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    • 1. 发明申请
    • PLASMA PROCESSING FOR POROUS SILICA THIN FILM
    • 多孔二氧化硅薄膜的等离子体处理
    • WO0170628A3
    • 2002-04-18
    • PCT/US0108997
    • 2001-03-20
    • DOW CORNINGAXCELIS TECH INC
    • BERRY IVAN LOUIS IIICHUNG KYUHAHAN QINGYUANLIU YOUFANMOYER ERIC SCOTTSPAULDING MICHAEL JOHNWALDFRIED CARLOBRIDGEWATER TODDCHEN WEI
    • C01B33/12H01L21/312H01L21/314H01L21/316C04B41/50
    • H01L21/3122C01B33/126H01L21/02126H01L21/02203H01L21/02216H01L21/02282H01L21/02337H01L21/0234H01L21/31695Y10T428/31663
    • Low dielectric constant films with improved elastic modulus. The method of making such coatings involves providing a porous network coating produced from a resin containing at least 2 Si-H groups. The coating can be thermally cured and has a dielectric constant in the range of from about 1.1 to about 3.5. Plasma treatment of the thermally cured coating will convert the coating into porous silica. Plasma treatment of the thermally cured porous network coating yields a coating with improved modulus, but with a higher dielectric constant. The coating is plasma treated for between about 15 and about 120 seconds at a temperature less than about 350 DEG C. Porous network coatings can also be plasma cured without prior thermal curing. The coating can be plasma cured at a temperature between about 200 DEG C and about 250 DEG C for less than about 5 minutes. The thermally cured plasma treated coating or plasma cured coating can optionally be annealed. Annealing by rapid thermal processing (RTP) of the thermally cured plasma treated or plasma cured coating reduces the dielectric constant of the coating while maintaining an improved elastic modulus. The annealing temperature is preferably less than about 475 DEG C, and the annealing time is preferably no more than about 180 seconds. The annealed, thermally cured plasma treated or plasma cured coating has a dielectric constant in the range of from about 1.1 to about 3.5 and an improved elastic modulus.
    • 具有改善的弹性模量的低介电常数膜。 制备这种涂层的方法包括提供由含有至少2个Si-H基团的树脂制备的多孔网状涂层。 涂层可以热固化,并且介电常数在约1.1至约3.5的范围内。 热固化涂层的等离子体处理将将涂层转化为多孔二氧化硅。 热固化多孔网络涂层的等离子体处理产生具有改进模量但具有较高介电常数的涂层。 该涂层在小于约350℃的温度下进行等离子体处理约15至约120秒。多孔网络涂层也可以在没有预先热固化的情况下进行等离子体固化。 涂层可以在约200℃至约250℃的温度下等离子体固化少于约5分钟。 热固化的等离子体处理的涂层或等离子体固化涂层可以任选地退火。 经热固化的等离子体处理或等离子体固化涂层的快速热处理(RTP)退火降低了涂层的介电常数,同时保持了改进的弹性模量。 退火温度优选小于约475℃,退火时间优选不大于约180秒。 经退火的热固化等离子体处理或等离子体固化涂层的介电常数在约1.1至约3.5的范围内并具有改进的弹性模量。
    • 4. 发明申请
    • NANOSCALE PHOTOLITHOGRAPHY
    • 纳米级光刻
    • WO2012064633A3
    • 2012-08-09
    • PCT/US2011059532
    • 2011-11-07
    • DOW CORNINGUNIV MICHIGANFU PENG-FEIGUO LINGJIE JAYMOYER ERIC SCOTTPINA-HERNANDEZ CARLOS
    • FU PENG-FEIGUO LINGJIE JAYMOYER ERIC SCOTTPINA-HERNANDEZ CARLOS
    • G03F7/00G03F7/16G03F7/40
    • B05D1/36B82Y10/00B82Y40/00G03F7/0002G03F7/165G03F7/405Y10T428/24479Y10T428/24612
    • A simple and practical method that can reduce the feature size of a patterned structure bearing surface hydroxyl groups is described. The patterned structure can be obtained by any patterning technologies, such as photo-lithography, e-beam lithography, nano-imprinting lithography. The method includes: (1) initially converting the hydroxyl or silanol-rich surface into an amine-rich surface with the treatment of an amine agent, preferably a cyclic compound; (2) coating an epoxy material on the top of the patterned structure; (3) forming an extra layer when applied heat via a surface-initiated polymerization; (4) applying an amine coupling agent to regenerate the amine-rich surface; (5) coating an epoxy material on the top of the patterned structure to form the next layer; (6) repeating step 4 and 5 to form multiple layers; This method allows the fabrication of feature sizes of various patterns and contact holes that are difficult to reach by conventional lithographic methods.
    • 描述了一种简单且实用的方法,其可以减小承载表面羟基的图案化结构的特征尺寸。 图案化结构可以通过任何图案化技术获得,例如光刻,电子束光刻,纳米压印光刻。 该方法包括:(1)通过处理胺试剂,优选环状化合物,将羟基或富含硅烷醇的表面初始转化成富胺表面; (2)在图案化结构的顶部涂布环氧树脂材料; (3)当通过表面引发的聚合反应加热时形成额外的层; (4)施加胺偶联剂以再生富胺表面; (5)在图案化结构的顶部涂布环氧材料以形成下一层; (6)重复步骤4和5以形成多个层; 该方法允许制造通过常规光刻方法难以达到的各种图案和接触孔的特征尺寸。