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1. 发明申请

WO2011043866A4 ROLLER ASSEMBLY FOR A BRUSH CLEANING DEVICE IN A CLEANING MODULE 审中-公开
公开(公告)号：WO2011043866A4
公开(公告)日：2011-04-14
申请号：PCT/US2010/045709
申请日：2010-08-17
申请人： APPLIED MATERIALS, INC. , KARUPPIAH, Lakshmanan , ZHANG, Dan , YAVELBERG, Simon , ATKINSON, Jim K. , CHEN, Hung Chih , MANTO, Noel , DOMIN, Jonathan
发明人： KARUPPIAH, Lakshmanan , ZHANG, Dan , YAVELBERG, Simon , ATKINSON, Jim K. , CHEN, Hung Chih , MANTO, Noel , DOMIN, Jonathan
IPC分类号： H01L21/302
摘要： Embodiments described herein relate to an apparatus and method for a roller assembly that may be utilized in a brush cleaning module. In one embodiment, a roller assembly is described. The roller assembly includes an annular groove having at least two substantially parallel opposing sidewalls adapted to contact the major surfaces of a substrate along a periphery of the substrate, each of the opposing sidewalls comprising a compressible material having a pre-compressed dimension that is less than a thickness of the periphery of the substrate.

2. 发明申请

WO2010048032A2 PAD CONDITIONER AUTO DISK CHANGE 审中-公开
标题翻译： PAD调节器自动更换磁盘
公开(公告)号：WO2010048032A2
公开(公告)日：2010-04-29
申请号：PCT/US2009/060882
申请日：2009-10-15
申请人： APPLIED MATERIALS, INC. , CHEN, Hung Chih , ZUNIGA, Steven M. , OLGADO, Donald J.K.
发明人： CHEN, Hung Chih , ZUNIGA, Steven M. , OLGADO, Donald J.K.
IPC分类号： H01L21/304
CPC分类号： B24B53/017
摘要： A method and apparatus for replacing a polishing pad conditioning disk is a chemical mechanical polishing system is provided. The apparatus comprises a disk load/unload station for unloading used conditioning disks from a pad conditioning assembly and loading unused conditioning disks onto the pad conditioning assembly, on or more disk storage stations for storing both used and unused conditioning disks, and a central robot having a range of motion sufficient for transferring both used an unused conditioning disks between the disk load/unload station and the one or more disk storage stations. Embodiments described herein reduce the length of system interruption by eliminating the need to safety lock out the system for the replacement of polishing pad conditioning disks.
摘要翻译：用于更换抛光垫调节盘的方法和设备是化学机械抛光系统。该设备包括盘装载/卸载站，用于从盘调节组件卸载使用的调节盘并将未使用的调节盘装载到盘调节组件上，一个或多个盘存储站用于存储已使用和未使用的调节盘两者，以及中央机器人，足以用于在磁盘加载/卸载站与一个或多个磁盘存储站之间传送未使用的调节磁盘的运动范围。这里描述的实施例通过消除安全锁定系统以更换抛光垫修整盘的需要来减少系统中断的长度。

3. 发明申请

WO2012012056A2 SUBSTRATE HOLDER TO REDUCE SUBSTRATE EDGE STRESS DURING CHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：在化学机械抛光期间减少基板边缘应力的基板支架
公开(公告)号：WO2012012056A2
公开(公告)日：2012-01-26
申请号：PCT/US2011/040745
申请日：2011-06-16
申请人： APPLIED MATERIALS, INC. , CHEN, Hung Chih , HSU, Samuel Chu-Chiang , SHASHANK, Gautam , KOOSAU, Denis M.
发明人： CHEN, Hung Chih , HSU, Samuel Chu-Chiang , SHASHANK, Gautam , KOOSAU, Denis M.
IPC分类号： H01L21/304
CPC分类号： B24B37/32
摘要： Embodiments of the present invention generally relate to methods for chemical mechanical polishing a substrate. The methods generally include coupling a first substrate to be polished to a dummy substrate, and removing a portion of the backside of the first substrate to reduce the thickness of the first substrate. The first substrate and the dummy substrate are positioned in a carrier head assembly comprising an inflatable membrane and a support ring. The first substrate is placed in contact with a polishing pad to reduce the surface roughness of the backside of the first substrate. The support ring restricts lateral movement of the inflatable membrane to prevent the first substrate from contacting an interior surface of the carrier head assembly. The support ring is sized to allow vertical movement of the inflatable membrane within the carrier head assembly.
摘要翻译：本发明的实施方案通常涉及用于化学机械抛光衬底的方法。所述方法通常包括将要抛光的第一衬底耦合到虚设衬底，以及去除第一衬底的背面的一部分以减小第一衬底的厚度。第一基板和虚设基板被定位在包括可充气膜和支撑环的载体头组件中。将第一基板放置成与抛光垫接触以减小第一基板的背面的表面粗糙度。支撑环限制可膨胀膜的横向移动，以防止第一基底接触载体头部组件的内表面。支撑环的尺寸设置成允许可充气膜在承载头组件内的垂直运动。

4. 发明申请

WO2010132181A3 POLISHING HEAD ZONE BOUNDARY SMOOTHING 审中-公开
公开(公告)号：WO2010132181A3
公开(公告)日：2010-11-18
申请号：PCT/US2010/031802
申请日：2010-04-20
申请人： APPLIED MATERIALS, INC. , CHEN, Hung Chih , HSU, Samuel Chu-Chiang , DANDAVATE, Gautam , KOOSAU, Denis M.
发明人： CHEN, Hung Chih , HSU, Samuel Chu-Chiang , DANDAVATE, Gautam , KOOSAU, Denis M.
IPC分类号： H01L21/304 , H01L21/683
摘要： A method and apparatus for chemical mechanical polishing of substrates, and more particularly a method and apparatus related to a carrier had for use in chemical mechanical polishing is provided. In one embodiment the carrier head assembly comprises a base assembly for providing support to the substrate, a flexible membrane mounted on the base assembly having a generally circular central portion with a lower surface that provides a substrate mounting surface, and a plurality of independently pressurizable chambers formed between the base assembly and the flexible membrane, comprising an annular outer chamber and a non-circular inner chamber, is provided.

5. 发明申请

WO2010017142A2 CLOSED LOOP CONTROL OF PAD PROFILE BASED ON METROLOGY FEEDBACK 审中-公开
标题翻译：基于计量反馈的扁平轮廓闭环控制
公开(公告)号：WO2010017142A2
公开(公告)日：2010-02-11
申请号：PCT/US2009/052601
申请日：2009-08-03
申请人： APPLIED MATERIALS, INC. , CHANG, Shou-sung , CHEN, Hung Chih , TSAI, Stan, D. , WANG, Yuchun
发明人： CHANG, Shou-sung , CHEN, Hung Chih , TSAI, Stan, D. , WANG, Yuchun
IPC分类号： H01L21/304
CPC分类号： B24B37/042 , B24B49/02 , B24B53/017
摘要： A chemical mechanical polishing apparatus includes a metrology system that detects the thickness of the polishing pad as semiconductor wafers are processed and the thickness of the polishing pad is reduced. The chemical mechanical polishing apparatus includes a controller that adjusts the rate of material removal of a conditioning disk when areas of the polishing surface are detected that are higher or lower than the adjacent areas of the polishing pad.
摘要翻译：化学机械抛光装置包括测量系统，其在处理半导体晶片时检测抛光垫的厚度，并且抛光垫的厚度减小。化学机械抛光装置包括控制器，当检测到比抛光垫的相邻区域更高或更低的区域时，调节调节盘的材料去除速率。

6. 发明申请

WO2008002811A3 PAD CLEANING METHOD 审中-公开
公开(公告)号：WO2008002811A3
公开(公告)日：2008-01-03
申请号：PCT/US2007/071701
申请日：2007-06-20
申请人： APPLIED MATERIALS, INC. , MAVLIEV, Rashid A. , CHEN, Hung Chih
发明人： MAVLIEV, Rashid A. , CHEN, Hung Chih
IPC分类号： B24B53/00
摘要： A method for cleaning a polishing pad is disclosed. In CMP and ECMP, a polishing pad must be conditioned to obtain good and predictable polishing results. During conditioning, debris is generated that must be removed to prevent processing defects. An effective method to clean a polishing pad is disclosed herein. In one embodiment, a washing fluid is directed at the pad to clean debris from the while a second fluid is utilized to remove the washing fluid. In another embodiment, the washing fluid is provided by a high pressure water jet while the second fluid is provided by an air knife.

7. 发明申请

WO2012021215A2 APPARATUS AND METHOD FOR TEMPERATURE CONTROL DURING POLISHING 审中-公开
标题翻译：抛光期间温度控制的装置和方法
公开(公告)号：WO2012021215A2
公开(公告)日：2012-02-16
申请号：PCT/US2011/040630
申请日：2011-06-16
申请人： APPLIED MATERIALS, INC. , CHEN, Hung Chih , HSU, Samuel Chu-Chiang , DANDAVATE, Gautam Shashank , KOOSAU, Denis M.
发明人： CHEN, Hung Chih , HSU, Samuel Chu-Chiang , DANDAVATE, Gautam Shashank , KOOSAU, Denis M.
IPC分类号： H01L21/304
CPC分类号： B24B37/30 , B24B37/015
摘要： Embodiments of the present invention relate to apparatus and method for improve uniformity of a polishing process. Embodiments of the present invention provide a heating mechanism configured to apply thermal energy to a perimeter of a substrate during polishing, or a cooling mechanism configured to cool a central region of the substrate during polishing, or a biased heating mechanism configured to create a temperature step differential on a given radius of a polishing pad.
摘要翻译：本发明的实施例涉及用于提高抛光工艺的均匀性的装置和方法。本发明的实施例提供了一种加热机构，其被配置为在抛光期间将热能施加到基板的周边，或者构造成在抛光期间冷却基板的中心区域的冷却机构，或者构造成产生温度步长的偏置加热机构抛光垫的给定半径上的微分。

8. 发明申请

WO2012019144A2 SUBSTRATE EDGE TUNING WITH RETAINING RING 审中-公开
标题翻译：基板边缘调整与保持环
公开(公告)号：WO2012019144A2
公开(公告)日：2012-02-09
申请号：PCT/US2011/046828
申请日：2011-08-05
申请人： APPLIED MATERIALS, INC. , CHEN, Hung Chih , HSU, Samuel Chu-Chiang , YUAN, Yin , ZHANG, Huanbo , DANDAVATE, Gautam Shashank , SILVETTI, Mario David
发明人： CHEN, Hung Chih , HSU, Samuel Chu-Chiang , YUAN, Yin , ZHANG, Huanbo , DANDAVATE, Gautam Shashank , SILVETTI, Mario David
IPC分类号： H01L21/304
CPC分类号： B24B41/06 , B24B37/32 , B24B41/067
摘要： A carrier head for a chemical mechanical polisher includes base, a substrate mounting surface, an annular inner ring, and an annular outer ring. The inner ring has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. The inner ring is vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad. The outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring. The lower surface of the inner ring has a first width, and the lower surface of the outer ring has a second width greater than the first width.
摘要翻译：用于化学机械抛光机的载体头包括基底，基底安装表面，环形内环和环形外环。所述内圈具有内表面，所述内表面被构造为围绕位于所述基板安装表面上的基板的边缘，外表面和与所述抛光垫接触的下表面。内环可相对于基板安装表面垂直移动。外环具有周向包围内环的内表面，外表面和与抛光垫接触的下表面。外环可以相对于衬底安装表面和内环独立地上下移动。内圈的下表面具有第一宽度，并且外环的下表面具有大于第一宽度的第二宽度。

9. 发明申请

WO2010044953A1 POLISHING PAD EDGE EXTENSION 审中-公开
标题翻译：抛光垫边缘延伸
公开(公告)号：WO2010044953A1
公开(公告)日：2010-04-22
申请号：PCT/US2009/054527
申请日：2009-08-20
申请人： APPLIED MATERIALS, INC. , CHEN, Hung Chih , CHANG, Shou-Sung , TSAI, Stan, D.
发明人： CHEN, Hung Chih , CHANG, Shou-Sung , TSAI, Stan, D.
IPC分类号： H01L21/304
CPC分类号： B24B37/20 , B24B37/34
摘要： A method and apparatus for conditioning a polishing pad is provided. The apparatus includes a polishing pad coupled to an upper surface of a platen, the polishing pad having a polishing surface, a support member coupled to a base of the platen adjacent a peripheral edge of the polishing pad, and a bearing material coupled to an upper surface of the support member, the bearing material having an upper surface that is coplanar with the polishing surface of the polishing pad. The method includes urging a conditioning disk against a polishing surface of a polishing pad, moving the conditioning disk across the polishing surface in a sweep pattern that includes at least a portion of the conditioning disk extending over a peripheral edge of the polishing surface, and maintaining a substantially uniform pressure to the polishing surface from the conditioning disk across the sweep pattern.
摘要翻译：提供了一种用于调理抛光垫的方法和装置。该装置包括耦合到压板的上表面的抛光垫，抛光垫具有抛光表面，耦合到压板的与抛光垫的周缘相邻的基座的支撑构件，以及联接到上部的轴承材料支撑构件的表面，轴承材料具有与抛光垫的抛光表面共面的上表面。所述方法包括将调节盘推向抛光垫的抛光表面，以调整图案的方式移动调节盘，该扫掠图案包括在抛光表面的周缘延伸的至少一部分调理盘，并且保持在整个扫描图案上从调节盘向抛光表面施加基本均匀的压力。

10. 发明申请

WO2008002811A2 PAD CLEANING METHOD 审中-公开
标题翻译：垫清洗方法
公开(公告)号：WO2008002811A2
公开(公告)日：2008-01-03
申请号：PCT/US2007/071701
申请日：2007-06-20
申请人： APPLIED MATERIALS, INC. , MAVLIEV, Rashid A. , CHEN, Hung Chih
发明人： MAVLIEV, Rashid A. , CHEN, Hung Chih
IPC分类号： B24B1/00
CPC分类号： B24B53/017
摘要： A method for cleaning a polishing pad is disclosed. In CMP and ECMP, a polishing pad must be conditioned to obtain good and predictable polishing results. During conditioning, debris is generated that must be removed to prevent processing defects. An effective method to clean a polishing pad is disclosed herein. In one embodiment, a washing fluid is directed at the pad to clean debris from the while a second fluid is utilized to remove the washing fluid. In another embodiment, the washing fluid is provided by a high pressure water jet while the second fluid is provided by an air knife.
摘要翻译：公开了一种清洁抛光垫的方法。在CMP和ECMP中，必须对抛光垫进行调节以获得良好且可预测的抛光结果。在调节过程中，产生的碎片必须移除以防止加工缺陷。本文公开了一种清洁抛光垫的有效方法。在一个实施例中，清洗流体被引导至垫上以便在利用第二流体去除清洗流体的同时清除碎屑。在另一个实施例中，洗涤流体由高压水射流提供，而第二流体由气刀提供。

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