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    • 3. 发明申请
    • WAFER INSPECTION SYSTEM
    • 波浪检测系统
    • WO2006002150A1
    • 2006-01-05
    • PCT/US2005/021900
    • 2005-06-20
    • APPLIED MATERIALS ISRAEL, LTD.REINHORN, SilviuSOME, DanielALMOGY, Gilad
    • REINHORN, SilviuSOME, DanielALMOGY, Gilad
    • G01N21/17
    • G01N21/9501G01N21/1717
    • Apparatus for inspecting a surface, including a plurality of pump sources having respective pump optical output ends and providing respective pump beams through the pump optical output ends, and a plurality of probe sources having respective probe optical output ends and providing respective probe beams through the probe optical output ends. There is an alignment mounting which holds the respective pump optical output ends and probe optical output ends in equal respective effective spatial offsets, and optics which convey the respective pump beams and probe beams to the surface, so as to generate returning radiation from a plurality of respective locations thereon, and which convey the returning radiation from the respective locations. The apparatus includes a receiving unit which is adapted to receive the returning radiation and which is adapted to determine a characteristic of the respective locations in response thereto.
    • 用于检查表面的装置,包括具有相应的泵浦光学输出端的多个泵浦源,并且通过泵浦光学输出端提供相应的泵浦光束,以及具有相应的探测光学输出端的多个探测源,并且通过探针提供相应的探测光束 光输出端。 存在对准安装,其将相应的泵浦光学输出端和探测光学输出端保持在相等的有效空间偏移中;以及光学器件,其将相应的泵浦光束和探测光束传送到表面,以便产生来自多个 各自的位置,并且从各个位置传送返回的辐射。 该装置包括接收单元,该接收单元适于接收返回的辐射并且适于响应于此确定相应位置的特性。
    • 7. 发明申请
    • SYSTEM AND METHOD FOR PROCESS VARIATION MONITOR
    • 过程变异监测系统和方法
    • WO2003100404A1
    • 2003-12-04
    • PCT/US2003/016569
    • 2003-05-22
    • APPLIED MATERIALS, INC.APPLIED MATERIALS ISRAEL, LTD.
    • LEVIN, EvgeniALMOGY, GiladROZENMAN, Efrat
    • G01N21/95
    • G06T7/001G01N21/9501G01N21/956G01N21/95607G01N2021/8896G06T2207/30148Y10S430/146
    • A method to extend the process monitoring capabilities of a semiconductor wafer optical inspection system so as to be able to detect low-resolution effects of process variations over the surface of a wafer at much higher sensitivity than heretofore possible. The method consists, in essence, of grouping sensed pixels by geometric blocks over the inspected surface and comparing each block with a corresponding one from another die on the same wager, from another wager of from a stored model image. In one embodiment of the invention, pixel values are compared directly and differences are thresholded at a considerably lower level than during a defects detection process. In another embodiment, there is calculated a signature for each block, based on the sensed light intensity values, and corresponding signatures are compared.
    • 扩展半导体晶片光学检查系统的过程监控能力的方法,以便能够以比以前更高的灵敏度检测晶片表面上的工艺变化的低分辨率效应。 本方法基本上包括通过检查表面上的几何块对感测像素进行分组,并且从相同下注的另一个模具中将每个块与来自另一个管芯的对应的块相比较,从另一个来自存储的模型图像的冲量。 在本发明的一个实施例中,像素值被直接比较,并且差异以比在缺陷检测处理期间低得多的阈值阈值化。 在另一个实施例中,基于感测的光强度值计算每个块的签名,并对相应的签名进行比较。
    • 9. 发明申请
    • APPARATUS AND METHOD FOR NON-DESTRUCTIVE INSPECTION ON A PATTERNED SURFACE
    • 用于在图案表面上进行非破坏性检查的装置和方法
    • WO2004011917A1
    • 2004-02-05
    • PCT/US2003/022786
    • 2003-07-21
    • APPLIED MATERIALS, INC.APPLIED MATERIALS ISRAEL, LTD.
    • ALMOGY, GiladNAFTALI, RonGUETTA, AvishaySHOHAM, Doron
    • G01N21/95
    • G01N21/956G01N21/9501
    • An optical system for detecting defects on a wafer (135) that includes a device for producing a beam and directing the beam onto the wafer surface, producing an illuminated spot on the wafer's surface. The system further includes a detector (121) detecting light, and a mirrored assembly (127) having together with the detector an axis of symmetry about a linen perpendicular to the wafer surface. The assembly is configured to receive scattered light from the surface, where the scattered light including a first scattered light part being scattered from the pattern. The assembly is further configured to reflect and focus rotationally symmetrically about the axis of symmetry the scattered light to the detector. The system further includes a device operating with the detector for facilitating detection of a scattered light other than the specified scattered light due to pattern.
    • 一种用于检测晶片(135)上的缺陷的光学系统,其包括用于产生光束并将光束引导到晶片表面上的装置,在晶片的表面上产生照明光斑。 该系统还包括检测光的检测器(121)以及与检测器一起围绕垂直于晶片表面的亚麻的对称轴的镜像组件(127)。 组件被配置为从表面接收散射光,其中包括从图案散射的第一散射光部分的散射光。 该组件进一步构造成将散射光的对称轴向旋转对称地反射和聚焦到检测器。 该系统还包括用于检测器的装置,用于便于检测由于图案而导致的特定散射光之外的散射光。