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    • 6. 发明申请
    • CORNER SPOILER FOR IMPROVING PROFILE UNIFORMITY
    • 用于改善轮廓均匀性的角撑板
    • WO2015116433A1
    • 2015-08-06
    • PCT/US2015/012014
    • 2015-01-20
    • APPLIED MATERIALS, INC.
    • ZHAO, LaiFURUTA, GakuWANG, QunhuaTINER, Robin L.PARK, Beom SooCHOI, Soo YoungYADAV, Sanjay D.
    • G02F1/13
    • C23C16/45591C23C16/45559C23C16/45563C23C16/4585H01J37/32091H01J37/32623H01J37/32651
    • The present disclosure relates to a corner spoiler designed to decrease high deposition rates on corner regions of substrates by changing the gas flow. In one embodiment, a corner spoiler for a processing chamber includes an L-shaped body fabricated from a dielectric material, wherein the L-shaped body is configured to change plasma distribution at a corner of a substrate in the processing chamber. The L-shaped body includes a first and second leg, wherein the first and second legs meet at an inside corner of the L-shaped body. The length of the first or second leg is twice the distance defined between the first or second leg and the inside corner. In another embodiment, a shadow frame for a depositing chamber includes a rectangular shaped body having a rectangular opening therethrough, and one or more corner spoilers coupled to the rectangular shaped body at corners of the rectangular shaped body.
    • 本发明涉及一种设计用于通过改变气体流量来降低基板拐角区域的高沉积速率的拐角扰流板。 在一个实施例中,用于处理室的拐角扰流板包括由介电材料制成的L形主体,其中L形主体被配置为改变处理室中的基板角落处的等离子体分布。 L形本体包括第一和第二腿,其中第一和第二腿在L形体的内角处相交。 第一腿或第二腿的长度是在第一腿或第二腿与内角之间限定的距离的两倍。 在另一个实施例中,用于沉积室的阴影框架包括具有矩形开口的矩形体,以及在矩形体的角落处联接到矩形体的一个或多个拐角扰流板。
    • 10. 发明申请
    • MULTI-LAYER AMORPHOUS SILICON STRUCTURE WITH IMPROVED POLY-SILICON QUALITY AFTER EXCIMER LASER ANNEAL
    • 多层非晶硅结构,具有改进的聚硅氧烷质量后激光雷达
    • WO2014182433A1
    • 2014-11-13
    • PCT/US2014/034938
    • 2014-04-22
    • APPLIED MATERIALS, INC.
    • WANG, QunhuaZHAO, LaiCHOI, Soo, Young
    • C23C16/44H01L21/205
    • H01L21/0262C23C16/24C23C16/4405C23C16/56H01L21/02488H01L21/02532H01L21/02592H01L21/02675
    • The embodiments described herein generally relate to methods for forming a multi-layer amorphous silicon structure that may be used in thin film transistor devices. In one embodiment, a method includes positioning a substrate comprising a buffer layer in a process chamber, the process chamber comprising a processing region, forming a plurality of amorphous silicon layers and annealing the amorphous silicon layers to form a polycrystalline silicon layer. Forming the plurality of layers includes delivering a silicon-containing precursor and a first activation gas to the processing region to deposit a first amorphous silicon layer over the buffer layer, the silicon-containing precursor and the first activation gas being activated by a plasma and maintaining a continuous flow of the silicon-containing precursor while delivering a second activation gas, without the first activation gas, to the processing region to deposit a second silicon layer on the first silicon layer.
    • 本文描述的实施例通常涉及用于形成可用于薄膜晶体管器件的多层非晶硅结构的方法。 在一个实施例中,一种方法包括将包括缓冲层的衬底定位在处理室中,所述处理室包括处理区域,形成多个非晶硅层并退火非晶硅层以形成多晶硅层。 形成多个层包括将含硅前体和第一活化气体输送到处理区域以在缓冲层上沉积第一非晶硅层,含硅前体和第一活化气体被等离子体激活并维持 连续流动的含硅前体,同时将没有第一活化气体的第二活化气体输送到处理区域,以在第一硅层上沉积第二硅层。