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1. 发明申请

WO2008013839A2 METHODS AND APPARATUS FOR PURGING A SUBSTRATE DURING INKJET PRINTING 审中-公开
标题翻译：用于在喷墨打印过程中采集基材的方法和装置
公开(公告)号：WO2008013839A2
公开(公告)日：2008-01-31
申请号：PCT/US2007/016700
申请日：2007-07-25
申请人： APPLIED MATERIALS, INC. , SHANG, Quanyuan , SZE, Fan, Cheung , HOOG, Josef , SUN, Lizhong , WHITE, John, M.
发明人： SHANG, Quanyuan , SZE, Fan, Cheung , HOOG, Josef , SUN, Lizhong , WHITE, John, M.
IPC分类号： B41J2/165
CPC分类号： B41J2/16552 , B41J29/17
摘要： The invention provides an inkjet printing apparatus that includes at least one inkjet print head adapted to dispense fluids onto a substrate and at least one delivery aperture adapted to direct a gas toward the substrate. The apparatus may also include at least one recovery aperture adapted to draw materials away from the substrate and evaporate liquids from the surface of the substrate.
摘要翻译：本发明提供了一种喷墨打印设备，其包括适于将流体分配到基底上的至少一个喷墨打印头和适于将气体引向基底的至少一个输送孔。该装置还可以包括至少一个适于将材料从衬底拉出并从衬底的表面蒸发液体的回收孔。

2. 发明申请

WO2005002794A2 METHOD AND APPARATUS FOR ELECTROCHEMICAL MECHANICAL PROCESSING 审中-公开
标题翻译：电化学机械加工方法与装置
公开(公告)号：WO2005002794A2
公开(公告)日：2005-01-13
申请号：PCT/US2004/022722
申请日：2004-07-01
申请人： APPLIED MATERIALS, INC. , WANG, Yan , NEO, Siew, S. , LIU, Feng, Q. , TSAI, Stan D. , HU, Yongqi , DUBOUST, Alain , MANENS, Antoine, P. , WADENSWEILER, Ralph, M. , MAVLIV, Rashid , CHEN, Liang-Yuh , OLGADO, Donald, J.K. , BUTTERFIELD, Paul, D. , TSENG, Ming-Kuei , CHANG, Shou-Sung , SUN, Lizhong
发明人： WANG, Yan , NEO, Siew, S. , LIU, Feng, Q. , TSAI, Stan D. , HU, Yongqi , DUBOUST, Alain , MANENS, Antoine, P. , WADENSWEILER, Ralph, M. , MAVLIV, Rashid , CHEN, Liang-Yuh , OLGADO, Donald, J.K. , BUTTERFIELD, Paul, D. , TSENG, Ming-Kuei , CHANG, Shou-Sung , SUN, Lizhong
IPC分类号： B24B37/04
CPC分类号： B24B37/04 , B23H5/08 , B24B53/017 , C25F7/00
摘要： Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical polishing system. In one embodiment, a cell for polishing a substrate includes a polishing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper polishing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. In another embodiment, a system is provided having a bulk polishing cell and a residual polishing cell. The residual polishing cell includes a biased conductive polishing surface. In further embodiments, the conductive element is protected from attack by process chemistries.
摘要翻译：本发明的实施例通常提供一种用于在电化学机械抛光系统中处理衬底的方法和装置。在一个实施例中，用于抛光衬底的单元包括设置在压板组件的顶表面上的抛光垫。多个导电元件跨过上抛光表面以间隔的关系布置，并且适于相对于设置在垫和压板组件之间的电极偏置衬底。多个通道通过压板组件形成在顶表面和限定在压板组件内的气室之间。在另一个实施例中，提供了具有大量抛光单元和残余抛光单元的系统。残余抛光单元包括偏置的导电抛光表面。在另外的实施方案中，保护导电元件免受过程化学物质的侵蚀。

3. 发明申请

WO2020199193A8 POLISHING FLUID COLLECTION APPARATUS AND SUBSTRATE POLISHING METHODS RELATED THERETO 审中-公开
公开(公告)号：WO2020199193A8
公开(公告)日：2020-10-08
申请号：PCT/CN2019/081499
申请日：2019-04-04
申请人： APPLIED MATERIALS, INC. , LIU, Peng
发明人： SUN, Lizhong , LIU, Peng , HU, Jianjun
IPC分类号： B24B1/00 , B24B57/00 , B24B37/00 , B24B55/12 , B24B57/02
摘要： Embodiments of the present disclosure generally provide apparatus for collecting and reuse polishing fluids and methods related thereto. In particular, the apparatus and methods provided herein feature a polishing fluid collection system used to collect and reuse polishing fluids dispensed during the chemical mechanical polishing (CMP) of a substrate in an electronic device manufacturing process. In one embodiment, a polishing fluid catch basin assembly includes a catch basin sized to surround at least a portion of a polishing platen and to be spaced apart therefrom. The catch basin features an outer wall, an inner wall disposed radially inward of the outer wall, and a base portion connecting the inner wall to the outer wall. The outer wall, the inner wall, and the base portion collectively define a trough. A radially inward facing surface of the inner wall is defined by an arc radius which is greater than a radius of the polishing platen the catch basin is sized to surround.

4. 发明申请

WO2017180971A2 MULTILAYER THIN FILM DEVICE ENCAPSULATION USING SOFT AND PLIABLE LAYER FIRST 审中-公开
标题翻译：多层薄膜器件首先使用柔软和可渗透层进行封装
公开(公告)号：WO2017180971A2
公开(公告)日：2017-10-19
申请号：PCT/US2017/027578
申请日：2017-04-14
申请人： APPLIED MATERIALS, INC.
发明人： KWAK, Byung-Sung , SUN, Lizhong , PARK, Giback , YOUNG, Michael Yu-Tak , FRANKLIN, Jeffrey L. , WANG, Miaojun , ARGYRIS, Dimitrios
CPC分类号： H01M2/0275 , H01M2/0287 , H01M4/131 , H01M4/134 , H01M4/366 , H01M4/382 , H01M4/525 , H01M2010/0495 , H01M2300/0065
摘要： A thin film device may include an active device region, where the active device region comprises a selective expansion region. The thin film device may further include a polymer layer disposed adjacent to the active device region and encapsulating the active device region, the polymer layer comprising a plurality of polymer sub-layers. A first polymer sub-layer of the plurality of polymer sub-layers may have a first hardness, while a second polymer sub-layer of the plurality of polymer sub-layers has a second hardness, the second hardness being different from the first hardness.
摘要翻译：薄膜器件可以包括有源器件区域，其中有源器件区域包括选择性扩展区域。所述薄膜器件可以进一步包括与所述有源器件区域相邻设置并封装所述有源器件区域的聚合物层，所述聚合物层包括多个聚合物子层。多个聚合物子层中的第一聚合物子层可具有第一硬度，而多个聚合物子层中的第二聚合物子层具有第二硬度，第二硬度不同于第一硬度。

5. 发明申请

WO2007041229A2 METHODS AND APPARATUS FOR ADJUSTING PIXEL FILL PROFILES 审中-公开
标题翻译：调整像素填充轮廓的方法和装置
公开(公告)号：WO2007041229A2
公开(公告)日：2007-04-12
申请号：PCT/US2006/037875
申请日：2006-09-28
申请人： APPLIED MATERIALS, INC.
发明人： SUN, Lizhong , SHANG, Quanyuan , WHITE, John, M.
IPC分类号： B41J29/38
CPC分类号： G02F1/133516 , G02F1/1303 , G02F1/133377 , H01L51/0005
摘要： For use in a color filter inkjet printing system that may be part of a flat panel display manufacturing system, methods and apparatus for adjusting a pixel fill profile are provided. The methods include application of , and the apparatus are adapted to apply, pressurized gas to at least one ink-filled pixel well on a substrate having a plurality of pixel wells. Numerous other aspects are provided.
摘要翻译：为了用作可以是平板显示器制造系统的一部分的滤色器喷墨打印系统，提供了用于调整像素填充轮廓的方法和装置。所述方法包括应用，并且该装置适于将压缩气体施加到具有多个像素孔的衬底上的至少一个填充墨水的像素。提供了许多其他方面。

6. 发明申请

WO2003006205A3 BARRIER REMOVAL AT LOW POLISH PRESSURE 审中-公开
公开(公告)号：WO2003006205A3
公开(公告)日：2003-01-23
申请号：PCT/US2002/022126
申请日：2002-07-12
申请人： APPLIED MATERIALS, INC.
发明人： TSAI, Stan, D. , LI, Shijian , LIU, Feng, Q. , SUN, Lizhong , CHEN, Liang-Yuh , MORAD, Ratson
IPC分类号： H01L21/321
摘要： The invention generally provides methods and compositions for planarizing a substrate surface having underlying dielectric materials. Aspects of the invention provide compositions and methods using a combination of low polishing pressures, polishing compositions, various polishing speeds, selective polishing pads, and selective polishing temperatures, for removing barrier materials by a chemical mechanical polishing technique with minimal residues and minimal seam damage. Aspects of the invention are achieved by employing a strategic multi-step process including sequential CMP at low polishing pressure to remove the deposited barrier materials.

7. 发明申请

WO2017180967A3 MULTILAYER THIN FILM DEVICE ENCAPSULATION USING SOFT AND PLIABLE LAYER FIRST 审中-公开
公开(公告)号：WO2017180967A3
公开(公告)日：2017-10-19
申请号：PCT/US2017/027574
申请日：2017-04-14
申请人： APPLIED MATERIALS, INC.
发明人： KWAK, Byung-Sung , SUN, Lizhong , PARK, Giback , YOUNG, Michael Yu-Tak , FRANKLIN, Jeffrey L. , WANG, Miaojun , ARGYRIS, Dimitrios
IPC分类号： H01M2/02 , H01M2/10 , H01M10/04 , H01M10/0585 , H01M4/131 , H01M10/0562
摘要： A thin film device. The thin film device may include:an active device region, the active device region comprising a diffusant; and a thin film encapsulant disposed adjacent to the active device region and encapsulating at least a portion of the active device region, the thin film encapsulant comprising: a first layer, the first layer disposed immediately adjacent the active device region and comprising a soft and pliable material; and a second layer disposed on the first layer, the second layer comprising a rigid dielectric material or rigid metal material.

8. 发明申请

WO2017180959A3 MULTILAYER THIN FILM DEVICE ENCAPSULATION USING SOFT AND PLIABLE LAYER FIRST 审中-公开
公开(公告)号：WO2017180959A3
公开(公告)日：2017-10-19
申请号：PCT/US2017/027561
申请日：2017-04-14
申请人： APPLIED MATERIALS, INC.
发明人： KWAK, Byung-Sung , SUN, Lizhong , PARK, Giback , YOUNG, Michael Yu-Tak , FRANKLIN, Jeffrey L. , WANG, Miaojun
IPC分类号： H01M10/04 , H01M10/0585 , H01M2/02 , H01M2/10 , H01M4/131 , H01M10/0562
摘要： A thin film device. The thin film device may include:an active device region, the active device region comprising a diffusant; and a thin film encapsulant disposed adjacent to the active device region and encapsulating at least a portion of the active device region, the thin film encapsulant comprising: a first layer, the first layer disposed immediately adjacent the active device region and comprising a soft and pliable material; and a second layer disposed on the first layer, the second layer comprising a rigid dielectric material or rigid metal material.

9. 发明申请

WO2013158888A1 PINHOLE-FREE SOLID STATE ELECTROLYTE WITH HIGH IONIC CONDUCTIVITY 审中-公开
标题翻译：具有高离子电导率的无孔固体电解质
公开(公告)号：WO2013158888A1
公开(公告)日：2013-10-24
申请号：PCT/US2013/037184
申请日：2013-04-18
申请人： APPLIED MATERIALS, INC.
发明人： SUN, Lizhong , JIANG, Chong , KWAK, Byung-sung, Leo
IPC分类号： H01M10/0562 , H01M10/05
CPC分类号： H01M10/0562 , G02F1/1508 , H01G11/56 , H01L28/40 , H01M10/0436 , H01M10/052 , H01M10/0585 , H01M2300/0068 , Y02E60/13
摘要： The present invention relates to vacuum-deposited solid state electrolyte layers with high ionic conductivity in electrochemical devices, and methods and tools for fabricating said electrolyte layers. An electrochemical device may comprise solid state electrolytes with incorporated thin layers and/or particles of transition metal oxides, silicon, silicon oxide, or other suitable materials that will induce an increase in ionic conductivity of the electrolyte stack (for example, materials with which lithium is able to intercalate), or mixtures thereof. An improvement in ionic conductivity of the solid state electrolyte is expected which is proportional to the number of incorporated layers or a function of the distribution uniformity and density of the particles within the electrolyte. Embodiments of the present invention are applicable to solid state electrolytes in a broad range of electrochemical devices including thin film batteries, electrochromic devices and ultracapacitors. The solid state electrolyte layers may be nominally pinhole-free.
摘要翻译：本发明涉及电化学装置中具有高离子传导性的真空沉积固态电解质层，以及用于制造所述电解质层的方法和工具。电化学装置可以包括固体电解质，其具有掺入的薄层和/或过渡金属氧化物，硅，氧化硅或其它合适的材料的颗粒，其将引起电解质堆叠的离子导电性的增加（例如，锂能插入），或其混合物。期望固体电解质的离子导电性的改善，其与引入的层的数量成比例，或电解质内的颗粒的分布均匀性和密度的函数。本发明的实施例可应用于包括薄膜电池，电致变色器件和超级电容器在内的宽范围的电化学装置中的固态电解质。固态电解质层可以标称无针孔。

10. 发明申请

WO2004024394A1 CONTROL OF REMOVAL PROFILE IN ELECTROCHEMICALLY ASSISTED CMP 审中-公开
标题翻译：电化学辅助CMP中的去除特性的控制
公开(公告)号：WO2004024394A1
公开(公告)日：2004-03-25
申请号：PCT/US2003/029230
申请日：2003-09-15
申请人： APPLIED MATERIALS, INC.
发明人： SUN, Lizhong , CHEN, Liang-Yuh , NEO, Siew , LIU, Feng, Q. , DUBOUST, Alain , TSAI, Stan, D. , MAVLIEV, Rashid, A.
IPC分类号： B24B37/04
CPC分类号： B24B37/046 , B23H5/06 , B23H5/08 , B24B37/042 , B24B49/16 , H01L21/32125
摘要： Aspects of the invention generally provide a method and apparatus for polishing a substrate using electrochemical deposition techniques. In one aspect, an apparatus for polishing a substrate (104) comprises a counter-electrode (166) and a pad (160) positioned between a substrate (104) and the counter-electrode (166) and a pad (160) positioned between a substrate (104) and the counter-electrode (166). The counter-electrode (166) and/or the pad (160) each comprise a plurality of electrically isolated zones (924, 926, 628, 424, 426, 428). An electrical connector is separately coupled to each of the conductive elements. Separate bias may be applied in each of the electrically isolated zones. A substrate having a material layer may be moved in a relative motion from the counter-electrode (166), the pad (160), or both. Determining the separate biases may comprise determining a time that at least one portion of the material layer is associated with each of the zones of the counter-electrode (166).
摘要翻译：本发明的各方面通常提供使用电化学沉积技术来抛光衬底的方法和装置。一方面，一种用于抛光衬底（104）的设备包括位于衬底（104）和对电极（166）之间的对电极（166）和焊盘（160）以及位于基板（104）和对置电极（166）。对电极（166）和/或焊盘（160）各自包括多个电隔离区域（924,926,628,424,426,428）。电连接器分别耦合到每个导电元件。可以在每个电隔离区域中分别施加偏压。具有材料层的基板可以相对运动地从对电极（166），焊盘（160）或两者移动。确定单独的偏压可以包括确定材料层的至少一部分与对电极（166）的每个区域相关联的时间。

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