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    • 3. 发明申请
    • ANALOG-TO-DIGITAL CONVERTER
    • 模拟数字转换器
    • WO2012141656A1
    • 2012-10-18
    • PCT/SG2012/000128
    • 2012-04-11
    • AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCHTIEW, Kei TeeCHAN, Kok LimJE, MinkyuYUAN, Xiaojun
    • TIEW, Kei TeeCHAN, Kok LimJE, MinkyuYUAN, Xiaojun
    • H03M3/00H04L27/00
    • H03M1/002H03M3/30H03M3/422H03M3/444
    • According to embodiments of the present invention, an analog-to-digital converter is provided. The analog-to-digital converter includes an input configured to receive an input signal, a feed-forward path connected to the input configured to feed forward the input signal, a processing path including a loop filter, wherein the loop filter includes at least one local feedback path configured to feed back an output signal of the loop filter to an input of the loop filter, a first combiner configured to combine the input signal fed forward by the feed-forward path with an output of the processing path, a quantizer configured to generate an output signal of the converter, a feed-back path configured to feed back the output signal, and a second combiner wherein the processing path is connected to the second combiner and the second combiner is configured to combine the input signal with the fed back output signal of the converter and supply the result of the combination to the processing path.
    • 根据本发明的实施例,提供了一种模拟 - 数字转换器。 模数转换器包括被配置为接收输入信号的输入端,连接到被配置为向前馈送输入信号的输入端的前馈路径,包括环路滤波器的处理路径,其中环路滤波器包括至少一个 局部反馈路径,被配置为将环路滤波器的输出信号反馈到环路滤波器的输入;第一组合器,被配置为将由前馈路径馈送的输入信号与处理路径的输出组合;量化器配置 以产生转换器的输出信号,被配置为反馈输出信号的反馈路径和第二组合器,其中处理路径连接到第二组合器,并且第二组合器被配置为将输入信号与馈送 转换器的反向输出信号,并将组合的结果提供给处理路径。
    • 6. 发明申请
    • METHOD TO REDUCE TRENCH CAPACITOR LEAKAGE FOR RANDOM ACCESS MEMORY DEVICE
    • 降低用于随机访问存储器件的TRENCH电容器泄漏的方法
    • WO2009058142A1
    • 2009-05-07
    • PCT/US2007/083176
    • 2007-10-31
    • AGERE SYSTEMS, INC.ROSSI, Nace, M.SINGH, RanbirYUAN, Xiaojun
    • ROSSI, Nace, M.SINGH, RanbirYUAN, Xiaojun
    • H01L21/8242H01L27/108H01L21/762
    • H01L27/1087H01L21/76224H01L27/10829H01L27/10861
    • The invention, in one aspect, provides a method of manufacturing a semiconductor device. This method includes forming a trench isolation structure (118) in a dynamic random memory region (DRAM) (110) of a semiconductor substrate (109) and patterning an etch mask over the trench isolation structure (118) to expose a portion of the trench isolation structure (118). A portion of the exposed trench isolation structure (118) is removed to form a gate trench (116) therein, wherein the gate trench (116) includes a first corner formed by the semiconductor substrate and a second corner formed by the trench isolation structure. The etch mask is removed from the DRAM region (110) and the at least the first corner of the gate trench is rounded to form a rounded corner (120). This is followed by the formation of an oxide layer (124) over a sidewall of the gate trench (116), the first rounded corner (120), and the semiconductor substrate (109) adjacent the gate trench (116). The trench (116) is filled with a gate material.
    • 本发明在一个方面提供一种制造半导体器件的方法。 该方法包括在半导体衬底(109)的动态随机存储器区域(DRAM)(110)中形成沟槽隔离结构(118),并且在沟槽隔离结构(118)上图形化蚀刻掩模以暴露沟槽的一部分 隔离结构(118)。 去除暴露的沟槽隔离结构(118)的一部分以在其中形成栅极沟槽(116),其中栅极沟槽(116)包括由半导体衬底形成的第一角和由沟槽隔离结构形成的第二角。 从DRAM区域(110)去除蚀刻掩模,并且栅极沟槽的至少第一角被倒圆以形成圆角(120)。 随后在栅极沟槽(116),第一圆角(120)和与栅极沟槽(116)相邻的半导体衬底(109)的侧壁上形成氧化物层(124)。 沟槽(116)填充有栅极材料。