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1. 发明申请

WO2007009232A1 LOW TEMPERATURE FIRED, LEAD-FREE THICK FILM HEATING ELEMENT 审中-公开
标题翻译：低温灭火，无铅厚膜加热元件
公开(公告)号：WO2007009232A1
公开(公告)日：2007-01-25
申请号：PCT/CA2006/001169
申请日：2006-07-18
申请人： DATEC COATING CORPORATION , OLDING, Timothy Russell , BARROW, David Andrew , RUGGIERO, Mary
发明人： OLDING, Timothy Russell , BARROW, David Andrew , RUGGIERO, Mary
IPC分类号： H05B3/10 , C23C24/00 , H05B3/12 , H05B3/16 , H05B3/26
CPC分类号： C23C28/00 , C23C18/1212 , C23C18/1216 , C23C18/1225 , C23C18/1245 , C23C18/1254 , C23C18/127 , C23C26/00 , C23C28/04 , C23C28/042 , C23C30/00 , H01C17/06526 , H05B3/141 , H05B3/265 , H05B2203/013 , H05B2203/017 , Y10T428/24917
摘要： A lead free, thick film heating element. Known thick film heating elements contain environmentally hazardous material such as lead. This is particularly problematic when manufacturing thick film heating elements, as lead is often used in thick film formulations to allow the glass-based thick film to be processed at low firing temperatures. Using composite sol gel technology, the present invention provides a method to produce a lightweight mica-based thick film heating element based on thick film materials that are free from lead or cadmium. This mica-based element is lightweight, has the performance advantages of a thick film heating element, and may be processed at a low temperature using thick film materials. Particularly, the present invention provides a lightweight heating element comprised of a mica-based substrate material, a resistive thick film that can be produced by composite sol gel technology, optionally a conductive thick film which is used to make electrical connection to the resistive element, and optionally a topcoat which is used to provide protection against moisture and oxidation. This element is lightweight, provides efficient, rapid heat up and cool down, can be designed to provide even temperature distribution, and delivers power at lower operating temperatures resulting in increased element safety.
摘要翻译：无铅，厚膜加热元件。已知的厚膜加热元件含有环境有害物质，如铅。当制造厚膜加热元件时，这是特别有问题的，因为铅通常用于厚膜配方中以允许在低烧制温度下处理玻璃基厚膜。使用复合溶胶凝胶技术，本发明提供一种制备基于不含铅或镉的厚膜材料的轻质云母基厚膜加热元件的方法。这种云母元素是轻质的，具有厚膜加热元件的性能优点，并且可以使用厚膜材料在低温下加工。特别地，本发明提供了一种轻质加热元件，其包括云母基材料，可通过复合溶胶凝胶技术制备的电阻厚膜，可选地用于与电阻元件电连接的导电厚膜，和任选的面漆，其用于提供防止水分和氧化的保护。该元件重量轻，提供高效，快速的加热和冷却，可设计为提供均匀的温度分布，并在较低的工作温度下提供功率，从而提高元件安全性。

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