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1. 发明申请

WO2004053899A1 CONDUCTIVE POLYMER DEVICE AND METHOD OF MANUFACTURING SAME 审中-公开
标题翻译：导电聚合物装置及其制造方法
公开(公告)号：WO2004053899A1
公开(公告)日：2004-06-24
申请号：PCT/US2003/007875
申请日：2003-03-14
申请人： BOURNS, INC. , BURKE, Ray , O'BRIEN, Maurice , LAN, Poting , CHU, Stelar
发明人： BURKE, Ray , O'BRIEN, Maurice , LAN, Poting , CHU, Stelar
IPC分类号： H01C1/14
CPC分类号： H01C7/027 , H01C1/1406 , H01C1/148 , H01C7/02 , H01C17/28 , H05K1/0206 , H05K1/056 , H05K3/0052 , H05K3/403 , H05K3/429 , H05K3/44 , H05K3/445 , H05K2201/09181 , H05K2201/09554 , H05K2201/09845
摘要： An electronic device is manufactured using printed circuit board manufacturing processes. In particular, a laminar device comprises a first metal layer (12), a second metal layer (14), at least one layer of device material sandwiched between the first and second metal layers. A first layer of insulating material (40) substantially covers the first metal layer (12). A third metal layer (48) is provided on the first layer of insulating material (40). This third metal layer (48) is divided to provide a first terminal (90) and a second terminal (92). The first terminal (90) is electrically connected to the first metal layer (12) by a conductive interconnect (84) formed through said first layer of insulating material (40), and the second terminal (92) is electrically connected to said second metal layer (14) by a conductive path (68) comprising an insulated conductive channel which passes through and is insulated from said first metal layer (12) and said at least one layer of device material (16). The use of an insulated channel provides a cost effective method of manufacture and maximizes the effective area of device material used. A PTC component is built through this method.
摘要翻译：使用印刷电路板制造工艺制造电子设备。特别地，层状器件包括第一金属层（12），第二金属层（14），夹在第一和第二金属层之间的至少一层器件材料。第一层绝缘材料（40）基本上覆盖第一金属层（12）。第三金属层（48）设置在第一绝缘材料层（40）上。该第三金属层（48）被分割以提供第一端子（90）和第二端子（92）。第一端子（90）通过通过所述第一绝缘材料层（40）形成的导电互连（84）与第一金属层（12）电连接，并且第二端子（92）电连接到所述第二金属层（14）由包括绝缘导电通道的导电路径（68）穿过并与所述第一金属层（12）和所述至少一层装置材料（16）绝缘。使用绝缘通道提供了一种成本有效的制造方法，并使所使用的器件材料的有效面积最大化。通过此方法构建PTC组件。

2. 发明申请

WO2004053898A3 ENCAPSULATED ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
公开(公告)号：WO2004053898A3
公开(公告)日：2004-06-24
申请号：PCT/US2003/002339
申请日：2003-01-24
申请人： BOURNS, INC. , BURKE, Ray , O'BRIEN, Maurice , AHEARNE, Brian , KELLY, John , BOURNS, Gordon, L.
发明人： BURKE, Ray , O'BRIEN, Maurice , AHEARNE, Brian , KELLY, John , BOURNS, Gordon, L.
IPC分类号： H01C1/14
摘要： The present invention relates to encapsulated or insulated devices. In certain environments and applications, it is necessary to protect devices from external agents. The present invention achieves this by providing a device comprising a segment of insulating material having an aperture defined therein. An element of active, for example positive temperature coefficient (PTC), material is received within the defined aperture. The element is substantially covered by a first metal layer on one side and a second metal layer on the opposing side. A first layer of insulating material substantially covers the first metal layer and a second layer of insulating material substantially covers the second layer of metal. A first terminal provides an external electrical connection to the first metal layer and a second terminal provides an external electrical connection to the second metal layer. The first terminal is connected to the first metal layer by a conductive interconnect which passes through the first insulating layer and the second terminal is connected to the second metal layer by a conductive interconnect passes through the second insulating layer. Moreover, the invention provides a method for manufacturing devices in a matrix form using conventional PCB techniques to facilitate the mass production of encapsulated devices. Additionally, the resulting components may be used as either leaded or SMT components in either single device or multiple device configurations in both SIP and DIP packages.

3. 发明申请

WO2004084270A3 MULTI-LAYER POLYMERIC ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SAME 审中-公开
公开(公告)号：WO2004084270A3
公开(公告)日：2004-09-30
申请号：PCT/US2004/007764
申请日：2004-03-15
申请人： BOURNS, INC. , BOURNS, Gordon , STRAKER, Gary , BURKE, Ray , NGUYEN, Thanh
发明人： BOURNS, Gordon , STRAKER, Gary , BURKE, Ray , NGUYEN, Thanh
IPC分类号： H01C7/02
摘要： An electronic device is formed of multiple, alternating layers of conductive polymer and metal foil electrodes, in which electrical connections between selected electrodes are provided by cross-conductors formed by plated through-hole vias. More specifically, the device includes a first cross-conductor that electrically connects a first set of electrodes, and a second cross-conductor electrically connects a second set of electrodes. Correspondingly, the first cross-conductor is electrically and physically isolated from the second set of electrodes, while the second cross-conductor is electrically and physically isolated from the first set of electrodes. The electrodes are etched to form an isolation gap that isolates that electrode from either the first or second cross-conductor. The first and second cross-conductors, in turn, are formed by plating the through-hole vias, so as to establish electrically-conductive contact with those electrodes not separated from the via by an isolation gap. Thus, a device may be formed with N non-metallic (e.g. polymeric) layers and N+1 electrodes, where N is an integer greater than 1, wherein a first cross-conductor electrically contacts a first set of electrodes, and a second cross-conductor electrically contacts a second set of electrodes, whereby the non-metallic layers are connected in parallel.

4. 发明申请

WO2006076968A1 A SENSOR 审中-公开
标题翻译：传感器
公开(公告)号：WO2006076968A1
公开(公告)日：2006-07-27
申请号：PCT/EP2005/052300
申请日：2005-05-18
申请人： BOURNS INC. , BURKE, Ray
发明人： BURKE, Ray
IPC分类号： G01D5/14 , G01F23/38
CPC分类号： G01F23/38 , G01D5/145
摘要： The present application provides a position sensor comprising a position sensor comprising a Halbach magnet arrangement providing a magnetic field. A Hall sensor is positioned within the magnetic field provided by the Halbach magnet. The Halbach magnet and sensor are rotatable relative to one another and the Hall sensor provides a measurement of the relative angle between the Hall sensor and the Halbach magnet.
摘要翻译：本申请提供了一种位置传感器，其包括位置传感器，该位置传感器包括提供磁场的Halbach磁体装置。霍尔传感器位于由Halbach磁铁提供的磁场内。 Halbach磁体和传感器可相对旋转，霍尔传感器可以测量霍尔传感器和Halbach磁体之间的相对角度。

5. 发明申请

WO2004086202A1 A SECURITY HOUSING FOR A CIRCUIT 审中-公开
标题翻译：一个电路的安全外壳
公开(公告)号：WO2004086202A1
公开(公告)日：2004-10-07
申请号：PCT/IE2004/000043
申请日：2004-03-25
申请人： BOURNS, INC. , BURKE, Ray , QUEEN, Carl
发明人： BURKE, Ray , QUEEN, Carl
IPC分类号： G06F1/00
CPC分类号： H01L23/57 , G06F21/87 , G08B13/128 , H01L2924/0002 , H05K1/0275 , H05K1/0284 , H05K1/144 , H05K3/027 , H05K3/105 , H05K3/185 , H05K2201/0999 , H05K2201/10151 , H05K2203/107 , H01L2924/00
摘要： The present invention relates to the field of enclosures for electronic circuits and in particular to applications, for example payment card systems, where it is necessary to provide some physical security to prevent unauthorised access to a circuit and more particularly to the data contained within memory devices in the circuit. The present invention provides an improved housing overcoming problems associated with prior art housing and in particular provides a housing that allows for replacement and/or repair of an underlying circuit at a relatively low cost. This is achieved by provision of a single piece construction security housing having conductive patterns integrally provided thereon. In particular, a first embodiment of the invention provides a security housing for mounting in use on a circuit board to protect an associated circuit, comprising: a plurality of electrical contacts for making electrical contact with the circuit board, a cover, a plurality of side walls, where the plurality of side walls and cover define a space for accommodating the associated circuit, and at least one pattern of conductive tracks electrically connected to the electrical contacts and integrally formed with the plurality of side walls and the cover in a single piece construction.
摘要翻译：本发明涉及用于电子电路的外壳领域，并且具体涉及例如支付卡系统的应用，其中必须提供一些物理安全性以防止未经授权访问电路等等特别是涉及电路中存储器件内的数据。本发明提供了一种改进的壳体，其克服了与现有技术壳体相关的问题，并且特别地提供了允许以相对低的成本更换和/或修理底层电路的壳体。这是通过提供具有整体设置在其上的导电图案的单件结构安全壳体来实现的。特别地，本发明的第一实施例提供了一种用于在电路板上使用时安装以保护相关电路的安全壳体，包括：多个用于与电路板电接触的电触点，盖，多个侧面所述多个侧壁和盖限定了用于容纳相关联的电路的空间，并且至少一个导电轨道的图案电连接到所述电触点并且与所述多个侧壁和所述盖一体地形成为单件结构

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