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1. 发明申请

WO2010036304A2 LASER ABLATION TO CREATE POCKET FOR DIE PLACEMENT 审中-公开
标题翻译：激光消除创建口袋放置
公开(公告)号：WO2010036304A2
公开(公告)日：2010-04-01
申请号：PCT/US2009005070
申请日：2009-09-10
申请人： EASTMAN KODAK CO , KERR ROGER STANLEY , TREDWELL TIMOTHY JOHN , BAEK SEUNG-HO
发明人： KERR ROGER STANLEY , TREDWELL TIMOTHY JOHN , BAEK SEUNG-HO
IPC分类号： H01L21/68 , G06K19/077 , H01L21/48 , H01L21/60 , H01L21/98 , H01L23/13
CPC分类号： H01L21/6835 , G06K19/07 , H01L21/4803 , H01L23/13 , H01L23/49855 , H01L24/19 , H01L25/50 , H01L2221/68354 , H01L2224/04105 , H01L2224/20 , H01L2224/95136 , H01L2924/01033 , H01L2924/01077 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043
摘要： Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, by selectively and scalably embedding or seating IC elements onto/into a receiving substrate, such as a chip substrate. Specifically, the assembly of IC chips can include forming a pocket in the receiving substrate to accommodate the IC elements therein. Such pockets can be formed in the receiving substrate using laser ablation.
摘要翻译：示例性实施例提供了用于通过有选择地和可扩展地将IC元件嵌入或放置到接收基板（例如芯片基板）上的诸如集成电路（IC）芯片之类的电子装置的组装方法和系统。具体来说，IC芯片的组装可以包括在接收基板中形成一个凹坑以容纳其中的IC元件。可以使用激光烧蚀在接收衬底中形成这样的凹穴。

2. 发明申请

WO2008042110A3 FLEXIBLE SUBSTRATE WITH ELECTRONIC DEVICES AND TRACES 审中-公开
标题翻译：具有电子设备和轨迹的柔性基板
公开(公告)号：WO2008042110A3
公开(公告)日：2008-07-31
申请号：PCT/US2007020144
申请日：2007-09-18
申请人： EASTMAN KODAK CO , TREDWELL TIMOTHY JOHN , KERR ROGER STANLEY
发明人： TREDWELL TIMOTHY JOHN , KERR ROGER STANLEY
IPC分类号： H01L29/786 , H01L21/77 , H01L27/12
CPC分类号： H01L29/78603 , H01L27/124 , Y10T156/10
摘要： A method of manufacturing an electronic device (10) provides a substrate (20) that has a plastic material and has a metallic coating on one surface. A portion of the metallic coating is etched to form a patterned metallic coating. A particulate material (16) is embedded in at least one surface of the substrate. A layer of thin-film semiconductor material is deposited onto the substrate (20).
摘要翻译：制造电子器件（10）的方法提供了具有塑料材料并且在一个表面上具有金属涂层的基底（20）。金属涂层的一部分被蚀刻以形成图案化的金属涂层。颗粒材料（16）嵌入在基底的至少一个表面中。将一层薄膜半导体材料沉积在衬底（20）上。

3. 发明申请

WO2005027500A3 TRACKING A MEDIUM USING WATERMARK AND MEMORY 审中-公开
标题翻译：使用水印和内存跟踪媒体
公开(公告)号：WO2005027500A3
公开(公告)日：2005-05-06
申请号：PCT/US2004028517
申请日：2004-09-02
申请人： EASTMAN KODAK CO , KERR ROGER STANLEY , TREDWELL TIMOTHY JOHN , DUMONT CHRISTOPHER LEE , CARROLL-YACOBY DIANE MARIE , JONES PAUL WILLIAM , STWERTKA PETER MATTHEW
发明人： KERR ROGER STANLEY , TREDWELL TIMOTHY JOHN , DUMONT CHRISTOPHER LEE , CARROLL-YACOBY DIANE MARIE , JONES PAUL WILLIAM , STWERTKA PETER MATTHEW
IPC分类号： G03B27/475 , H04N1/32
CPC分类号： G03B27/475
摘要： A method for tracking a segment of an image-recording medium and an image-recording medium are provided. In a first aspect of the invention what is provided is a method for distributing an image-recording medium. In accordance with the method, an identifying mark is encoded within a recorded image area on the image-recording medium. A tracking memory is associated with the image-recording medium with the tracking memory having information stored therein. The image-recording medium is distributed to users of the image-recording medium and tracking information from the tracking memory is read and stored in a database that associates the users to whom the image-recording medium has been distributed with the identifying mark recorded in the image area.
摘要翻译：提供了一种用于跟踪图像记录介质的片段和图像记录介质的方法。在本发明的第一方面中提供了一种用于分配图像记录介质的方法。根据该方法，识别标记被编码在图像记录介质上的记录图像区域内。跟踪存储器与具有存储在其中的信息的跟踪存储器的图像记录介质相关联。将图像记录介质分配给图像记录介质的用户，并且读取来自跟踪存储器的跟踪信息并将其存储在数据库中，该数据库将已经分发了图像记录介质的用户与记录在图像区域。

4. 发明申请

WO2010036306A3 SOLVENT SOFTENING TO ALLOW DIE PLACEMENT 审中-公开
标题翻译：解决方案要保证放置
公开(公告)号：WO2010036306A3
公开(公告)日：2010-05-20
申请号：PCT/US2009005076
申请日：2009-09-10
申请人： EASTMAN KODAK CO , KERR ROGER STANLEY , TREDWELL TIMOTHY JOHN , BAEK SEUNG-HO
发明人： KERR ROGER STANLEY , TREDWELL TIMOTHY JOHN , BAEK SEUNG-HO
IPC分类号： H01L21/56 , H01L21/60
CPC分类号： H01L24/82 , H01L21/56 , H01L24/19 , H01L24/96 , H01L24/97 , H01L2221/68363 , H01L2223/6677 , H01L2224/04105 , H01L2224/18 , H01L2224/76155 , H01L2224/82102 , H01L2224/97 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/09701 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/82
摘要： Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, (250) by selectively and seating IC elements onto/into a receiving substrate (210) such as a chip substrate. Specifically, the assembly of IC chips can include embedding IC elements onto the receiving substrate upon softening the receiving substrate. Such softening can be performed by using a softening agent (220).
摘要翻译：示例性实施例提供了用于通过选择性地将IC元件放置到诸如芯片基板的接收基板（210）上来组装诸如集成电路（IC）芯片（250）的电子设备的方法和系统。具体来说，IC芯片的组装可以包括在接收基板软化时将IC元件嵌入到接收基板上。这种软化可以通过使用软化剂（220）进行。

5. 发明申请

WO2010036307A3 METHOD OF ASSEMBLING INTEGRATED CIRCUIT ELEMENTS WITH A CHIP SUBSTRATE USING A THERMAL ACTIVATABLE BARRIER LAYER AND THE RESULTING PRODUCT THEREOF 审中-公开
标题翻译：使用热激活障碍层组装芯片基板的集成电路元件及其结果产品的方法
公开(公告)号：WO2010036307A3
公开(公告)日：2010-08-19
申请号：PCT/US2009005078
申请日：2009-09-10
申请人： EASTMAN KODAK CO , KERR ROGER STANLEY , TREDWELL TIMOTHY JOHN , BAEK SEUNG-HO
发明人： KERR ROGER STANLEY , TREDWELL TIMOTHY JOHN , BAEK SEUNG-HO
IPC分类号： H01L21/60 , H01L21/68
CPC分类号： H01L24/83 , H01L21/6835 , H01L24/19 , H01L24/29 , H01L24/82 , H01L24/97 , H01L2221/68354 , H01L2221/68363 , H01L2221/68368 , H01L2223/6677 , H01L2224/04105 , H01L2224/16 , H01L2224/18 , H01L2224/2919 , H01L2224/29298 , H01L2224/7565 , H01L2224/76155 , H01L2224/7665 , H01L2224/81005 , H01L2224/81143 , H01L2224/82102 , H01L2224/83192 , H01L2224/838 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01077 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10T29/53178 , H01L2224/82 , H01L2224/83 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/0401
摘要： Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, by selectively and scalably embedding or seating IC elements onto/into a receiving substrate, such as a chip substrate. Preparing of the chip substrate can be performed by depositing or patterning an activatable thermal barrier material on a surface of the substrate. The IC chips are secured on the prepared substrate by activating the thermal barrier material between the chip substrate and IC chips. Securing can include softening of the chip substrate with the activated thermal barrier material to an amount suitable for embedding the IC chips. Securing can also include adhesively bonding the IC chips to the substrate with the activated thermal barrier material in the case of a non-pliable substrate.
摘要翻译：示例性实施例提供了用于通过有选择地和可扩展地将IC元件嵌入或放置到接收基板（例如芯片基板）上的诸如集成电路（IC）芯片之类的电子装置的组装方法和系统。可以通过在基板的表面上沉积或图案化可激活的热障材料来进行芯片基板的制备。通过激活芯片衬底和IC芯片之间的热障材料，将IC芯片固定在制备的衬底上。固定可以包括利用活化的热障材料将芯片基板软化到适于嵌入IC芯片的量。在非柔性基板的情况下，固定还可以包括将IC芯片与激活的热障材料粘合到基板上。

6. 发明申请

WO2005119612A3 SYSTEM AND DEVICE FOR DETECTING OBJECT TAMPERING 审中-公开
标题翻译：用于检测对象篡改的系统和设备
公开(公告)号：WO2005119612A3
公开(公告)日：2006-05-04
申请号：PCT/US2005018416
申请日：2005-05-24
申请人： EASTMAN KODAK CO , KERR ROGER STANLEY , TREDWELL TIMOTHY JOHN
发明人： KERR ROGER STANLEY , TREDWELL TIMOTHY JOHN
IPC分类号： G08B13/12 , G08B13/186
CPC分类号： G08B13/126 , G08B13/186
摘要： Systems and devices are provided for detecting access to an object. A pattern of conductors extending in spaced, isolated configuration is provided on the object defining a tamper detection area. At least one sensor device is connected to the pattern of conductors and is capable of detecting a change in the continuity of the pattern of conductors. A communication circuit provides at least one signal indicative of the change in continuity of the pattern of conductors. The tamper detection area of conductors confronts each surface of the object.
摘要翻译：系统和设备被提供用于检测对对象的访问。在间隔开的隔离结构上延伸的导体图形被提供在定义篡改检测区域的对象上。至少一个传感器设备连接到导体图案，并且能够检测导体图案的连续性的变化。通信电路提供指示导体图案的连续性变化的至少一个信号。导体的篡改检测区域面对物体的每个表面。

7. 发明申请

WO2005066871A2 PATIENT INFORMATION MANAGEMENT SYSTEM AND METHOD 审中-公开
标题翻译：患者信息管理系统与方法
公开(公告)号：WO2005066871A2
公开(公告)日：2005-07-21
申请号：PCT/US2004042319
申请日：2004-12-16
申请人： EASTMAN KODAK CO , KERR ROGER STANLEY , TREDWELL TIMOTHY JOHN
发明人： KERR ROGER STANLEY , TREDWELL TIMOTHY JOHN
IPC分类号： G03B42/04 , G06F19/00 , G06Q10/00
CPC分类号： G06Q50/22 , G06F19/3418 , G06Q10/10 , G16H40/20
摘要： A patient information management system and method form managing patient information is provided. A first identifier for storing patient identification data in a remotely readable form and a second identifier associated with a medical device for storing patient medical information in a remotely readable form are provided. At least one reader remotely reads data stored in the first and second identifiers and communicates this data to an external database.
摘要翻译：提供了管理患者信息的患者信息管理系统和方法。提供用于以远程可读形式存储患者识别数据的第一标识符和与用于以远程可读形式存储患者医疗信息的医疗设备相关联的第二标识符。至少一个读取器远程读取存储在第一和第二标识符中的数据，并将该数据传送到外部数据库。

8. 发明申请

WO2007142788A2 LASER ABLATION RESIST 审中-公开
标题翻译：激光消除电阻
公开(公告)号：WO2007142788A2
公开(公告)日：2007-12-13
申请号：PCT/US2007011626
申请日：2007-05-15
申请人： EASTMAN KODAK CO , PHILLIPS SCOTT E , TREDWELL TIMOTHY JOHN , TUTT LEE W , PEARCE GLENN THOMAS , NGUYEN KELVIN , WEXLER RONALD MYRON
发明人： PHILLIPS SCOTT E , TREDWELL TIMOTHY JOHN , TUTT LEE W , PEARCE GLENN THOMAS , NGUYEN KELVIN , WEXLER RONALD MYRON
CPC分类号： G03F1/00 , Y10S430/145 , Y10S430/146
摘要： A method of making micro-structure devices by coating a first layer of resist (12) on a substrate (10). A pattern is created on the substrate by radiation induced thermal removal of the resist.
摘要翻译：一种通过在基板（10）上涂覆第一抗蚀剂层（12）来制造微结构器件的方法。通过抗蚀剂的辐射诱导热去除在衬底上产生图案。

9. 发明申请

WO2008088477A3 IMAGING ARRAY FOR MULTIPLE FRAME CAPTURE 审中-公开
标题翻译：成像阵列多个帧捕获
公开(公告)号：WO2008088477A3
公开(公告)日：2009-02-12
申请号：PCT/US2007024809
申请日：2007-12-03
申请人： CARESTREAM HEALTH INC , TREDWELL TIMOTHY JOHN
发明人： TREDWELL TIMOTHY JOHN
IPC分类号： H04N5/32 , H04N5/361 , H04N5/369
CPC分类号： H04N5/37452 , H04N5/3741
摘要： An imaging array has a plurality of pixel sites (22), each having a photosensing element (24) providing a variable signal in response to incident radiation. A first frame storage circuit (46a) is electrically coupled to the photosensing element and has a first charge storage element for storing a first photosensing element signal and a first switching element (26) to switch the photosensing element to the first frame storage circuit. A second switching element (26) switches the first charge storage element (32) for reading the signal stored. A second frame storage circuit (46b) is electrically coupled to the photosensing element and has a second charge storage element for storing a second signal. A third switching element (26) switches the photosensing element to the second frame storage circuit. A fourth switching element (26) switches the second charge storage element for reading the signal stored.
摘要翻译：成像阵列具有多个像素位置（22），每个像素位置（22）具有响应入射辐射提供可变信号的光敏元件（24）。第一帧存储电路（46a）电耦合到光敏元件，并且具有用于存储第一光敏元件信号的第一电荷存储元件和用于将光敏元件切换到第一帧存储电路的第一开关元件（26）。第二开关元件（26）切换第一电荷存储元件（32）以读取存储的信号。第二帧存储电路（46b）电耦合到光敏元件，并具有用于存储第二信号的第二电荷存储元件。第三开关元件（26）将光敏元件切换到第二框架存储电路。第四开关元件（26）切换第二电荷存储元件以读取所存储的信号。

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