专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2017186856A1 HEAT CAPACITIVE COMPONENT CARRIER AND METHOD TO PRODUCE SAID COMPONENT CARRIER 审中-公开
标题翻译：热容电子元件载体及制造所述元件载体的方法
公开(公告)号：WO2017186856A1
公开(公告)日：2017-11-02
申请号：PCT/EP2017/060071
申请日：2017-04-27
申请人： AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
发明人： SILVANO DE SOUSA, Jonathan
IPC分类号： H05K1/02 , F28D20/02 , H01L23/373
CPC分类号： H05K1/0206 , F28D15/0233 , F28D20/023 , H01L21/4846 , H01L23/3677 , H01L23/3736 , H01L23/38 , H01L23/427 , H05K1/0203 , H05K3/22 , H05K3/4038 , H05K2201/064 , H05K2201/10219 , Y02E60/145
摘要： The invention refers to a component carrier (10) realized as a printed circuit board, an intermediate printed circuit board product or an IC-substrate, comprising at least one heat- passage component (30), said at least one heat-passage component (30) being realized in form of a heat-generating or a heat-absorbing component that is mounted on an outside surface layer (21, 22) or is embedded within at least one inner layer (23, 24) of the component carrier (10), and further comprising at least one latent-heat storage unit (40) with a phase-change material (45). The phase-change material (45) is laminated and integrated within at least one cavity (25) of the component carrier (10) and is directly thermoconductively coupled with the at least one heat-passage component (30). The invention also refers to a method for producing said component carrier (10).
摘要翻译：本发明涉及实现为印刷电路板，中间印刷电路板产品或IC衬底的元件载体（10），其包括至少一个热通道部件（30），所述至少一个热通道部件（30）以安装在外表面层（21,22）上或嵌入在至少一个内层（23,24）内的发热或吸热部件的形式实现， 24），并且还包括具有相变材料（45）的至少一个潜热存储单元（40）。相变材料（45）被层压并集成在部件载体（10）的至少一个空腔（25）内并直接与至少一个热通道部件（30）导热耦合。本发明还涉及用于制造所述部件载体（10）的方法。

2. 发明申请

WO2018060247A1 FLAME RETARDANT STRUCTURE FOR COMPONENT CARRIER 审中-公开
标题翻译：用于组分载体的阻燃剂结构
公开(公告)号：WO2018060247A1
公开(公告)日：2018-04-05
申请号：PCT/EP2017/074499
申请日：2017-09-27
申请人： AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
发明人： SILVANO DE SOUSA, Jonathan , LEITGEB, Markus
IPC分类号： H05K3/46 , H05K1/02 , H05K1/18
摘要： A component carrier (100) for carrying at least one component (1400) and comprising a plurality of electrically conductive layer structures (102, 104), and a plurality of electrically insulating layer structures (106, 108), wherein the plurality of electrically conductive layer structures (102, 104) and the plurality of electrically insulating layer structures (106, 108) form a laminated stack, and wherein at least one of the electrically insulating layer structures (106, 108) is configured as a flame retardant structure (108) preventing propagation of fire along the component carrier (100).
摘要翻译：一种用于承载至少一个部件（1400）并包括多个导电层结构（102,104）的部件载体（100），以及多个电绝缘层结构（106,108）），其中所述多个导电层结构（102,104）和所述多个电绝缘层结构（106,108）形成层压堆叠，并且其中所述电绝缘层结构（106,108）中的至少一个是配置为阻止火沿着部件载体（100）传播的阻燃结构（108）。

3. 发明申请

WO2018002230A1 COOLING COMPONENT CARRIER MATERIAL BY CARBON STRUCTURE WITHIN DIELECTRIC SHELL 审中-公开
标题翻译：碳纳米管结构在电介质壳中冷却组分载体材料
公开(公告)号：WO2018002230A1
公开(公告)日：2018-01-04
申请号：PCT/EP2017/066145
申请日：2017-06-29
申请人： AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
发明人： SILVANO DE SOUSA, Jonathan , LEITGEB, Markus , PESSL, Walter
IPC分类号： H05K3/46 , H05K1/02 , H05K1/18
摘要： A component carrier (100) comprising component carrier material (130), and a heat spreading module (102) which comprises a carbon structure, in particular graphite structure (104), enclosed within a dielectric shell (106) for disabling contact between the carbon structure and the component carrier material (130).
摘要翻译：包括部件载体材料（130）的分量载体（100）和包括碳结构，特别是石墨结构（104）的散热模块（102），所述碳结构被封闭在电介质壳体 106），用于禁用碳结构和组分载体材料（130）之间的接触。

4. 发明申请

WO2018060233A1 COMPONENT CARRIER WITH FULLY ENCAPSULATED THERMOELECTRIC DEVICE 审中-公开
标题翻译：具有完全封装的热电器件的组件载体
公开(公告)号：WO2018060233A1
公开(公告)日：2018-04-05
申请号：PCT/EP2017/074472
申请日：2017-09-27
申请人： AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
发明人： SILVANO DE SOUSA, Jonathan
IPC分类号： H01L35/32 , H05K1/02
摘要： A component carrier ( 100) which comprises a heat absorbing and thermally conductive surface layer (102) configured for being heated by an external heat source (104), and a thermoelectric device (106) fully surrounded by material of the component carrier (100), thermally coupled with the surface layer (102) and configured for transferring thermal energy of the heated surface layer (102) into electric energy.
摘要翻译：（100），其包括被配置为由外部热源（104）加热的吸热和导热表面层（102），以及被所述外部热源（104）完全围绕的热电装置（106）所述元件载体（100）的材料与所述表面层（102）热耦合并且被配置用于将所述加热的表面层（102）的热能传递到电能中。

5. 发明申请

WO2016071324A1 HERMETICALLY SEALED HEAT PIPE STRUCTURE SYNTHESIZED WITH SUPPORT STRUCTURE AND METHOD FOR PRODUCING IT 审中-公开
标题翻译：合成密封热管结构与支撑结构及其生产方法
公开(公告)号：WO2016071324A1
公开(公告)日：2016-05-12
申请号：PCT/EP2015/075568
申请日：2015-11-03
申请人： AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
发明人： TAMM, Wilhelm , SILVANO DE SOUSA, Jonathan , RENAUD-BEZOT, Nick , MOITZI, Heinz , LEITGEB, Markus
IPC分类号： H05K1/02 , H01L23/427 , H01L23/46 , H01L33/64 , H05K7/20 , F28D15/02
CPC分类号： H05K1/0272 , F28D15/0233 , F28D15/0241 , F28D15/0275 , F28D15/046 , F28D2015/0225 , F28F21/062 , F28F2265/24 , H01L23/427 , H01L23/49822 , H01L33/648 , H01L2924/0002 , H05K1/0203 , H05K1/0204 , H05K2201/037 , H01L2924/00
摘要： An electronic device (200) which comprises a support structure (100) comprising electrically insulating material and/or electrically conductive material, and a heat pipe structure (202) synthesized during or after formation of the support structure (100), being integrated in and/or on the support structure (100) and comprising a thermally conductive shell (204) which fully surrounds and thereby hermetically seals a heat transporting medium, in particular a fluid (206), in an interior of the shell (204) with regard to a surrounding.
摘要翻译：一种电子设备（200），包括包括电绝缘材料和/或导电材料的支撑结构（100），以及在形成支撑结构（100）期间或之后合成的热管结构（202）相对于壳体（204）的内部，/或在支撑结构（100）上，并且包括导热壳体（204），该导热壳体完全围绕壳体（204）的内部而密封热传输介质，特别是流体（206）周围。

6. 发明申请

WO2018060231A1 HIGHLY THERMALLY CONDUCTIVE DIELECTRIC STRUCTURE FOR HEAT SPREADING IN COMPONENT CARRIER 审中-公开
标题翻译：用于组件载体中热扩散的高导热介电结构
公开(公告)号：WO2018060231A1
公开(公告)日：2018-04-05
申请号：PCT/EP2017/074468
申请日：2017-09-27
申请人： AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
发明人： SILVANO DE SOUSA, Jonathan , VORABERGER, Hannes , LEITGEB, Markus
IPC分类号： H05K1/02 , H05K1/03 , H01L23/373 , H05K3/02 , H05K3/46
摘要： A manufacturing method of manufacturing a constituent (350) for a component carrier (300), wherein the method comprises providing an electrically conductive structure (100), forming a highly thermally conductive and electrically insulating or semiconductive structure (102) on the electrically conductive structure (100), and subsequently attaching a thermally conductive and electrically insulating structure (200), having a lower thermal conductivity than the highly thermally conductive and electrically insulating or semiconductive structure (102), on an exposed surface of the highly thermally conductive and electrically insulating or semiconductive structure (102).
摘要翻译：
为一个分量载波（300），其中所述方法包括提供导电结构（100），形成高导热性和电绝缘的或半导电的结构制造成分（350）的制造方法在导电结构（100），并随后附接的导热且电绝缘的结构（200），具有比所述高导热性更低的热导率和电绝缘的或半导电结构（102），（102），在暴露的表面高度导热和电绝缘或半导体结构（102）。

7. 发明申请

WO2017055599A1 ELECTRONIC COMPONENT CARRIER FOR CARRYING AND COOLING A HEAT GENERATING ELECTRONIC COMPONENT 审中-公开
标题翻译：用于携带和冷却热电子元件的电子元件载体
公开(公告)号：WO2017055599A1
公开(公告)日：2017-04-06
申请号：PCT/EP2016/073500
申请日：2016-09-30
申请人： AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
发明人： SILVANO DE SOUSA, Jonathan
IPC分类号： H05K1/02
CPC分类号： H05K1/0206 , H05K1/0207 , H05K2201/026 , H05K2201/0323 , H05K2201/10416
摘要： A component carrier for carrying and cooling at least one heat generating electronic component (150; 251, 252, 351, 352, 353, 354, 451, 452), the component carrier comprising an outer layer structure (110, 115, 210, 215, 310, 315, 410, 415), an electrically insulating layer (120, 125, 220, 225, 320, 325, 420, 425) arranged adjacent to the outer layer structure, and a heat conducting structure (130, 230, 331, 332, 430) arranged adjacent to the electrically insulating layer on a side opposite to the outer layer structure, the heat conducting structure being adapted to be thermally coupled to the at least one heat generating electronic component, wherein the outer layer structure is adapted to receive thermal radiation irradiated by the heat conducting structure and to transport corresponding heat away from the component carrier via convection by a heat transfer medium surrounding the component carrier.
摘要翻译：用于承载和冷却至少一个发热电子部件（150; 251,252,351,352,353,354,451,452）的部件载体，所述部件载体包括外层结构（110,115,210,215 ，310,315,410,415），与所述外层结构相邻布置的电绝缘层（120,125,220,225,320,325,420,425）和导热结构（130,230,331 ，332,430），其布置在与所述外层结构相对的一侧上邻近所述电绝缘层，所述导热结构适于热耦合到所述至少一个发热电子部件，其中所述外层结构适于接收由导热结构辐射的热辐射，并通过围绕组件载体的传热介质经由对流将相应的热量从组分载体输送。

8. 发明申请

WO2016071327A1 CIRCUIT BOARD WITH INTEGRATED PREFABRICATED HEAT PIPE AND REINFORCED HEAT PIPE 审中-公开
标题翻译：带集成预热管和加热管的电路板
公开(公告)号：WO2016071327A1
公开(公告)日：2016-05-12
申请号：PCT/EP2015/075574
申请日：2015-11-03
申请人： AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
发明人： SILVANO DE SOUSA, Jonathan , LEITGEB, Markus
IPC分类号： H05K1/02 , H05K7/20 , F28D15/02
CPC分类号： H05K1/0272 , F28D15/02 , F28F2265/12 , H01L23/427 , H05K1/0206 , H05K3/022 , H05K2201/064 , H05K2203/063
摘要： A circuit board (200), wherein the circuit board (200) comprises a plurality of connected layer structures (100, 102) of electrically insulating material and electrically conductive material, and a hermetically sealed prefabricated heat pipe (104) in contact with at least one of the layer structures (100, 102).
摘要翻译：一种电路板（200），其中所述电路板（200）包括电绝缘材料和导电材料的多个连接层结构（100,102），以及与至少接触的密封预制热管（104）层结构（100,102）中的一个。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式