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1. 发明申请

WO2008125232A2 COMPOSITE COMPONENT AND A METHOD AND DEVICE FOR PRODUCING THE COMPOSITE COMPONENT 审中-公开
标题翻译：复合材料构件和方法及装置部件制造
公开(公告)号：WO2008125232A2
公开(公告)日：2008-10-23
申请号：PCT/EP2008002682
申请日：2008-04-04
申请人： DAIMLER AG , BECHTOLD MICHAEL , DUDZIAK KAI-UWE , JUNGE DIETER , SCHROEDER MATTHIAS , LANGWALDT SILKE , MAIER HANS-PETER , NOTTBUSCH HANS-PETER , AUGUSTIN HELMUT , FALKE JUERGEN , SCHULT JENS , REESE ECKHARD
发明人： BECHTOLD MICHAEL , DUDZIAK KAI-UWE , JUNGE DIETER , SCHROEDER MATTHIAS , LANGWALDT SILKE , MAIER HANS-PETER , NOTTBUSCH HANS-PETER , AUGUSTIN HELMUT , FALKE JUERGEN , SCHULT JENS , REESE ECKHARD
IPC分类号： B29C45/14
CPC分类号： B29C45/1418 , B29C2045/14213 , B29L2023/00 , Y10T428/13 , Y10T428/1355
摘要： The invention relates to a method and a device (1, 16) for producing a composite component (2) made of a hollow profile (3) and at least one injection-molded element (4, 25), wherein a hollow profile (3) is formed by means of internal high pressure fluid forming and is encapsulated with an injection molding material to form the injection-molded element (4, 25). In order to allow the production of even a complexly designed composite component (2) in a simple manner, it is proposed that the hollow profile (3) is expanded by means of internal high pressure in a closed combination tool comprising an internal high pressure forming tool element (5) and an injection molding tool element (6) before it is encapsulated, wherein the hollow profile (3) is pressed only locally on the tool engraving (7, 17) in the region of the location to be encapsulated, keeping the outlet (11) of the injection molding channel (10, 23) opening into the tool engraving (7, 17) clear.
摘要翻译：本发明涉及一种用于生产（3）和至少一个注入元件（4，25），中空型材（3）通过流体内部高压的装置和用注塑材料转化的空心型材的复合部件（2）的方法和装置（1，16）被包覆模制以形成所述模制元件（4，25）。为了使制造也以简单的方式的复合形成的复合部件（2）中，提出的是由Innenhochdruckumformwerkzeugelement（5）和一个Spritzgießwerkzeugelement（6）通过内部高压的装置加宽的在封闭组合工具的空心型材（3）， Spritzgießkanals它被模制之前，其特征在于，在工具上雕刻的空心型材（3）（7，17）开口进入该地区被下工具雕刻的自由姿态包封的地方（7，17）的出口（11）（10，23）仅在局部被按下。

2. 发明申请

WO2009146683A2 HEAT TRANSFER DEVICE HAVING AT LEAST ONE SEMICONDUCTOR ELEMENT, PARTICULARLY A LASER OR LIGHT-EMITTING DIODE ELEMENT, AND METHOD FOR THE ASSEMBLY THEREOF 审中-公开
标题翻译：与至少一个半导体元件，特别是激光或LED元素，方法进行组装传热装置
公开(公告)号：WO2009146683A2
公开(公告)日：2009-12-10
申请号：PCT/DE2009000770
申请日：2009-06-02
申请人： JENOPTIK LASERDIODE GMBH , SCHROEDER MATTHIAS , LORENZEN DIRK
发明人： SCHROEDER MATTHIAS , LORENZEN DIRK
IPC分类号： H01S5/024 , H01S5/40
CPC分类号： H01S5/024 , H01S5/02264 , H01S5/02272 , H01S5/02484 , H01S5/4025
摘要： The invention relates, among other things, to a method for the assembly of a semiconductor component, wherein the semiconductor component on mutually opposing sides is joined in a first and a second bonded connection with a heat-conducting body each. For this purpose, the heat-conducting bodies are joined in a third bonded connection in the region of the sections thereof extending away from the semiconductor element, wherein a spacer, which with regard to the third connection is disposed on the opposite side of the semiconductor component between the heat-conducting bodies, in conjunction with the requirement that the joining zone thickness of the third connection is greater than that of the first or the second joining zone, ensures that defined joining zone thicknesses in the bonded connection are maintained during the joining process. The third connection is used for the at least partial heat transfer of the waste heat of the semiconductor component, particularly to a heat sink that is connected to the heat transfer device produced according to the invention.
摘要翻译：本发明涉及尤其用于其中所述半导体器件被放置在相对侧上在第一和第二接合的连接，每一个都具有导热体安装半导体器件的方法。热导体连接用于此目的的在从半导体器件的部分向外延伸的区域中的第三材料连接，其特征在于，其被布置成相对于第三关节上的热导体间的半导体装置的另一侧连同要求的隔离物，所述第三化合物的接合区的厚度是比第一或用于维护关节区厚度的定义使得在接合过程中的接合连接第二关节区的大。经由第三连接至少部分的热，特别是半导体元件的废热传递到连接于本发明的装置产生的热传递装置的散热器。

3. 发明申请

WO2009143835A3 HEAT TRANSFER DEVICE FOR DOUBLE-SIDED COOLING OF A SEMICONDUCTOR COMPONENT 审中-公开
标题翻译：传热装置双面冷却半导体COMPONENT
公开(公告)号：WO2009143835A3
公开(公告)日：2010-09-23
申请号：PCT/DE2009000761
申请日：2009-05-29
申请人： JENOPTIK LASERDIODE GMBH , SCHROEDER MATTHIAS , LORENZEN DIRK
发明人： SCHROEDER MATTHIAS , LORENZEN DIRK
IPC分类号： H01S5/024 , H01S5/40
CPC分类号： H01S5/024 , H01S5/02264 , H01S5/02272 , H01S5/4025
摘要： The invention relates to a heat transfer device wherein two heat transfer bodies are adhesively connected to opposite sides on contact surfaces of a semiconductor component, extending beyond the semiconductor component. The heat conducting bodies have metal regions constituting the majority of the heat conducting bodies and being in electrical contact with the semiconductor component. An electrically insulating joining agent connects the metal regions of the heat conducting bodies adhesively to each other on the opposite side from the semiconductor component, or at least one of said metal regions to a further metal region of an intermediate body placed between the heat conducting bodies. At least one of the metal regions connected between the heat conducting bodies by the electrically insulating adhesive is disposed at least in segments between the contact surface planes.
摘要翻译：因此建议，其中两个导热体被一体地安装在半导体元件的接触区域的相对侧上并且延伸超过半导体部件除了传热装置。该热导体具有金属的区域，从而弥补了热导体的主要部分，并且在与半导体器件电连通。电绝缘连接装置的热传导关断半导体元件的金属部分连接到内聚彼此或与设置在导热中间本体之间的产品的另一金属部分这些金属的区域中的至少一个。热导体被电绝缘连接装置连接在金属区域中的至少一个之间设置至少在所述接触表面的平面之间的部分。

4. 发明申请

WO2010015352A3 HEAT DISSIPATION MODULE HAVING A SEMICONDUCTOR ELEMENT AND PRODUCTION METHOD FOR SUCH A HEAT DISSIPATION MODULE 审中-公开
标题翻译：具有半导体元件的热交换模块以及制造这种热提取模块的方法
公开(公告)号：WO2010015352A3
公开(公告)日：2010-08-26
申请号：PCT/EP2009005501
申请日：2009-07-29
申请人： JENOPTIK LASERDIODE GMBH , LORENZEN DIRK , SCHROEDER MATTHIAS
发明人： LORENZEN DIRK , SCHROEDER MATTHIAS
IPC分类号： H01S5/024
CPC分类号： H01S5/4025 , H01S5/02264 , H01S5/02272 , H01S5/024 , H01S5/02476 , H01S5/4018
摘要： The invention relates to a heat dissipation module having a semiconductor element (2) comprising a first side and an opposing second side (13, 12), to a first electrically conductive heat dissipating body (3) which has a first contact surface (6) with a first section (8) and an adjacent second section (9), to a second electrically conductive heat dissipation body (4) which has a second contact surface (7) that faces the first contact surface (6) and has a third section (10) and adjacent thereto a fourth section (11), the semiconductor element (2) being arranged between the two heat dissipating bodies (3, 4), the first side (13) being joined to the first section (8) and the second side (12) to the third section (10) such that the first side (12) of the semiconductor element (2) is contacted thermally and electrically with the first section (8) of the first contact surface (6) and the second side (12) of the semiconductor element (2) is contacted thermally and electrically with the third section (10) of the second contact surface (7), and the second section (9) being thermally, but not electrically connected to the fourth section (11) by an interposed electric insulating layer (16), characterized in that a current conduction element (5) is arranged between the electric insulating layer (16) and the fourth section (11) of the second contact surface (7), said element being in thermal contact with the insulating layer (16) and in thermal and electric contact with the fourth section (11), wherein the current conduction element (15) comprises an end section (17) extending at least beyond one of the two contact surfaces (6, 7).
摘要翻译：提供了一种Wärmeableitmodul具有第一和相对的第二侧（13，12），其具有半导体元件（2），第一导电散热（3），其具有（6）具有第一部分的第一接触表面装置（8）和一个（10）和与其相邻的第四部分（11），第二导电散热体（4）具有面向第一接触表面（6）的第二接触表面（7）其中所述两个Wärmeableitkörpern之间的半导体元件（2）（3，4）被布置，而第一侧（13），从而所述第一部分（8）和所述第二侧（12），作为对第三部分（10）接合在使半导体元件的所述第一侧（12）（2）热和电连接到所述第一接触表面（6）和所述半导体元件的所述第二侧（12）的第一部分（8）（2）疗法混合并电连接到所述第二接触表面（7）的第三部分（10）接触，并且其中，与通过其间的电绝缘层（16）的第四部分（11）的第二部分（9），而热，但不电连接其特征在于，所述电绝缘层（16）与所述第二接触表面（7）的所述第四部分（11）之间的载流元件（5）与所述绝缘层（16）热接触，并且所述第四区段（11）处于热接触和电接触，其中载流元件（15）经由两个接触表面（6,7）中的至少一个突出连接部分（17）。

5. 发明申请

WO2009146695A2 HEAT TRANSFER DEVICE COMPRISING A SEMICONDUCTOR COMPONENT AND CONNECTING DEVICE FOR THE OPERATION THEREOF 审中-公开
标题翻译：换热设备与半导体元件和连接设备为您的操作
公开(公告)号：WO2009146695A2
公开(公告)日：2009-12-10
申请号：PCT/DE2009000797
申请日：2009-06-05
申请人： JENOPTIK LASERDIODE GMBH , SCHROEDER MATTHIAS , LORENZEN DIRK , ROELLIG ULRICH
发明人： SCHROEDER MATTHIAS , LORENZEN DIRK , ROELLIG ULRICH
IPC分类号： H01S5/024 , H01L23/40 , H01S5/40
CPC分类号： H01S5/024 , H01L2023/4056 , H01L2924/0002 , H01S5/02264 , H01S5/02272 , H01S5/02476 , H01S5/4025 , H01L2924/00
摘要： The object for a heat transfer device, in which a first and a second thermally conductive body cool a semiconductor component on both sides, is to fasten the connections required for the operation of the semiconductor component and to be designed in a detachable manner, particularly two electrical connections and a thermal connection, to the heat transfer device using a number of non-positively acting connection elements that is reduced compared to the prior art. In order to achieve the object, according to the invention each thermally conductive body is provided with a continuous recess, wherein recesses above an opening in a joining zone, which bonds the thermally conductive bodies opposite of the semiconductor element, communicate with each other, the first thermally conductive body is provided for connecting to a heat sink, and the thickness of the second thermally conductive body is limited to a minimum of half the lateral extension of the semiconductor component. For this purpose, the bonded connection of a joining gap comprising the joining zone has a support function that is based on the structure and material. In the connecting device according to the invention for the heat transfer device, at least one or both electrical connections are non-positively fastened to the heat transfer device, together with the non-positive fastening of the heat transfer device to a connecting body, using a non-positively acting connecting element, which engages in the connecting body through the recesses in the thermally conductive bodies.
摘要翻译：用于传热装置，其中第一和第二热传导元件，半导体器件双面冷却，存在所需的半导体器件的操作和释放地成形的连接的任务，特别是两个电连接和相对于现有技术具有热连接以固定的正作用在传热装置的连接元件数量减少。为了达到上述目的，提出通过在接合区域中的开口，以提供各导热体具有连续凹槽，具有凹槽，所述内聚性地连接所述热导体断半导体器件中，与彼此通信，以用于连接到一个散热器提供第一导热体和到所述第二导热体的厚度限制到最小的半导体装置的一半的横向范围。具有关节间隙中的结合区的粘结具有的结构和材料有关的支持功能。在用于热传递装置的至少一个或两者的电连接的由通过在连接器主体的热传递装置的热导体的凹部卡合的非正性连接部件与热传递装置的非刚性紧固固定的非正一起在终端主体的本发明的连接装置。

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