专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO0219418A3 METHOD FOR ACHIEVING COPPER FILL OF HIGH ASPECT RATIO INTERCONNECT FEATURES 审中-公开
标题翻译：实现高比例互连特征铜箔的方法
公开(公告)号：WO0219418A3
公开(公告)日：2003-05-08
申请号：PCT/US0126597
申请日：2001-08-27
申请人： APPLIED MATERIALS INC
发明人： CARL DANIEL A , CHIN BARRY , CHEN LIANG , CHEUNG ROBIN , DING PEIJUN , DORDI YEZDI N , HASHIM IMRAN , HEY PETER W , SINHA ASHOK K
IPC分类号： H01L21/288 , H01L21/768
CPC分类号： H01L21/2885 , H01L21/76877
摘要： One aspect of the invention provides a consistent metal electroplating technique to form void-less metal interconnects in sub-micron high aspect ratio features on semiconductor substrates. One embodiment of the invention provides a method for filling sub-micron features (214) on a substrate, comprising reactive precleaning the substrate, depositing a barrier layer (218) on the substrate using high density plasma physical vapor deposition; depositing a seed layer (220) over the barrier layer using high density plasma physical vapor deposition; and electro-chemically depositing a metal (222) using a highly resistive electrolyte and applying a first current density during a first deposition period followed by a second current density during a second period.
摘要翻译：本发明的一个方面提供一致的金属电镀技术，以在半导体衬底上形成亚微米高纵横比特征的无空隙金属互连。本发明的一个实施例提供了一种用于在基底上填充亚微米特征（214）的方法，其包括反应性预清洗所述基底，使用高密度等离子体物理气相沉积在所述基底上沉积阻挡层（218）使用高密度等离子体物理气相沉积在阻挡层上沉积种子层（220）; 以及使用高电阻电解质电化学沉积金属（222），并且在第一周期期间在第一沉积周期期间施加第一电流密度，然后施加第二电流密度。

2. 发明申请

WO0250336A3 INTEGRATED MUTLI-STEP GAP FILL AND ALL FEATURE PLANARIZATION FOR CONDUCTIVE MATERIALS 审中-公开
标题翻译：集成的MUTLI-STEP GAP填充和所有导电材料的特征平面化
公开(公告)号：WO0250336A3
公开(公告)日：2005-01-06
申请号：PCT/US0146449
申请日：2001-12-03
申请人： APPLIED MATERIALS INC
发明人： HSU WEI-YUNG , CHEN LIANG-YUH , MORAD RATSON , CARL DANIEL A , SOMEKH SASSON
IPC分类号： B24B37/00 , B24B37/04 , C25D5/00 , C25D5/22 , C25D7/12 , H01L21/288 , H01L21/304 , H01L21/321 , H01L21/768 , C23C18/16 , C25D5/02
CPC分类号： C25D7/123 , C25D5/06 , C25D5/22 , C25D17/001 , C25D17/008 , H01L21/288 , H01L21/2885 , H01L21/3212 , H01L21/7684 , H01L21/76877
摘要： A method and apparatus is provided for depositing and planarizing a material layer on a substrate. In one embodiment, an apparatus is provided which includes a partial enclosure, a permeable disc, a diffuser plate and optionally an anode. A substrate carrier is positionable above the partial enclosure and is adapted to move a substrate into and out of contact or close proximity with the permeable disc. The partial enclosure and the substrate carrier are rotatable to provide relative motion between a substrate and the permeable disc. In another aspect, a method is provided in which a substrate is positioned in a partial enclosure having an electrolyte therein at a first distance from a permeable disc. A current is optionally applied to the surface of the substrate and a first thickness is deposited on the substrate. Next, the substrate is positioned closer to the permeable disc and a second thickness is deposited on the substrate. During the deposition, the partial enclosure and the substrate are rotated relative one another.
摘要翻译：提供了一种用于沉积和平坦化衬底上的材料层的方法和装置。在一个实施例中，提供了一种装置，其包括部分外壳，可渗透盘，漫射板和任选的阳极。衬底载体可定位在部分外壳上方，并且适于将衬底移动到与可渗透盘接触或接近的位置。部分外壳和基板载体可旋转以提供基板和可渗透盘之间的相对运动。在另一方面，提供了一种方法，其中将基板定位在其中具有电解质的部分封闭体中，其中离开可渗透盘离第一距离。任选地将电流施加到衬底的表面，并且在衬底上沉积第一厚度。接下来，将基板定位成更靠近可渗透盘，并且在基板上沉积第二厚度。在沉积期间，部分封闭物和基底相对彼此旋转。

3. 发明申请

WO02075804A3 PLANARIZATION OF SUBSTRATES USING ELECTROCHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：使用电化学机械抛光的基板平面化
公开(公告)号：WO02075804A3
公开(公告)日：2003-06-26
申请号：PCT/US0204806
申请日：2002-02-19
申请人： APPLIED MATERIALS INC
发明人： CHEN LIANG-YUH , HSU WEI-YUNG , DUBOUST ALAIN , MORAD RATSON , CARL DANIEL A , SOMEKH SASSON , MAYDAN DAN
IPC分类号： B24B37/00 , B23H5/08 , B24B37/04 , H01L21/304 , H01L21/316 , H01L21/321
CPC分类号： B23H5/08
摘要： A method and apparatus are provided for planarizing a material layer on a substrate. In one aspect, a method is provided for processing a substrate including forming a passivation layer on a substrate surface, polishing the substrate in an electrolyte solution, applying an anodic bias to the substrate surface, and removing material from at least a portion of the substrate surface. In another aspect, an apparatus is provided which includes a partial enclosure, polishing article, a cathode, a power source, a substrate carrier movably disposed above the polishing article, and a computer based controller to position a substrate in an electrolyte solution to form a passivation layer on a substrate surface, to polish the substrate in the electrolyte solution with the polishing article, and to apply an anodic bias to the substrate surface or polishing article to remove material from at least a portion of the substrate surface.
摘要翻译：提供了一种用于平坦化衬底上的材料层的方法和装置。在一个方面，提供一种用于处理衬底的方法，包括在衬底表面上形成钝化层，在电解质溶液中抛光衬底，向衬底表面施加阳极偏压，以及从衬底的至少一部分去除材料表面。在另一方面，提供了一种装置，其包括部分外壳，抛光制品，阴极，电源，可移动地设置在抛光制品上方的基板载体，以及基于计算机的控制器，以将基板定位在电解质溶液中以形成在衬底表面上的钝化层，用抛光制品抛光电解质溶液中的衬底，并将阳极偏压施加到衬底表面或抛光制品上以从衬底表面的至少一部分去除材料。

4. 发明申请

WO0196632A3 A METHOD AND APPARATUS FOR CONDITIONING ELECTROCHEMICAL BATHS IN PLATING TECHNOLOGY 审中-公开
标题翻译：一种电镀技术电化学处理方法与装置
公开(公告)号：WO0196632A3
公开(公告)日：2005-05-12
申请号：PCT/US0118211
申请日：2001-06-06
申请人： APPLIED MATERIALS INC
发明人： CHEUNG ROBIN , CARL DANIEL A , CHEN LIANG-YUH , DORDI YEZDI , SMITH PAUL F , MORAD RATSON , HEY PETER , SINHA ASHOK
IPC分类号： C23C18/16 , C25D7/12 , C25D21/12 , C25D21/18
CPC分类号： C25D21/18 , C23C18/1617 , C23C18/1683 , C25D21/12
摘要： An apparatus and method is provided for analyzing or conditioning an electrochemical bath. One aspect of the invention provides a method for analyzing an electrochemical bath in an electrochemical deposition process including providing a first electrochemical bath having a first bath composition, utilizing the first electrochemical bath in an electrochemical deposition process to form a second electrochemical bath having a second bath composition and analyzing the first and second compositions to identify one or more constituents generated in the electrochemical deposition process. Additive material having a composition that is substantially the same as all or at least some of the one or more constituents generated in the electrochemical deposition process may be added to another electrochemical bath to produce a desired chemical composition. The constituents may be added at the beginning of the use of the bath to initially condition the electrochemical bath or may be added, preferably either continuously or periodically, during the electrochemical deposition process.
摘要翻译：提供了用于分析或调理电化学浴的装置和方法。本发明的一个方面提供了一种用于在电化学沉积方法中分析电化学浴的方法，包括提供具有第一浴组成的第一电化学浴，利用电化学沉积工艺中的第一电化学浴形成具有第二浴的第二电化学浴组合和分析第一和第二组合物以鉴定在电化学沉积过程中产生的一种或多种成分。具有与在电化学沉积工艺中产生的一种或多种成分中的全部或至少一些基本上相同的组成的添加剂材料可以加入到另一电化学浴中以产生所需的化学组成。可以在使用浴的开始时添加组分以最初调节电化学浴，或者可以在电化学沉积过程期间连续地或周期性地添加。

5. 发明申请

WO02085570A3 CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：电化学机械抛光导电抛光法
公开(公告)号：WO02085570A3
公开(公告)日：2003-04-24
申请号：PCT/US0211009
申请日：2002-04-10
申请人： APPLIED MATERIALS INC
发明人： CHEN LIANG-YUH , WANG YUCHUN , WANG YAN , DUBOUST ALAIN , CARL DANIEL A , WADENSWEILER RALPH , BIRANG MANOOCHER , BUTTERFIELD PAUL D , MAVLIEV RASHID , TSAI STAN D
IPC分类号： B23H5/08 , C25F7/00 , H01L21/304 , B24B37/04 , B24D13/14
CPC分类号： B23H5/08
摘要： An article (205) of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article (205) of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface (510) adapted to polish the substrate and a mounting surface (530). A plurality of perforations (505) may be formed in the polishing article (205) for flow of material therethrough. In another aspect, a polishing article (205) for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.
摘要翻译：提供制造和装置的物品（205），用于平坦化基底表面。在一个方面，提供了一种用于抛光衬底的制品（205），该衬底包括具有至少部分导电表面（510）的主体的抛光制品，该表面适于抛光衬底和安装表面（530）。可以在抛光制品（205）中形成多个穿孔（505），用于材料流过其中。另一方面，用于抛光衬底的抛光制品（205）包括具有抛光表面和设置在其中的导电元件的主体。导电元件可以具有延伸超过由抛光表面限定的平面的接触表面。抛光表面可以具有形成在其中的一个或多个凹穴。导电元件可以设置在每个抛光槽中。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式