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1. 发明申请

WO2010126592A1 LED PACKAGE WITH INCREASED FEATURE SIZES 审中-公开
标题翻译： LED包装具有增加的特征尺寸
公开(公告)号：WO2010126592A1
公开(公告)日：2010-11-04
申请号：PCT/US2010/001255
申请日：2010-04-27
申请人： CREE, INC. , EMERSON, David , KELLER, Bernd , HUSSELL, Christopher , SALTER, Amber , COLLINS, Brian , BERGMANN, Michael , EDMOND, John , TARSA, Eric , ANDREWS, Peter
发明人： EMERSON, David , KELLER, Bernd , HUSSELL, Christopher , SALTER, Amber , COLLINS, Brian , BERGMANN, Michael , EDMOND, John , TARSA, Eric , ANDREWS, Peter
IPC分类号： H01L33/58 , H01L33/64 , H01L33/20
CPC分类号： H01L33/58 , H01L33/20 , H01L33/486 , H01L33/54 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2924/01019 , H01L2924/01087 , H01L2924/00014
摘要： A light emitting diode (LED) package (30) having increased feature sizes for improved luminous flux and efficacy. A LED chip (34) is disposed on a submount (32) with a lens (70) that covers the LED chip. In some cases, the ratio of the width of the light LED chip to the width of said lens in a given direction is 0.5 or greater. Increased feature sizes allow the package to • emit light more efficiently. Some packages, include submounts having dimensions greater than 3.5 mm per 3.5 mm used in conjunction with larger LED chips. Materials having high thermal conductivities are used to fabricate the submounts, such as APN, providing the package with better thermal management.
摘要翻译：一种发光二极管（LED）封装（30），其具有增加的特征尺寸以改善光通量和功效。 LED芯片（34）设置在具有覆盖LED芯片的透镜（70）的底座（32）上。在一些情况下，光LED芯片的宽度与所述透镜在给定方向上的宽度的比率为0.5或更大。增加的特征尺寸可使包装更有效地发光。一些包装，包括尺寸大于3.5 mm / 3.5 mm的底座，与较大的LED芯片结合使用。使用具有高导热性的材料来制造诸如APN的底座，为封装提供更好的热管理。

2. 发明申请

WO2008091319A2 WAFER LEVEL PHOSPHOR COATING METHOD AND DEVICES FABRICATED UTILIZING METHOD 审中-公开
标题翻译：晶片级磷化涂层方法和装置的制造利用方法
公开(公告)号：WO2008091319A2
公开(公告)日：2008-07-31
申请号：PCT/US2007/024366
申请日：2007-11-20
申请人： CREE, INC. , SERUTO, James , CHITNIS, Ashay , IBBETSON, James , KELLER, Bernd , EMERSON, David, T. , EDMOND, David, T. , BERGMAN, Michael, J. , CABALU, Jasper, S. , BRITT, Jeffrey, C. , CHAKRABORTY, Arpan , TARSA, Eric, J. , FU, Yankun
发明人： SERUTO, James , CHITNIS, Ashay , IBBETSON, James , KELLER, Bernd , EMERSON, David, T. , EDMOND, David, T. , BERGMAN, Michael, J. , CABALU, Jasper, S. , BRITT, Jeffrey, C. , CHAKRABORTY, Arpan , TARSA, Eric, J. , FU, Yankun
IPC分类号： H01L33/00
CPC分类号： H01L33/508 , H01L33/0095 , H01L33/36 , H01L33/387 , H01L33/44 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.
摘要翻译：制造发光二极管（LED）芯片的方法包括通常在衬底上提供多个LED。基座沉积在LED上，每个基座与其中一个LED电接触。在LED上形成涂层，其中涂层至少埋置一些基座。然后平坦化涂层以暴露至少一些埋置基座，同时在所述LED上留下至少一些所述涂层。然后可以例如通过线键接触暴露的基座。本发明公开了用于制造具有倒装芯片键合在载体衬底上的LED和用于制造其他半导体器件的LED芯片的类似方法。还公开了使用所公开的方法制造的LED芯片晶片和LED芯片。

3. 发明申请

WO2011109096A1 LED LAMP INCORPORATING REMOTE PHOSPHOR WITH HEAT DISSIPATION FEATURES 审中-公开
标题翻译： LED灯具加热脱硫特点
公开(公告)号：WO2011109096A1
公开(公告)日：2011-09-09
申请号：PCT/US2011/000403
申请日：2011-03-02
申请人： CREE, INC , TONG, Tao , LETOQUIN, Ronan , KELLER, Bernd , TARSA, Eric
发明人： TONG, Tao , LETOQUIN, Ronan , KELLER, Bernd , TARSA, Eric
IPC分类号： F21K99/00 , F21V29/00 , F21Y101/02
CPC分类号： F21K9/64 , F21K9/00 , F21V29/004 , F21V29/006 , F21V29/75 , F21V29/76 , F21V29/767 , F21V29/85 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L33/644 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014
摘要： An LED lamp or bulb (50, 210, 240, 270) is disclosed that comprises a light source (58, 218, 248, 272), a heat sink structure (52, 212, 242, 274) and a remote planar phosphor carrier (62, 220, 250, 280) having at least one conversion material. The phosphor carrier can be remote to the light sources and mounted to the heat sink so that heat from the phosphor carrier spreads into the heat sink. The phosphor carrier can comprise a thermally conductive transparent material and a phosphor layer, with an LED based light source mounted to the heat sink such that light from the light source passes through the phosphor carrier. At least some of the LED light is converted by the phosphor carrier, with some lamp embodiments emitting a white light combination of LED and phosphor light. The phosphor arranged according to the present invention can operate at lower temperature to thereby operate at greater phosphor conversion efficiency and with reduced heat related damage to the phosphor.
摘要翻译：公开了一种LED灯或灯泡（50,210,240,270），其包括光源（58,218,248,272），散热器结构（52,212,242,274）和远程平面荧光体载体（62,220,250,280）具有至少一种转化材料。荧光体载体可以远离光源并且安装到散热器，使得来自荧光体载体的热量扩散到散热器中。荧光体载体可以包括导热透明材料和荧光体层，其中基于LED的光源安装到散热器，使得来自光源的光通过荧光体载体。至少一些LED光由荧光体载体转换，一些灯实施例发出LED和磷光体的白光组合。根据本发明布置的荧光体可以在较低的温度下工作，从而以较高的荧光体转换效率工作，并减少对荧光体的热损害。

4. 发明申请

WO2011109091A1 LED BASED PEDESTAL-TYPE LIGHTING STRUCTURE 审中-公开
标题翻译：基于LED的PEDESTAL型照明结构
公开(公告)号：WO2011109091A1
公开(公告)日：2011-09-09
申请号：PCT/US2011/000397
申请日：2011-03-02
申请人： CREE, INC. , TONG, Tao , LETOQUIN, Ronan , KELLER, Bernd , LOWES, Theodore , TARSA, Eric
发明人： TONG, Tao , LETOQUIN, Ronan , KELLER, Bernd , LOWES, Theodore , TARSA, Eric
IPC分类号： F21K99/00
CPC分类号： F21K9/56 , F21K9/00 , F21K9/232 , F21K9/64 , F21V3/00 , F21V3/04 , F21V29/773 , F21Y2107/00 , F21Y2107/40 , F21Y2115/10 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： LED based lamps and bulbs are disclosed that comprise a pedestal having a plurality of LEDs, wherein the pedestal at least partially comprises a thermally conductive material. A heat sink structure is included with the pedestal thermally coupled to the heat sink structure. A remote phosphor is arranged in relation to the LEDs so that at least some light from the LEDs passes through the remote phosphor and is converted to a different wavelength of light. Some lamp or bulb embodiments can emit a white light combination of light from the LEDs and the remote phosphor. These can include LEDs emitting blue light with the remote phosphor having a material that absorbs blue light and emits yellow or green light. A diffuser can be included to diffuse the emitting light into the desired pattern, such as omnidirectional.
摘要翻译：公开了基于LED的灯和灯泡，其包括具有多个LED的基座，其中所述基座至少部分地包括导热材料。散热器结构包括在与散热器结构热耦合的基座上。相对于LED布置远程荧光体，使得来自LED的至少一些光穿过远程荧光体并被转换成不同波长的光。一些灯泡或灯泡实施例可以发出来自LED和远程荧光体的光的白光组合。这些可以包括发射蓝光的LED，远程荧光体具有吸收蓝色光并发出黄色或绿色光的材料。可以包括扩散器以将发射光扩散到所需的图案，例如全向的。

5. 发明申请

WO2011109094A1 LED LAMP INCORPORATING REMOTE PHOSPHOR AND DIFFUSER WITH HEAT DISSIPATION FEATURES 审中-公开
标题翻译： LED灯具配备远程磷光体和散热器，具有散热功能
公开(公告)号：WO2011109094A1
公开(公告)日：2011-09-09
申请号：PCT/US2011/000400
申请日：2011-03-02
申请人： CREE, INC. , TONG, Tao , LETOQUIN, Ronan , KELLER, Bernd , TARSA, Eric
发明人： TONG, Tao , LETOQUIN, Ronan , KELLER, Bernd , TARSA, Eric
IPC分类号： F21K99/00
CPC分类号： H01L33/505 , F21K9/232 , F21K9/64 , F21V3/02 , F21V3/12 , F21Y2115/10 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： An LED lamp or bulb (320) is disclosed that comprises a light source (324), a heat sink structure (325) and a remote phosphor carrier (328) having at least one conversion material. The phosphor carrier can be remote to the light sources and mounted to the heat sink so that heat from the phosphor carrier spreads into the heat sink. The phosphor carrier can have a three-dimensional shape, and can comprise a thermally conductive transparent material and a phosphor layer, with an LED based light source mounted to the heat sink such that light from the light source passes through the phosphor carrier. At least some of the LED light is converted by the phosphor carrier, with some lamp embodiments emitting a white light combination of LED and phosphor light. The phosphors in the phosphor carriers can be arranged to operate at a lower temperature to thereby operate at greater phosphor conversion efficiency and with reduced heat related damage to the phosphor. The lamps or bulbs can also comprise a diffuser over the phosphor carrier to distribute light and to conceal the phosphor carrier.
摘要翻译：公开了一种LED灯或灯泡（320），其包括具有至少一种转换材料的光源（324），散热结构（325）和远程荧光体载体（328）。荧光体载体可以远离光源并且安装到散热器，使得来自荧光体载体的热量扩散到散热器中。荧光体载体可以具有三维形状，并且可以包括导热透明材料和荧光体层，其中基于LED的光源安装到散热器，使得来自光源的光通过荧光体载体。至少一些LED光由荧光体载体转换，一些灯实施例发出LED和磷光体的白光组合。荧光体载体中的荧光体可以被布置成在较低的温度下操作，从而以更高的荧光体转换效率和减少与荧光体相关的热损伤来操作。灯泡或灯泡还可以包括荧光体载体上的漫射器以分配光并隐藏磷光体载体。

6. 发明申请

WO2011109092A2 LED LAMP WITH REMOTE PHOSPHOR AND DIFFUSER CONFIGURATION 审中-公开
标题翻译：带有远端磷光体和发光二极管配置的LED灯
公开(公告)号：WO2011109092A2
公开(公告)日：2011-09-09
申请号：PCT/US2011/000398
申请日：2011-03-02
申请人： CREE, INC. , TONG, Tao , LETOQUIN, Ronan , KELLER, Bernd , TARSA, Eric , YOUMANS, Mark , LOWES, Theodore , MEDENDORP, Nicholas, W. , VAN DE VEN, Antony , NEGLEY, Gerald
发明人： TONG, Tao , LETOQUIN, Ronan , KELLER, Bernd , TARSA, Eric , YOUMANS, Mark , LOWES, Theodore , MEDENDORP, Nicholas, W. , VAN DE VEN, Antony , NEGLEY, Gerald
IPC分类号： F21K99/00 , F21V29/00
CPC分类号： F21V3/00 , F21K9/00 , F21K9/232 , F21K9/64 , F21V29/505 , F21V29/677 , F21V29/745 , F21V29/767 , F21V29/773 , F21V29/85 , F21Y2115/10
摘要： An LED lamp or bulb is disclosed that comprises a light source, a heat sink structure and an optical cavity. The optical cavity comprises a phosphor carrier having a conversions material and arranged over an opening to the cavity. The phosphor carrier comprises a thermally conductive transparent material and is thermally coupled to the heat sink structure. An LED based light source is mounted in the optical cavity remote to the phosphor carrier with light from the light source passing through the phosphor carrier. A diffuser dome is included that is mounted over the optical cavity, with light from the optical cavity passing through the diffuser dome. The diffuser dome can disperse the light passing through it into the desired emission pattern, such as omnidirection. In one embodiment, the light source can be blue emitting LED and the phosphor carrier can include a yellow phosphor, with the LED lamp or bulb emitting a white light combination of LED and phosphor light.
摘要翻译：公开了一种LED灯或灯泡，其包括光源，散热结构和光学腔。光学腔包括具有转换材料的荧光体载体并且布置在通向空腔的开口上。荧光体载体包括导热透明材料并且热耦合到散热器结构。基于LED的光源通过来自光源的光穿过荧光体载体而安装在远离荧光体载体的光学腔中。包括安装在光学腔上的扩散器圆顶，来自光学腔的光通过扩散器圆顶。扩散器圆顶可以将通过它的光分散成所需的发射图案，例如全方向。在一个实施例中，光源可以是蓝色LED，并且荧光体载体可以包括黄色磷光体，LED灯或灯泡发出LED和磷光体的白光组合。

7. 发明申请

WO2009142675A2 SOLID STATE LIGHTING COMPONENT 审中-公开
标题翻译：固态照明组件
公开(公告)号：WO2009142675A2
公开(公告)日：2009-11-26
申请号：PCT/US2009/001628
申请日：2009-03-13
申请人： CREE, INC. , YUAN, Thomas , KELLER, Bernd , IBBETSON, James , TARSA, Eric, J. , NEGLEY, Gerald
发明人： YUAN, Thomas , KELLER, Bernd , IBBETSON, James , TARSA, Eric, J. , NEGLEY, Gerald
IPC分类号： H01L33/00 , H01L25/075 , H01L27/15
CPC分类号： H01L33/60 , H01L25/0753 , H01L33/58 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/181 , H05B33/0821 , H05B33/0857 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要： An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.
摘要翻译：一种LED组件，包括安装在基座的平坦表面上的LED芯片的阵列，所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组，其中每个组以串联电路互连。 LED芯片中包含一个透镜。其他实施例可以包括散热结构，其包括与底座一体并且被布置成散发来自LED芯片的热量。

8. 发明申请

WO2008002362A1 EFFICIENT EMITTING LED PACKAGE AND METHOD FOR EFFICIENTLY EMITTING LIGHT 审中-公开
标题翻译：有效发射LED包装和有效发光的方法
公开(公告)号：WO2008002362A1
公开(公告)日：2008-01-03
申请号：PCT/US2007/011759
申请日：2007-05-16
申请人： CREE, INC. , LEUNG, Michael, S. , KELLER, Bernd , IBBETSON, James , TARSA, Eric, J.
发明人： LEUNG, Michael, S. , KELLER, Bernd , IBBETSON, James , TARSA, Eric, J.
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , F21K9/60 , F21K9/64 , F21V7/0008 , F21V7/0033 , F21V7/22 , F21V13/04 , F21V29/773 , F21Y2115/10 , H01L33/60
摘要： An LED package comprises an LED for emitting LED light, and a conversion material remote to said LED for down-converting the wavelength of LED light. The package further comprises a reflector directing at least some of the LED light toward the conversion material; the conversion material down-converting the wavelength of at least some of the reflected LED light. A method for emitting light from an LED package comprising providing an LED, reflector and conversion material, and emitting light from said LED, at least some of the LED light emitted toward the reflector. The method further comprises reflecting at least some of the LED light toward the conversion material, and converting at least some of said reflected LED light at the conversion material. At least some of the converted reflected LED light is emitted by the LED package.
摘要翻译： LED封装包括用于发射LED光的LED和远离所述LED的转换材料，用于对LED光的波长进行下变频。该封装还包括将至少一些LED光引向转换材料的反射器; 所述转换材料将反射的LED光的至少一些的波长下变频。一种用于从LED封装件发射光的方法，包括提供LED，反射器和转换材料，以及从所述LED发射光，朝向反射器发射的至少一些LED光。该方法还包括将至少一些LED光反射到转换材料，以及将所述反射的LED光中的至少一些转换成转换材料。至少一些被转换的反射的LED灯由LED封装发射。

9. 发明申请

WO2011109098A3 SOLID STATE LAMP AND BULB 审中-公开
公开(公告)号：WO2011109098A3
公开(公告)日：2011-09-09
申请号：PCT/US2011/000405
申请日：2011-03-02
申请人： CREE, INC. , LE, Long, Larry , PICKARD, Paul , LAY, James, Michael , TONG, Tao , LETOQUIN, Ronan , KELLER, Bernd , TARSA, Eric , YOUMANS, Mark , LOWES, Theodore , MEDENDORP, Nicholas, W., Jr. , VAN DE VEN, Antony , NEGLEY, Gerald
发明人： LE, Long, Larry , PICKARD, Paul , LAY, James, Michael , TONG, Tao , LETOQUIN, Ronan , KELLER, Bernd , TARSA, Eric , YOUMANS, Mark , LOWES, Theodore , MEDENDORP, Nicholas, W., Jr. , VAN DE VEN, Antony , NEGLEY, Gerald
IPC分类号： F21K99/00 , F21Y101/02
摘要： A lighting device, comprising: a light source (58) on a heat sink (52); a diffuser (76) on said heat sink and spaced apart from said light source; and wavelength conversion material (66) on said heat sink and disposed between the light source and the diffuser and spaced from the light source and the diffuser wherein said lamp is arranged to fit within the A19 envelope while emitting a substantially uniform emission pattern.

10. 发明申请

WO2008115213A2 WAFER LEVEL PHOSPHOR COATING METHOD AND DEVICES FABRICATED ULTILIZING METHOD 审中-公开
标题翻译：晶片级磷光涂层方法和装置制造的超薄化方法
公开(公告)号：WO2008115213A2
公开(公告)日：2008-09-25
申请号：PCT/US2007/024367
申请日：2007-11-20
申请人： CREE, INC. , CHITNIS, Ashay , IBBETSON, James , CHAKRABORTY, Arpan , TARSA, Eric, J. , KELLER, Bernd , SERUTO, James , FU, Yankun
发明人： CHITNIS, Ashay , IBBETSON, James , CHAKRABORTY, Arpan , TARSA, Eric, J. , KELLER, Bernd , SERUTO, James , FU, Yankun
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L23/3114 , H01L33/38 , H01L33/387 , H01L33/44 , H01L33/501 , H01L33/507 , H01L33/508 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.
摘要翻译：制造发光二极管（LED）芯片的方法包括通常在衬底上提供多个LED。基座沉积在LED上，每个基座与其中一个LED电接触。在LED上形成涂层，其中涂层至少埋置一些基座。然后平坦化涂层以暴露至少一些埋置基座，同时在所述LED上留下至少一些所述涂层。然后可以例如通过线键接触暴露的基座。本发明公开了用于制造具有倒装芯片键合在载体衬底上的LED和用于制造其他半导体器件的LED芯片的类似方法。还公开了使用所公开的方法制造的LED芯片晶片和LED芯片。

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