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1. 发明申请

WO2006088427A1 MICROFLUIDICS PACKAGE AND METHOD OF FABRICATING THE SAME 审中-公开
标题翻译：微流控封装及其制造方法
公开(公告)号：WO2006088427A1
公开(公告)日：2006-08-24
申请号：PCT/SG2005/000038
申请日：2005-02-15
申请人： AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH , NATIONAL UNIVERSITY OF SINGAPORE , CHONG, Ser, Choong , XIE, Ling , JI, Hongmiao , LI, Jing , CHEN, Yu , YOBAS, Levent
发明人： CHONG, Ser, Choong , XIE, Ling , JI, Hongmiao , LI, Jing , CHEN, Yu , YOBAS, Levent
IPC分类号： B81B1/00 , B01L3/00
CPC分类号： B81B7/0061 , B01F5/0603 , B01F13/0059 , B01L3/502707 , B01L3/502715 , B01L9/527 , B01L2200/028 , B01L2200/12 , B01L2300/0816 , B01L2300/0887 , B81B2201/051 , B81B2201/058
摘要： A microfluidics package (1) comprising a substrate (6) having a top surface, said top surface comprises at least one fluid channel (11, 12), at least one fluidic chip (2) having a top surface, a bottom surface, at least one side surface, and at least one passage to allow a fluid to traverse from the top surface or any side surface to the bottom surface of the chip; and a sheet (4) of which both sides are adhesive, wherein the first adhesive side of the sheet (4) is secured to the substrate (6), and the at least one fluidic chip (2) is secured by the second adhesive side of the sheet (4), said fluidic chip (2) being arranged such that the at least one passage of the fluidic chip is in fluid communication with the at least one fluid channel (11, 12) of the substrate.
摘要翻译：一种微流体封装（1），包括具有顶表面的衬底（6），所述顶表面包括至少一个流体通道（11,12），至少一个流体芯片（2），其具有顶表面，底表面至少一个侧表面和至少一个通道，以允许流体从所述芯片的顶表面或任何侧表面穿过所述底表面; 和其中两侧是粘合剂的片材（4），其中片材（4）的第一粘合剂侧固定到基底（6）上，并且至少一个流体碎片（2）由第二粘合剂侧所述流体芯片（2）布置成使得流体芯片的至少一个通道与基板的至少一个流体通道（11,12）流体连通。

2. 发明申请

WO2009045170A1 SILICON MICROPHONE WITH ENHANCED IMPACT PROOF STRUCTURE USING BONDING WIRES 审中-公开
标题翻译：硅胶麦克风使用连接线增强防撞结构
公开(公告)号：WO2009045170A1
公开(公告)日：2009-04-09
申请号：PCT/SG2008/000369
申请日：2008-09-29
申请人： SILICON MATRIX PTE. LTD. , WANG, Zhe , CHONG, Ser, Choong
发明人： WANG, Zhe , CHONG, Ser, Choong
IPC分类号： H04R17/02 , H04R19/00
CPC分类号： H04R19/04
摘要： A backplateless silicon microphone and a wire protection method for improved impact resistance are disclosed. A circular diaphragm (11) is surrounded by a circular spring (12) having a plurality of slots and perforations to facilitate air damping reduction, release of in- plane stress, and improve out-plane flexibility. Anchored at a substrate (8), the circular spring (12) holds the silicon microphone suspended over a backside hole in the substrate (8) but allows the diaphragm (11 ) to vibrate perpendicular to the substrate. A microphone variable capacitor is formed between the perforated spring and substrate. Slot size is minimized to prevent particles from entering an underlying air gap. A plurality of "n" bonding pads (16a, 16b) near the outer edge of the circular spring (12) are connected by "n/2" bonding wires that serve as a stopper to restrict an upward motion of the diaphragm. The bonding wires may cross each other to enable lower loop height for more effective resistance to impact.
摘要翻译：公开了一种无刷硅传声器和用于提高耐冲击性的线保护方法。圆形隔膜（11）由具有多个槽和穿孔的圆形弹簧（12）围绕，以便于减少空气阻尼，释放面内应力，并提高平面外的柔性。固定在基板（8）上的圆形弹簧（12）将硅麦克风保持在基板（8）的背面孔上，但允许隔膜（11）垂直于基板振动。在多孔弹簧和基板之间形成麦克风可变电容器。槽口尺寸被最小化以防止颗粒进入下面的气隙。在圆形弹簧（12）的外边缘附近的多个“n”个接合焊盘（16a，16b）通过用作限制器的“n / 2”接合线连接，以限制隔膜的向上运动。接合线可以彼此交叉以实现较低的回路高度，以更有效地抵抗冲击。

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