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    • 2. 发明申请
    • THERMOPILE INFRARED SENSOR ARRAY
    • 热电红外阵列
    • WO2006122529A3
    • 2007-01-25
    • PCT/DE2006000841
    • 2006-05-16
    • HEIMANN SENSOR GMBHLENEKE WILHELMSIMON MARIONSCHULZE MISCHASTORCK KARLHEINZSCHIEFERDECKER JOERG
    • LENEKE WILHELMSIMON MARIONSCHULZE MISCHASTORCK KARLHEINZSCHIEFERDECKER JOERG
    • H04N5/33G01J5/06G01J5/22H04N3/15
    • G01J5/06G01J5/12H01L2224/48091H01L2224/48472H01L2924/1461H01L2924/3025H04N5/2253H04N5/33H01L2924/00014H01L2924/00
    • The invention relates to a thermopile infrared sensor array, comprising a sensor chip with a number of thermopile sensor elements, made from a semiconductor substrate and corresponding electronic components, whereby the sensor chip is mounted on a support circuit board and enclosed by a cap in which a lens is arranged. The aim of the invention is the production of a monolithic infrared sensor array with a high thermal resolution capacity with a small chip size and which may be economically produced. Said aim is achieved, whereby a thin membrane (12) made from non-conducting material is arranged on the semiconductor substrate of the sensor chip (1) on which thermopile sensor elements (13) are located in an array, whereby, under each thermopile sensor element (13), the back side of the membrane (12) is uncovered in a honeycomb pattern by etching and the electronic components are arranged in the boundary region of the sensor chip. An individual pre-amplifier (VV) with a subsequent low-pass (TP) filter (6) is provided for each column and each row of sensor elements (13, 14).
    • 本发明涉及热电堆型红外线传感器阵列,其包括具有多个安装在半导体基板和相关的电子组件上的热电堆传感器元件的传感器芯片,所述传感器芯片安装在载体基板与其中光学系统位于帽包围。 本发明提供的单片红外线传感器阵列将被指定,其具有小的芯片尺寸高热分辨能力和制造成本低。 在所取得的传感器芯片的半导体基板(1)是一个薄的膜(12)由非导电性材料的热电堆传感器元件(13),其上是在阵列中的,其中所述膜的背面(12 )是每个热电堆传感器元件(13下类似蚀刻蜂窝),并且在所述传感器芯片的边缘区域中的电子元件中,所述(13针对各列和传感器元件14)的每个中的每一行与一个下游低通TP单个前置放大器VV(6)设置 ,