜，0.1-4重量％的银，0-0.1重量％的磷，0-0.1重量％的锗， 0-0.1重量％的镓，0-0.3重量％的一种或多种稀土元素，0-0.3重量％的铟，0-0.3重量％的镁，0-0.3重量％的钙，0-0.3重量％的硅，0-0.3重量％的铝，0-0.3重量％的锌，0-1重量％的锑和至少一种以下元素：0.02-0.3重量％％的镍，0.008-0.2重量％的锰，0.01-0.3重量％的钴，0.005-0.3重量％的铬，0.02-0.3重量％的铁和0.008-0.1重量％的锆，并且余量的锡一起有不可避免的杂质。

2. 发明申请

WO2008085570A3 FLUX FORMULATIONS 审中-公开
标题翻译：通量配方
公开(公告)号：WO2008085570A3
公开(公告)日：2008-09-12
申请号：PCT/US2007081037
申请日：2007-10-11
申请人： FRY METALS INC , ARORA SANYOGITA , FINKE MARTINUS N , SINGH BAWA , LEWIS BRIAN , MARCZI MICHAEL T , HOLTZER MITCHELL
发明人： ARORA SANYOGITA , FINKE MARTINUS N , SINGH BAWA , LEWIS BRIAN , MARCZI MICHAEL T , HOLTZER MITCHELL
IPC分类号： B23K35/34
CPC分类号： B23K35/3613 , B23K35/362 , B23K2201/42 , C08K11/00 , H05K3/3489 , Y10T428/31504
摘要： Flux formulations that remain pliable after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers and the like.
摘要翻译：披露了在沉积后仍保持柔韧性的助焊剂配方。在某些实例中，助焊剂包含第一组分和有效量的第二组分以在沉积之后提供柔顺通量。助焊剂还可以包含活化剂，增塑剂等。

3. 发明申请

WO2008049006A2 MATERIALS FOR USE WITH INTERCONNECTS OF ELECTRICAL DEVICES AND RELATED METHODS 审中-公开
标题翻译：与电气设备互连使用的材料及相关方法
公开(公告)号：WO2008049006A2
公开(公告)日：2008-04-24
申请号：PCT/US2007081650
申请日：2007-10-17
申请人： FRY METALS INC , MARCZI MICHAEL T , KOEP PAUL , DE MONCHY MICHEL A , FINKE MARTINUS N , LEWIS BRIAN
发明人： MARCZI MICHAEL T , KOEP PAUL , DE MONCHY MICHEL A , FINKE MARTINUS N , LEWIS BRIAN
IPC分类号： H01L23/48
CPC分类号： H05K3/3484 , B23K35/262 , B23K35/264 , B23K35/302 , H01L23/3736 , H01L24/83 , H01L31/02008 , H01L31/048 , H01L2224/8181 , H01L2224/81825 , H01L2224/83224 , H01L2224/83801 , H01L2224/8381 , H01L2924/01322 , H01L2924/01327 , H01L2924/12042 , H01L2924/13055 , H05K3/341 , H05K3/3463 , H05K2201/0209 , H05K2201/068 , H05K2201/10992 , H05K2203/0415 , Y02E10/50 , Y02P70/613 , H01L2924/3512 , H01L2924/00
摘要： Certain examples disclosed herein are directed to materials that are designed for use in interconnects of electrical devices such as, for example, printed circuit boards and solar cells. In certain examples, a two-step solder may be used to reduce stresses on the materials used in the production of the electrical devices.
摘要翻译：本文公开的某些实例涉及被设计用于诸如印刷电路板和太阳能电池的电气设备的互连中的材料。在某些实例中，可以使用两步焊料来减少用于电气设备生产中的材料的应力。

4. 发明申请

WO2005070163A3 COOLING DEVICES AND METHODS OF USING THEM 审中-公开
标题翻译：冷却装置及其使用方法
公开(公告)号：WO2005070163A3
公开(公告)日：2006-05-18
申请号：PCT/US2005000893
申请日：2005-01-13
申请人： COOKSON ELECTRONICS INC , RAE ALAN , SINGH BAWA , VARNELL WILLIAM D , GULINO ANGELO J , HOLTZER MITCH , ABYS JOE , LEWIS BRIAN , SLIM SIMAN
发明人： RAE ALAN , SINGH BAWA , VARNELL WILLIAM D , GULINO ANGELO J , HOLTZER MITCH , ABYS JOE , LEWIS BRIAN , SLIM SIMAN
IPC分类号： G01R31/02
CPC分类号： F25B9/145 , G01R31/2877
摘要： A method and device for cooling an electronic component 1810 during its manufacture, repair, or rework is disclosed. In certain examples, the cooling device includes a cooling device body 1710 optionally with one or more voids 1730. In certain examples, a cooling medium that can receive, absords or extract heat from the electronic component 1810 and/or the surrounding environment is disposed on or in the cooling device body 1710. In some examples, a cooling device that includes a polymeric cooling device body, optionally with tape 1820 disposed on the polymeric cooling device body, is disclosed.
摘要翻译：公开了一种用于在其制造，修理或返工期间冷却电子部件1810的方法和装置。在某些实例中，冷却装置包括可选地具有一个或多个空隙1730的冷却装置主体1710.在某些示例中，可以将从电子部件1810和/或周围环境接收，吸收或提取热量的冷却介质设置在或者在冷却装置主体1710中。在一些示例中，公开了一种冷却装置，其包括聚合物冷却装置主体，可选地具有设置在聚合物冷却装置主体上的胶带1820。

5. 发明申请

WO03007312A3 THERMAL INTERFACE MATERIAL AND HEAT SINK CONFIGURATION 审中-公开
标题翻译：热接口材料和热沉配置
公开(公告)号：WO03007312A3
公开(公告)日：2003-08-14
申请号：PCT/US0215870
申请日：2002-05-20
申请人： FRY METALS INC
发明人： SREERAM ATTIGANAL N , LEWIS BRIAN , HOZER LESZEK , LIBERATORE MICHAEL JAMES , MINOGUE GERARD
IPC分类号： B23K35/24 , B23K35/14 , B23K35/30 , B23K35/36 , C22C5/02 , C22C28/00 , H01L23/373 , H01L23/42 , C22C32/00
CPC分类号： H01L23/42 , B23K35/302 , B23K35/3066 , B23K35/3602 , H01L23/3735 , H01L23/3736 , H01L23/433 , H01L2224/73253 , H01L2924/0002 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01063 , H01L2924/01066 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/09701 , H01L2924/12041 , H01L2924/3011 , H01L2924/00
摘要： A thermal interface material for use in electronic packaging, the thermal interface material comprises a solder with relatively high heat flow characteristics and a CTE modifying component to reduce or prevent damage due to thermal cycling. The thermal interface material comprises an active solder that contains indium and an intrinsic oxygen getter selected from the group consisting of alkali metals, alkaline-earth metals, refractory metals, rare earth metals and zinc and mixtures and alloys thereof. Lastly, damage due to an electronic package due to thermal cycling stress is reduced by using an insert in a lid of an electronic device package wherein the insert has a coefficient of thermal expansion that is between about that of the lid and about that of a semiconductor substrate.
摘要翻译：用于电子封装的热界面材料，热界面材料包括具有相对高热流特性的焊料和CTE改性组分，以减少或防止由于热循环引起的损伤。热界面材料包括含有铟的活性焊料和选自碱金属，碱土金属，难熔金属，稀土金属和锌的本征氧吸气剂及其混合物和合金。最后，通过在电子设备封装的盖子中使用插入件来减少由于热循环应力而导致的电子封装的损坏，其中插入件的热膨胀系数在盖子的大约和半导体的盖子之间基质。

6. 发明申请

WO2009026290A2 SYSTEM AND METHOD FOR STORAGE MANAGEMENT 审中-公开
标题翻译：存储管理的系统和方法
公开(公告)号：WO2009026290A2
公开(公告)日：2009-02-26
申请号：PCT/US2008073592
申请日：2008-08-19
申请人： UBS AG , BARKER MARTIN , LEWIS BRIAN , MULBERRY PETER , MCMULLAN ALEX , LUNT JONATHAN , VINCENT GARY
发明人： LEWIS BRIAN , MULBERRY PETER , MCMULLAN ALEX , LUNT JONATHAN , VINCENT GARY
CPC分类号： G06F11/328 , G06F3/0605 , G06F3/0608 , G06F3/0653 , G06F3/067 , G06F11/3485
摘要： A system and method for monitoring the storage estate of an organization using an interactive website that is configured to produce and display a novel set of key performance indicators (KPIs) related to the storage estate, including KPIs related to data collected from at least one of storage area network data and network attached storage data. In one embodiment, the novel set of KPIs includes one or more of protection efficiency, application efficiency, and snapshot overhead, where protection efficiency is calculated as a ratio of logical addressable data storage volume to total physical volume of data storage for storage area network data of the organization, application efficiency is calculated as a fraction of disk storage allocated to end user devices that is actually used by the end user devices for storage area network data, and snapshot overhead is calculated as a ratio of a volume of storage allocated for replicated copies of data to allocated storage for network attached storage data.
摘要翻译：一种用于使用交互式网站监控组织的存储地产的系统和方法，所述交互式网站被配置为产生和显示与所述存储地产相关的新颖的关键性能指标（KPI）集合，所述KPI包括与从以下至少一个存储区域网络数据和网络附加存储数据。在一个实施例中，该组新的KPI包括保护效率，应用效率和快照开销中的一个或多个，其中保护效率被计算为逻辑可寻址数据存储量与存储区域网络数据的数据存储的总物理量的比率，应用效率被计算为分配给最终用户设备实际用于存储区域网络数据的最终用户设备的磁盘存储的一小部分，并且快照开销被计算为分配用于复制的存储容量的比率将数据副本分配给网络附加存储数据的分配存储。

7. 发明申请

WO2009126217A3 INTERCHANGEABLE GRAPHIC DISPLAY SYSTEM AND METHOD OF MAKING SAME 审中-公开
标题翻译：可互换的图形显示系统及其制造方法
公开(公告)号：WO2009126217A3
公开(公告)日：2009-12-30
申请号：PCT/US2009001993
申请日：2009-03-31
申请人： LEWIS BRIAN , JIMOH HAKEEM
发明人： LEWIS BRIAN , JIMOH HAKEEM
IPC分类号： G09F21/04
CPC分类号： A63C17/06 , A63C2201/02 , A63C2203/08 , A63C2203/42
摘要： An interchangeable graphic display system of method of using same, in conjunction with an in-line skate frame, wherein the system includes a graphic display apparatus having a first and second layer, wherein each layer is attachable by a separate mounting means, and wherein the system enables an individual to display and replace different pictorial and graphic representations during operation of in-line skates.
摘要翻译：一种可互换的图形显示系统，其与使用直排式溜冰鞋框架的方法相结合，其中该系统包括具有第一和第二层的图形显示装置，其中每个层可通过单独的安装装置附接，并且其中系统使个人能够在直线溜冰鞋操作期间显示和替换不同的图形和图形表示。

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