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    • 2. 发明申请
    • BIOARTIFICIAL IMPLANT AND ITS USE AND METHOD OF REDUCING THE RISK FOR FORMATION OF CONNECTIVE TISSUE AFTER IMPLANTATION
    • 生物植入物及其使用和减少在植入后形成连接组织的风险的方法
    • WO2005030283A1
    • 2005-04-07
    • PCT/SE2004/001418
    • 2004-10-04
    • TIKOMED ABBRUCE, AdamBRUCE, LarsNILSSON, BoKORSGREN, Olle
    • BRUCE, AdamBRUCE, LarsNILSSON, BoKORSGREN, Olle
    • A61L27/50
    • A61L27/306A61L27/50
    • A bioartificial implant comprises a semipermeable barrier designed from one side to allow diffusion or prevent diffusion of predetermined substances/materials/molecules/cells/cell lines produced in the human body to the other opposite side of the barrier, and from said other opposite side to allow diffusion or prevent diffusion of predetermined substances which are the same as or different from the first mentioned substances/materials/molecules/cells/cell lines. The semipermeable barrier has a surface coating at least on said one side a bioactive metal, such as titanium, which surface coating is permeable to allow said diffusions. In a method for reducing the risk of formation/growth of connective tissue in connection with an implant which comprises a semipermeable barrier, the barrier is provided at least on one side with a permeable coating of bioactive metal. An example of the use of the implant is bioartificial pancreas.
    • 生物人造植入物包括从一侧设计的半透膜,以允许扩散或防止在人体中产生的预定物质/材料/分子/细胞/细胞系扩散到屏障的另一相对侧,并且从所述另一相对侧扩散 允许扩散或防止与前述物质/材料/分子/细胞/细胞系相同或不同的预定物质的扩散。 所述半渗透屏障至少在所述一侧上具有生物活性金属(例如钛)的表面涂层,所述表面涂层是可渗透的,以允许所述扩散。 在减少与包括半透性屏障的植入物相关的结缔组织形成/生长的风险的方法中,至少在一侧上设置有可渗透的生物活性金属涂层的屏障。 使用植入物的实例是生物人造胰腺。
    • 4. 发明申请
    • NEW USE OF DEXTRAN SULFATE
    • 新西兰硫酸锌的使用
    • WO2004047848A1
    • 2004-06-10
    • PCT/SE2003/001830
    • 2003-11-26
    • PROPHYMED ABNILSSON, BoKORSGREN, Olle
    • NILSSON, BoKORSGREN, Olle
    • A61K31/721
    • A61K31/737A61K31/721A61K35/39A61L27/3804A61L27/3839A61L27/54A61L2300/232A61L2300/41A61L2300/45A61L2300/64
    • The present invention refers to use of dextran sulfate, or a pharmaceutically acceptable derivate thereof, for manufacturing of a medicament for treatment of Instant Blood-Mediated Inflammatory Reaction (IBMIR). In addition, the invention refers to the use of dextran sulfate, or a pharmaceutically acceptable derivate thereof, for manufacturing of a medicament for treatment of morphological disruption of cell transplants and graft-rejection of cell transplants caused by IBMIR. The invention may be applied to patients suffering from type I diabetes, in which porcine islets of Langerhans are transplanted in their portal vein. Administration of dextran sulfate according to the invention inhibits and prevents rejection and destruction of the transplanted islets and makes normoglycemia in the patients possible.
    • 本发明涉及硫酸葡聚糖或其药学上可接受的衍生物在制备用于治疗即时血液介导的炎性反应(IBMIR)的药物中的用途。 此外,本发明涉及硫酸葡聚糖或其药学上可接受的衍生物在制备用于治疗由IBMIR引起的细胞移植的形态学破坏和细胞移植的移植排斥的药物中的用途。 本发明可以应用于患有I型糖尿病的患者,其中在其门静脉中移植了朗格汉斯猪胰岛。 根据本发明的硫酸葡聚糖的施用抑制并防止移植胰岛的排斥和破坏,并使患者的血糖异常成为可能。
    • 6. 发明申请
    • CONVEX WOODCHIP BOARD
    • CONVEX木工板
    • WO2010085198A1
    • 2010-07-29
    • PCT/SE2010/050034
    • 2010-01-14
    • SWEDWOOD INTERNATIONAL ABNILSSON, Bo
    • NILSSON, Bo
    • B32B21/02B27N3/02B27N3/14B27N5/00
    • B27N3/14B27N3/02B32B7/02B32B21/02B32B21/13B32B2307/54B32B2307/718B32B2479/00E04C2/16E04C2/328
    • The invention relates to a method for manufacturing a woodchip board (3) comprising a first (21) and second (23) woodchip layer sandwiching an intermediate layer (12) comprising woodchips of other chip size than the first (21) and second (23) woodchip layer. The method comprises the steps involving application of a first quantity (5) of glued woodchips (7) to a lower tool face (9) of a pressing tool (1, 31); application of a filler quantity (11) of glued woodchips (7') to the first quantity (5); application of a second quantity (13) of glued woodchips (7) to the filler quantity (11); compression of said quantities (5, 11, 13) by means of the lower (9) tool face and an upper tool face (15); realization of differentiated times when the glue of the glued woodchips (7) hardens in the first (5) and second quantity (13) respectively, by virtue of the production of these quantities with different thickness and/or by heating of the respective quantities (5, 13) to different temperatures; and removal of the hardened woodchip board (3) from the pressing tool (1, 31).
    • 本发明涉及一种用于制造木片板(3)的方法,所述木片板(3)包括夹着中间层(12)的第一(21)和第二(23)木芯层,所述中间层包括除了第一(21)和第二(23) )木片层。 该方法包括以下步骤:将第一数量(5)胶合的木片(7)施加到压制工具(1)的下工具面(9)上; 将粘合的木片(7')的填料量(11)施加到第一数量(5); 将第二数量(13)的胶合木片(7)施加到填料量(11); 通过下(9)工具面和上工具面(15)压缩所述量(5,11,13); 当粘合的木片(7)的胶水分别在第一(5)和第二数量(13)中硬化时,通过产生具有不同厚度的这些量和/或通过加热各自的量来实现差异化时间( 5,13)到不同的温度; 以及从加压工具(1,31)中取出硬化的木片板(3)。
    • 10. 发明申请
    • A CHIP BOARD AND A PROCESS FOR THE PREPARATION THEREOF
    • 一个芯片板及其准备工艺
    • WO2003095167A1
    • 2003-11-20
    • PCT/IB2003/001895
    • 2003-05-07
    • INTER IKEA SYSTEMS B.V.ISAKSSON, JanNILSSON, Bo
    • ISAKSSON, JanNILSSON, Bo
    • B27N3/14
    • B27N3/14Y10T428/253Y10T428/31942Y10T428/31957Y10T428/31971Y10T428/31982Y10T428/31986Y10T428/31989
    • A chip board including an intermediary layer (1) and a layer (2) of large chips positioned on both sides of said intermediary layer. An outer layer (3) is provided on the 5 outer surface of each layer of large chips. In addition to the chips, the layers include an adhesive. The intermediary layer (1) includes a mixture of wood chips having chip fractions of a chip size of 0.1 to 20 mm, and the chips of this layer are randomly oriented. The individual chip in the layer (2) of large chips presents the following characteristics: a length of approx. 50 to approx. 130 mm, a width of approx. 4 to approx. 40 mm and a thickness of approx. 0.2 to approx. 2.0 mm. The chips within each layer (2) of large chips are all oriented in one and the same direction. As a result, a chip board is obtained which demonstrates a significantly higher E- module and stiffness in flexure than hitherto known despite a reduced consumption of material.
    • 一种芯片板,包括中间层(1)和位于所述中间层两侧的大芯片层(2)。 外层(3)设置在每个大芯片层的外表面上。 除了芯片之外,层包括粘合剂。 中间层(1)包括具有芯片尺寸为0.1至20mm的芯片部分的木片的混合物,并且该层的芯片是随机取向的。 大芯片层(2)中的单个芯片具有以下特征: 50到大约 130毫米,宽约 4到约 40毫米,厚约约 0.2〜 2.0毫米。 大芯片每层(2)内的芯片均朝同一方向取向。 结果,获得了尽管材料消耗减少的芯片板,其表现出比以前已知的更高的E模块和弯曲刚度。