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    • 2. 发明申请
    • CONVEX WOODCHIP BOARD
    • CONVEX木工板
    • WO2010085198A1
    • 2010-07-29
    • PCT/SE2010/050034
    • 2010-01-14
    • SWEDWOOD INTERNATIONAL ABNILSSON, Bo
    • NILSSON, Bo
    • B32B21/02B27N3/02B27N3/14B27N5/00
    • B27N3/14B27N3/02B32B7/02B32B21/02B32B21/13B32B2307/54B32B2307/718B32B2479/00E04C2/16E04C2/328
    • The invention relates to a method for manufacturing a woodchip board (3) comprising a first (21) and second (23) woodchip layer sandwiching an intermediate layer (12) comprising woodchips of other chip size than the first (21) and second (23) woodchip layer. The method comprises the steps involving application of a first quantity (5) of glued woodchips (7) to a lower tool face (9) of a pressing tool (1, 31); application of a filler quantity (11) of glued woodchips (7') to the first quantity (5); application of a second quantity (13) of glued woodchips (7) to the filler quantity (11); compression of said quantities (5, 11, 13) by means of the lower (9) tool face and an upper tool face (15); realization of differentiated times when the glue of the glued woodchips (7) hardens in the first (5) and second quantity (13) respectively, by virtue of the production of these quantities with different thickness and/or by heating of the respective quantities (5, 13) to different temperatures; and removal of the hardened woodchip board (3) from the pressing tool (1, 31).
    • 本发明涉及一种用于制造木片板(3)的方法,所述木片板(3)包括夹着中间层(12)的第一(21)和第二(23)木芯层,所述中间层包括除了第一(21)和第二(23) )木片层。 该方法包括以下步骤:将第一数量(5)胶合的木片(7)施加到压制工具(1)的下工具面(9)上; 将粘合的木片(7')的填料量(11)施加到第一数量(5); 将第二数量(13)的胶合木片(7)施加到填料量(11); 通过下(9)工具面和上工具面(15)压缩所述量(5,11,13); 当粘合的木片(7)的胶水分别在第一(5)和第二数量(13)中硬化时,通过产生具有不同厚度的这些量和/或通过加热各自的量来实现差异化时间( 5,13)到不同的温度; 以及从加压工具(1,31)中取出硬化的木片板(3)。
    • 4. 发明申请
    • WOODEN CHIPBOARD COMPRISING TWO BOARDS ADHESIVELY BONDED TOGETHER WITH CHANNELS OF ARCHED SHAPE
    • 木质包装盒,包含两个与粘贴形状的通道粘合在一起的纸板
    • WO2011062543A1
    • 2011-05-26
    • PCT/SE2010/051223
    • 2010-11-09
    • SWEDWOOD INTERNATIONAL ABNILSSON, Bo
    • NILSSON, Bo
    • B27N5/02B27N3/02B27N3/20B32B21/02A47B13/10E04C2/16A47B96/20
    • E04C2/16B27N3/00B27N5/00B32B3/30B32B7/14B32B21/02B32B21/13
    • The invention relates to a manufacturing arrangement for a wooden chipboard and to such a wooden chipboard constructed from two boards (3) adhesively bonded together, each comprising an outward-facing side (5) and an inward-facing side (7), recessed grooves (9) in at least one inward-facing side (7) forming parallel channels (k) in the wooden chipboard (1), and an adhesive surface (11) between the boards (3) in the location between the grooves (9). The adhesive surface (11) between two adjacent grooves (9) in a board (3) constitutes a basic foundation (13) for a support wall (15, 15', 15") formed in the board (3) between the grooves (9) for counteracting the depression of the outward-facing side (5) in the area of the bottom (17) of the groove (9) when the wooden chipboard (1) is exposed to stressing, the groove (9) being formed with an arched shape in its cross section transversely to its longitudinal direction.
    • 本发明涉及一种用于木制刨花板的制造装置和由两个粘合在一起的板(3)构成的木制刨花板,每个板包括向外侧(5)和向内侧(7),凹槽 (9)中的至少一个在所述木质刨花板(1)中形成平行通道(k)的向内侧(7)中的粘合表面(11),以及在所述凹槽(9)之间的位置之间的粘合剂表面(11) 。 在板(3)中的两个相邻槽(9)之间的粘合表面(11)构成用于形成在槽(3)之间的板(3)中的支撑壁(15,15',15“)的基础基座(13) 如图9所示,当木刨花板(1)暴露于应力时,用于抵抗凹槽(9)的底部(17)的区域中的朝外侧(5)的凹陷,凹槽(9)形成有 其横截面中的弓形形状横向于其纵向方向。
    • 6. 发明申请
    • WOOD CHIP BOARD FOR FURNITURE AND METHOD FOR MANUFACTURING OF THE WOOD CHIP BOARD
    • 用于家具的木屑板和用于制造木屑板的方法
    • WO2013187840A1
    • 2013-12-19
    • PCT/SE2013/050689
    • 2013-06-13
    • SWEDWOOD INTERNATIONAL AB
    • NILSSON, Bo
    • B27N3/14B27N3/02D21B1/04
    • B27N3/02B27N3/14
    • The invention relates to a wood chip board (1) comprising layers (S1, S2, S3) with different fractions of wood chips, a lower layer (S1) of a first quantity (M1) of wood chips (3) of different chip size, an intermediate layer (S2) of a second quantity (M2) of wood chips, an upper layer (S3) of a third quantity (M3) of wood chips (3) of different chip size. The second quantity (M2) is constituted by a mixture of defibrated wood chips (5, 5', 5"), where said second quantity (M2) of defibrated wood chips exhibits at least a first volume (V1) having a lower density than at least a second volume (V2). The invention also relates to a method of manufacturing said wood chip board (1).
    • 本发明涉及一种木屑板(1),其包括具有木屑不同部分的层(S1,S2,S3),具有不同芯片尺寸的木片(3)的第一数量(M1)的下层(S1) ,木片的第二数量(M2)的中间层(S2),具有不同芯片尺寸的木片(3)的第三数量(M3)的上层(S3)。 第二数量(M2)由解纤木屑(5,5',5“)的混合物构成,其中所述第二数量(M2)的解纤木屑显示出至少第一体积(V1),其具有比 至少第二容积(V2)。本发明还涉及制造所述木片(1)的方法。
    • 9. 发明申请
    • A CHIP BOARD AND A PROCESS FOR THE PREPARATION THEREOF
    • 一个芯片板及其准备工艺
    • WO2003095167A1
    • 2003-11-20
    • PCT/IB2003/001895
    • 2003-05-07
    • INTER IKEA SYSTEMS B.V.ISAKSSON, JanNILSSON, Bo
    • ISAKSSON, JanNILSSON, Bo
    • B27N3/14
    • B27N3/14Y10T428/253Y10T428/31942Y10T428/31957Y10T428/31971Y10T428/31982Y10T428/31986Y10T428/31989
    • A chip board including an intermediary layer (1) and a layer (2) of large chips positioned on both sides of said intermediary layer. An outer layer (3) is provided on the 5 outer surface of each layer of large chips. In addition to the chips, the layers include an adhesive. The intermediary layer (1) includes a mixture of wood chips having chip fractions of a chip size of 0.1 to 20 mm, and the chips of this layer are randomly oriented. The individual chip in the layer (2) of large chips presents the following characteristics: a length of approx. 50 to approx. 130 mm, a width of approx. 4 to approx. 40 mm and a thickness of approx. 0.2 to approx. 2.0 mm. The chips within each layer (2) of large chips are all oriented in one and the same direction. As a result, a chip board is obtained which demonstrates a significantly higher E- module and stiffness in flexure than hitherto known despite a reduced consumption of material.
    • 一种芯片板,包括中间层(1)和位于所述中间层两侧的大芯片层(2)。 外层(3)设置在每个大芯片层的外表面上。 除了芯片之外,层包括粘合剂。 中间层(1)包括具有芯片尺寸为0.1至20mm的芯片部分的木片的混合物,并且该层的芯片是随机取向的。 大芯片层(2)中的单个芯片具有以下特征: 50到大约 130毫米,宽约 4到约 40毫米,厚约约 0.2〜 2.0毫米。 大芯片每层(2)内的芯片均朝同一方向取向。 结果,获得了尽管材料消耗减少的芯片板,其表现出比以前已知的更高的E模块和弯曲刚度。
    • 10. 发明申请
    • RESILIENT AND FLOATING DEVICE FOR PREVENTION OF FOULING OF BOAT BOTTOMS AND OF OTHER FLOATING OBJECTS
    • 用于防止船舶底板和其他浮动物体的弹性和浮动装置
    • WO2013039433A1
    • 2013-03-21
    • PCT/SE2011/000160
    • 2011-09-15
    • NILSSON, Bo
    • NILSSON, Bo
    • B63B59/04B63B59/08
    • B63B59/04B63B59/045B63B59/08
    • The present invention relates to a device for prevention of fouling of boat bottoms and other floating objects, said device consists of a flexible, mat like member intended to be positionally fixated to the bottom of the boat or another floating object in question with the aid of suitable fastening means, wherein the flexible, mat like structure consists of a mat (2), which after having been driven up onto by a boat hull over the same, is pressed upwards in a direction towards the boat hull bottom into close contact therewith. The mat (2) consists of a resilient, floating material such as plastic tubes with closed ends or, alternatively, rope or homogeneous cord (3) having a lower density than water and which mutually form a grid pattern (4) with a mesh size adapted to the desired lifting power over the entire surface of the mat (2), which is intended for contact with the boat bottom of the floating object in question so as to conform to the shape of the bottom of the boat by means of the water pressure and which grid pattern (4) between the tubes (3) allows the abrased waste of vegetation to easily penetrate through the mat (2) to sink down to the bottom without adhering to the minimal surface of the mat (2), whereby ongoing contact and movement created by the mat through its resilient and floating construction against the surface of the object prevent organisms from starting to grow when the object is driven up onto the mat.
    • 本发明涉及一种用于防止船底和其他浮动物体结垢的装置,所述装置由柔性的垫子构件组成,其用于借助于位置固定在船的底部或另一浮动物体上 合适的紧固装置,其中柔性垫子结构由垫子(2)组成,垫子(2)在被其船体上方驱动到其上之后被向上压向船体底部的方向与其紧密接触。 垫(2)由弹性浮动材料组成,例如具有封闭端的塑料管,或者具有比水密度低的绳索或均质绳索(3),并且相互形成网格尺寸的网格图案(4) 适于在垫子(2)的整个表面上的期望的提升力,其用于与所讨论的浮动物体的船底部接触,以便通过水符合船的底部的形状 压力和管(3)之间的网格图案(4)允许植被的磨损浪费容易地穿过垫子(2)以下沉到底部而不粘附到垫(2)的最小表面,由此持续 由垫子通过其抵抗物体表面的弹性和浮动结构产生的接触和运动防止当物体被驱动到垫子上时生物体开始生长。