专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2015123000A9 ADJUSTING EDDY CURRENT MEASUREMENTS 审中-公开
标题翻译：调整EDDY当前测量
公开(公告)号：WO2015123000A9
公开(公告)日：2016-09-29
申请号：PCT/US2015012281
申请日：2015-01-21
申请人： APPLIED MATERIALS INC
发明人： XU KUN , CARLSSON INGEMAR , SWEDEK BOGUSLAW A , BENNETT DOYLE E , SHEN SHIH-HAUR , IRAVANI HASSAN G , TU WEN-CHIANG , LIU TZU-YU
IPC分类号： H01L21/304 , H01L21/66
CPC分类号： B24B49/105 , B24B37/013 , B24B49/02 , B24B49/04 , B24B49/14
摘要： Among other things, a method of controlling polishing during a polishing process is described. The method includes receiving a measurement of a thickness, thick(t), of a conductive layer of a substrate undergoing polishing from an in-situ monitoring system at a time t; receiving a measured temperature, T(t), associated with the conductive layer at the time t; calculating resistivity pT of the conductive layer at the measured temperature T(t); adjusting the measurement of the thickness using the calculated resistivity pT to generate an adjusted measured thickness; and detecting a polishing endpoint or an adjustment for a polishing parameter based on the adjusted measured thickness.
摘要翻译：其中，描述了在抛光过程中控制抛光的方法。该方法包括在时间t从原位监测系统接收经历抛光的基底的导电层的厚度（t）的测量; 在时间t接收与导电层相关的测量温度T（t）; 在测量温度T（t）下计算导电层的电阻率pT; 使用所计算的电阻率pT调节厚度的测量值以产生调整的测量厚度; 以及基于所调整的测量厚度检测抛光终点或抛光参数的调整。

2. 发明申请

WO2011129959A3 MOLDING WINDOWS IN THIN PADS 审中-公开
标题翻译：薄壁上的模制窗
公开(公告)号：WO2011129959A3
公开(公告)日：2012-04-19
申请号：PCT/US2011029468
申请日：2011-03-22
申请人： APPLIED MATERIALS INC , SWEDEK BOGUSLAW A , BENNETT DOYLE E , BENVEGNU DOMINIC J
发明人： SWEDEK BOGUSLAW A , BENNETT DOYLE E , BENVEGNU DOMINIC J
IPC分类号： H01L21/304 , H01L21/66
CPC分类号： B24B37/205
摘要： A polishing pad includes a polishing layer having a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The solid light-transmitting window has an upper portion with a first lateral dimension and a lower portion with a second lateral dimension that is smaller than the first lateral dimension. A top surface of the solid light-transmitting window coplanar with the polishing surface and a bottom surface of the solid light-transmitting window coplanar with a lower surface of the adhesive layer.
摘要翻译：抛光垫包括具有抛光表面的抛光层，与抛光层相对的抛光层一侧的粘合剂层，以及延伸穿过模制到抛光层的固体透光窗。固体透光窗具有具有第一横向尺寸的上部和具有小于第一横向尺寸的第二横向尺寸的下部。固体透光窗的顶表面与抛光表面共面并且固体透光窗的底表面与粘合剂层的下表面共面。

3. 发明申请

WO2010126901A2 METHOD OF MAKING AND APPARATUS HAVING WINDOWLESS POLISHING PAD AND PROTECTED FIBER 审中-公开
标题翻译：具有无窗抛光垫和保护纤维的制造方法
公开(公告)号：WO2010126901A2
公开(公告)日：2010-11-04
申请号：PCT/US2010032607
申请日：2010-04-27
申请人： APPLIED MATERIALS INC , ZHANG JIMIN , DUBOUST ALAIN , BENNETT DOYLE E
发明人： ZHANG JIMIN , DUBOUST ALAIN , BENNETT DOYLE E
IPC分类号： H01L21/304 , H01L21/66
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A polishing system includes a polishing pad with an aperture that extends through all layers of the polishing pad and a light transmissive film positioned on top of a light-generating or light-guiding element of an optical monitoring system.
摘要翻译：抛光系统包括具有延伸穿过抛光垫的所有层的孔的抛光垫和位于光学监控系统的发光或光导元件顶部的透光膜。

4. 发明申请

WO2010045162A3 EDDY CURRENT GAIN COMPENSATION 审中-公开
标题翻译： EDDY当前增益补偿
公开(公告)号：WO2010045162A3
公开(公告)日：2010-07-15
申请号：PCT/US2009060397
申请日：2009-10-12
申请人： APPLIED MATERIALS INC , BENNETT DOYLE E , OSTERHELD THOMAS H
发明人： BENNETT DOYLE E , OSTERHELD THOMAS H
IPC分类号： H01L21/304
CPC分类号： B24B37/013 , B24B49/105 , G01B7/105
摘要： In-situ monitoring during processing of a substrate includes processing a conductive film on a substrate in a semiconductor processing apparatus and generating a signal from an eddy current sensor during processing. The signal includes a first portion generated when the eddy current sensor is adjacent the substrate, a second portion generated when the eddy current sensor is adjacent a metal body and not adjacent the substrate, and a third portion generated when the eddy current sensor is adjacent neither the metal body nor the substrate. The second portion of the signal is compared to the third portion of the signal and a gain is determined based at least on a result of the comparing, and the first portion of the signal is multiplied by the gain to generate an adjusted signal.
摘要翻译：在处理衬底期间的原位监测包括在半导体处理设备中的衬底上处理导电膜并且在处理期间产生来自涡流传感器的信号。信号包括当涡电流传感器邻近衬底时产生的第一部分，当涡流传感器邻近金属体并且不邻近衬底时产生的第二部分，以及当涡电流传感器不邻近衬底时产生的第三部分金属体也不是基体。将信号的第二部分与信号的第三部分进行比较，并且至少基于比较的结果确定增益，并且将信号的第一部分乘以增益以产生经调整的信号。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式